CN110977361A - Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof - Google Patents
Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof Download PDFInfo
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- CN110977361A CN110977361A CN201911369191.8A CN201911369191A CN110977361A CN 110977361 A CN110977361 A CN 110977361A CN 201911369191 A CN201911369191 A CN 201911369191A CN 110977361 A CN110977361 A CN 110977361A
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- cover plate
- nickel
- alloy cover
- protective layer
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 78
- 239000000956 alloy Substances 0.000 title claims abstract description 78
- 238000003466 welding Methods 0.000 title claims abstract description 51
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 164
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 82
- 239000011241 protective layer Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 15
- 230000007797 corrosion Effects 0.000 claims abstract description 11
- 238000005260 corrosion Methods 0.000 claims abstract description 11
- 238000003754 machining Methods 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 33
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 229910001096 P alloy Inorganic materials 0.000 claims description 6
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000002161 passivation Methods 0.000 claims 2
- 238000007750 plasma spraying Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 239000007921 spray Substances 0.000 description 11
- 150000003839 salts Chemical class 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical group [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof, belonging to the technical field of integrated circuit manufacturing. The preparation method of the parallel seam welding alloy cover plate for packaging the integrated circuit comprises the following steps: spraying four side surfaces of the alloy cover plate column by using a plasma spraying process to form a first nickel protective layer; cutting the alloy cover plate column into single alloy cover plates along the transverse direction; deburring the alloy cover plate; forming a T-shaped alloy cover plate body by machining or chemical corrosion; and plating nickel on the outer surface of the alloy cover plate body to form a second nickel protective layer. The invention discloses a parallel seam welding alloy cover plate for packaging an integrated circuit and a preparation method thereof.
Description
Technical Field
The invention relates to the technical field of integrated circuit manufacturing, in particular to a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof.
Background
Parallel seam welding is an important cover plate sealing technology for high-reliability integrated circuit airtight packaging, and the technology utilizes the principle of resistance welding to melt a plating layer on the reverse side of a cover plate by heat generated by a roller electrode; the welding points are formed one by one in succession along with the rolling of the electrode wheel on the cover plate to form a fish scale-shaped lap joint welding line, so that the welding between the cover plate and the sealing ring of the ceramic or metal shell is realized. The welding belongs to local welding, and the welding current generates enough heat when passing through the contact part of the electrode and the cover plate and the contact part of the cover plate and the sealing ring, so that the coating at the two contact parts is melted. The heat of the seam welding process is concentrated on the local part of the sealing area, and the chip in the device is not subjected to high temperature. The parallel seam welding has the characteristics that high temperature is locally generated, the temperature of the chip in the shell is low, and thermal shock is not generated to the chip. The common parallel seam welding alloy cover plate adopts nickel as a surface coating, and generally adopts a chemical nickel plating process with a lower melting point in order to avoid the influence of overhigh temperature in the welding process on a circuit chip and a device in a packaging shell. In the process, the weight ratio of phosphorus doped in the chemical nickel plating solution is generally between 8 and 12 percent, and the melting point of a plating layer is 880 ℃. In parallel seam welding, when the temperature of the contact part of the cover plate and the sealing ring is higher than the melting point of the electroless nickel plating by controlling the welding current, the sealing welding between the cover plate and the sealing ring can be realized.
The conventional parallel seam welding alloy cover plate adopts the integral chemical nickel plating process to form the surface nickel plating layer with the thickness of only a few microns, so that the exposure of iron elements in a base body at the bottom of a plating layer is difficult to avoid in the parallel seam welding process, the problem of corrosion failure in a salt spray test occurs sometimes, and hidden troubles are brought to the reliability in circuit application.
Because the base material of the parallel seam welding alloy cover plate is ferrous alloy, once the iron element is exposed, the corrosion resistance of the cover plate is degraded, which is also the root cause of the corrosion of the packaged product adopting the parallel seam welding sealing process in the salt spray test.
Disclosure of Invention
The invention aims to provide a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof, and aims to solve the problems that the conventional parallel seam welding alloy cover plate adopts an integral chemical nickel plating process, the thickness of a formed nickel plating layer on the surface is only a few micrometers, so that the corrosion failure problem in a salt spray test is caused by the fact that iron elements in a base body at the bottom of the plating layer are difficult to avoid being exposed in the parallel seam welding process, and the hidden danger is caused to the reliability in circuit application.
In order to solve the technical problem, the invention provides a method for preparing a parallel seam welding alloy cover plate for integrated circuit packaging, which comprises the following steps:
machining to obtain an alloy cover plate column;
spraying four side surfaces of the alloy cover plate column to form a first nickel protective layer;
cutting the alloy cover plate column with the first nickel protective layer into single alloy cover plates along the transverse direction;
deburring the cut alloy cover plate;
forming a T-shaped alloy cover plate body by machining or chemical corrosion;
plating nickel on the outer surface of the T-shaped alloy cover plate body to form a second nickel protective layer;
and cleaning and drying to finish the manufacture of the parallel seam welding alloy cover plate.
