CN101343760A - Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology - Google Patents
Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology Download PDFInfo
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- CN101343760A CN101343760A CNA2008101309426A CN200810130942A CN101343760A CN 101343760 A CN101343760 A CN 101343760A CN A2008101309426 A CNA2008101309426 A CN A2008101309426A CN 200810130942 A CN200810130942 A CN 200810130942A CN 101343760 A CN101343760 A CN 101343760A
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- cover plate
- metal cover
- plating
- alloy production
- phosphorus alloy
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Abstract
The invention relates to a microelectronic packaging metal cover plate galvanizing nickel phosphorus alloy production process, which is applied in the production of a metal cover plate required for microelectronic element packaging. The microelectronic packaging metal cover plate galvanizing nickel phosphorus alloy production technique comprises the procedures of cover plate punching, chemical oil removing, acid pickling, nickel phosphorus alloy electrolysis plating and inspection, when necessary, the hydrogen removing sequence after the plating is also included, and the microelectronic packaging metal cover plate galvanizing nickel phosphorus alloy production process is characterized in that firstly, a metal sheet material with the thickness of 0.1 to 0.3 mm is adopted as a billet material during punching and molding; secondly, an electroplating solution adopts 150 to 300 g/L of NiSO4*7H2O, 40 to 80 g/L of NiCl2*6H2O, 30 to 60 g/L of H3PO4, and 40 to 60 g/L of H3BO3, the temperature is between 65 and 95 DEG C, the pH value is between 0.5 to 2.6, and the cathode current density ranges from 0.5 to 5A/dm<2>. The invention has the advantages that the electroplating solution can be used steadily for a long term, and the nickel consumption cost is low.
Description
Technical field
The present invention relates to a kind of microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology, be applied to produce the required metal cover boards of microelectronic element encapsulation such as unicircuit.
Background technology
Along with the high speed development of electronic communication industry, domestic demand to microelectron packaging metal cover plate constantly increases, and people wish to develop the production technique that bath stability is good, the life-span is long, sedimentation velocity is fast.The bath stability of existing chemical plating technology is poor, sedimentation velocity is slow, bath life is short, production cost is high.
Summary of the invention
Technical problem to be solved by this invention provides a kind of microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology, and its (1) bath stability is good, and bath life is long, and production cost is low.(2) coating deposition rate is fast, high efficiency.(3) can stablize the acquisition high phosphorus and reach 10～11% high ni-resist phosphorus alloy.(4) metal cover board that makes of this technology soldering and sealing reliability height in microelectronics production is used, the soldering and sealing fusing point is low, can effectively improve the job stability that microelectronics Packaging is produced product.
Purpose of the present invention can be achieved like this, a kind of microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology, comprise punching out cover plate, electrochemical deoiling, pickling, electrolytic ni plating phosphorus alloy, inspection process, also comprise in case of necessity and move back the hydrogen treatment process after the plating, it is characterized in that (a) sheet metal with 0.1～0.3 mm thick when punch forming is a base substrate; (b) plating solution formula is: NiSO
47H
2O 150～300g/L, NiCl
26H
2O40～80g/L, H
3PO
430～60g/L, H
3BO
340～60g/L, 65～95 ℃ of temperature, pH value 0.5～2.6, cathode current density 0.5～5A/dm
2
Beneficial effect of the present invention has: the one, and the employing sheet alloy is a raw material.The 2nd, adopt nickel-phosphorus alloy plating technology plating method, make this metal cover board corrosion resisting property good.The 3rd, the stable use that can maintain a long-term stability of electrolytic plating solution, and chemical plating fluid can only use 8 cycles must change plating bath; On main body nickel consumption, electrolytic ni plating derives from electrolytic zinc-coated steel sheet, and chemical nickel plating derives from the nickel ion of nickelous chloride, the cost of electrolytic ni plating will reduce more than three times than the cost of chemical nickel plating, according to as follows: the sheet nickel of existing market price is 170 yuan of per kilograms, 128 yuan of per kilograms of nickelous chloride, nickel content is 246.9 grams in every kilogram of nickelous chloride.Obtaining 1 kilogram nickel, to need nickelous chloride be 518.4 yuan.170: 518.4=1: 3.05; The nickel dam sedimentation velocity of electrolytic ni plating is fast, reaches as high as 35 microns/hour, than the fast several times of chemical nickel plating, high efficiency; Electrolytic ni plating can obtain any ratio of stablizing of phosphorus content in the nickel dam (5～15%).Be suitable for the production requirement of unicircuit microelectron packaging metal cover plate; The coating gloss appearance degree of electronickelling is good, has that the soldering and sealing fusing point is low, soldering and sealing qualification rate advantages of higher; The coating of electronickelling is compared with chemical nickel plating has bonding strength and compactness preferably, can not need to move back hydrogen after the plating and handle.
Description of drawings
Accompanying drawing is a process flow sheet of the present invention.
Embodiment
A kind of microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology comprises following operation:
1, punching out cover plate.The necessary burr of the cover plate that punching out