The invention also provides a parallel seam welding alloy cover plate for packaging the integrated circuit, which comprises a T-shaped alloy cover plate body, wherein the alloy cover plate body comprises a connecting part and a pressure-bearing part, the peripheral side walls of the connecting part are respectively provided with a first nickel protective layer, and the first nickel protective layer and the alloy cover plate body are wrapped by a second nickel protective layer.
Optionally, the thickness of the first nickel protective layer is 200 μm to 400 μm.
Optionally, the first nickel protective layer is high-purity nickel, and the melting point is 1455 ℃.
Optionally, the second nickel protection layer is a nickel layer, or a nickel layer plus a gold layer.
Optionally, the thickness of the nickel layer in the second nickel protective layer is 2 μm to 8.89 μm; when the second nickel protective layer is a nickel layer and a gold layer, the thickness of the gold layer is 0.01-6 μm.
Optionally, the nickel in the second nickel protective layer is a nickel-phosphorus alloy, and the melting point is 880 ℃.
Optionally, the weight ratio of phosphorus in the second nickel protective layer nickel-phosphorus alloy is 8-12%.
The parallel seam welding alloy cover plate for packaging the integrated circuit and the preparation method thereof provided by the invention have the following beneficial effects:
(1) the four sides of the alloy cover plate column are sprayed to form first nickel protective layers, a single alloy cover plate is formed after cutting, a plurality of single alloy cover plates with the first nickel protective layers on the sides can be obtained quickly, the thickness of the obtained first nickel protective layers can effectively prevent exposure of iron elements in matrix kovar alloy in the open sealing process, and the salt spray corrosion resistance of the cover plate is enhanced;
(2) compared with the existing parallel seam welding nickel-plated cover plate, the parallel seam welding alloy cover plate provided by the invention has better salt spray corrosion resistance, and can meet the more harsh salt spray environment application requirements of integrated circuit products and the high reliability requirement of packaging devices by adopting a parallel seam welding sealing process.
Drawings
FIG. 1 is a schematic structural view of a machined alloy decking column;
FIG. 2 is a schematic structural diagram of an alloy cover plate post after four sides are sprayed with a first nickel protective layer;
FIG. 3 is a schematic structural view of a single alloy cover plate;
FIG. 4 is a cross-sectional view of a T-shaped alloy cover plate body;
FIG. 5 is a cross-sectional view of the outer surface of the alloy cover plate body after a second nickel protective layer is formed;
FIG. 6 is an elevation view of a parallel seam welded alloy cover plate;
FIG. 7 is a top view of a parallel seam welded alloy cover plate.
Detailed Description
The invention provides a parallel seam welding alloy cover plate for integrated circuit package, which is described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The invention provides a method for preparing a parallel seam welding alloy cover plate for packaging an integrated circuit, which comprises the following steps: firstly, machining to obtain an alloy cover plate column as shown in figure 1; secondly, spraying and forming a first nickel protective layer on four side surfaces of the alloy cover plate column, as shown in fig. 2; next, cutting the alloy cover plate column with the first nickel protective layer into single alloy cover plates along the transverse direction, as shown in fig. 3; deburring the cut alloy cover plate; then, machining or chemical etching is adopted to form a T-shaped alloy cover plate body, as shown in FIG. 4; finally, plating nickel on the outer surface of the T-shaped alloy cover plate body to form a second nickel protection layer, as shown in FIG. 5; and cleaning and drying to finish the manufacture of the parallel seam welding alloy cover plate. The means used in forming the first nickel protective layer is to use a plasma spray process, and the means used in forming the second nickel protective layer is to use an electroplating or electroless plating technique. The first nickel protective layers are formed by spraying on the four side faces of the alloy cover plate column, and a single alloy cover plate is formed after cutting, so that a plurality of single alloy cover plates with the first nickel protective layers on the side faces can be quickly obtained, the thickness of the obtained first nickel protective layers can effectively prevent the exposure of iron elements in matrix kovar alloy in the open sealing process, and the salt spray corrosion resistance of the cover plate is enhanced; (this method is as if glue was applied to the side of a sheet of paper, and glue was applied to the side of a book, it is obviously easier to apply on the side of a book, and glue with a certain thickness can be more easily obtained). Compared with the existing parallel seam welding nickel-plated cover plate, the invention can obtain the same sealing effect without increasing welding current.
The invention also provides a parallel seam welding alloy cover plate for packaging an integrated circuit, and the structure of the cover plate is shown in figures 5-7. Including the alloy apron body 3 of T shape, alloy apron body 3 includes connecting portion 30 and pressure-bearing part 31 for cooperate with the step hole on the metal package shell, the lateral wall all is formed with first nickel protective layer 1 around connecting portion 30, first nickel protective layer 1 with the outer parcel of alloy apron body 3 has second nickel protective layer 2.
Specifically, the thickness of the first nickel protective layer 1 is 200 μm to 400 μm. The first nickel protective layer 1 is high-purity nickel, and the melting point is 1455 ℃.
The second nickel protective layer 2 is a nickel layer or a nickel layer plus a gold layer. The thickness of the nickel layer in the second nickel protective layer 2 is 2-8.89 μm; when the second nickel protective layer 2 is a nickel layer plus a gold layer, the thickness of the gold layer is 0.01-6 μm.
The nickel in the second nickel protective layer 2 is nickel-phosphorus alloy, and the melting point is 880 ℃. The weight ratio of phosphorus in the nickel-phosphorus alloy of the second nickel protective layer 2 is 8-12%.
Because the damage of the parallel seam welding process to the welding edge is inevitable, the damage size can only be controlled through process improvement, and the problem of the damage of the welding edge cannot be solved fundamentally. According to the parallel seam welding alloy cover plate for integrated circuit packaging and the preparation method thereof, a reliable coating structure can be obtained on the side face of the alloy cover plate body, the thickness of the obtained first nickel protection layer can effectively prevent the exposure of iron elements in matrix corvar alloy in the flat sealing process, the salt spray corrosion resistance is improved, the requirement of high-reliability ceramic packaging on a salt spray test can be met, and the requirements of integrated circuit products on more harsh salt spray environment application and the high reliability of devices packaged by adopting a parallel seam welding sealing process can be met; compared with the existing parallel seam welding nickel-plated cover plate, the invention can obtain the same sealing effect without increasing welding current.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (8)
1. A method for preparing a parallel seam welding alloy cover plate for integrated circuit packaging is characterized by comprising the following steps:
machining to obtain an alloy cover plate column;
spraying four side surfaces of the alloy cover plate column to form a first nickel protective layer;
cutting the alloy cover plate column with the first nickel protective layer into single alloy cover plates along the transverse direction;
deburring the cut alloy cover plate;
forming a T-shaped alloy cover plate body by machining or chemical corrosion;
plating nickel on the outer surface of the T-shaped alloy cover plate body to form a second nickel protective layer;
and cleaning and drying to finish the manufacture of the parallel seam welding alloy cover plate.
2. The parallel seam welding alloy cover plate for packaging the integrated circuit is characterized by comprising a T-shaped alloy cover plate body (3), wherein the alloy cover plate body (3) comprises a connecting part (30) and a pressure-bearing part (31), the peripheral side wall of the connecting part (30) is provided with a first nickel protective layer (1), and the outer of the first nickel protective layer (1) and the alloy cover plate body (3) is wrapped with a second nickel protective layer (2).
3. The cover plate of claim 2, wherein the first nickel protective layer (1) has a thickness of 200 μm to 400 μm.
4. The cover plate of claim 2, wherein said first nickel protective layer (1) is high purity nickel having a melting point of 1455 ℃.
5. The cover plate of claim 2, wherein the second nickel passivation layer (2) is a nickel layer or a nickel layer plus a gold layer.
6. The cover plate of claim 5, wherein the thickness of the nickel layer in the second nickel protective layer (2) is 2 μm to 8.89 μm; when the second nickel protective layer (2) is a nickel layer plus a gold layer, the thickness of the gold layer is 0.01-6 μm.
7. The cover plate of claim 5, wherein the nickel in the second nickel passivation layer (2) is a nickel-phosphorus alloy with a melting point of 880 ℃.
8. The cover plate of claim 7, wherein the weight ratio of phosphorus in the nickel-phosphorus alloy of the second nickel protection layer (2) is 8-12%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911369191.8A CN110977361B (en) | 2019-12-26 | 2019-12-26 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911369191.8A CN110977361B (en) | 2019-12-26 | 2019-12-26 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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| CN110977361A true CN110977361A (en) | 2020-04-10 |
| CN110977361B CN110977361B (en) | 2024-05-03 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111497378A (en) * | 2020-04-20 | 2020-08-07 | 宁波瑞凌新能源科技有限公司 | Radiation refrigeration metal plate, preparation method and application thereof |
| CN113707618A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | Salt-spray-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
| US11833780B2 (en) | 2020-04-20 | 2023-12-05 | Ningbo Radi-Cool Advanced Energy Technologies Co., Ltd. | Radiative cooling metal plate, preparation method and application thereof |
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| CN110977361B (en) | 2024-05-03 |
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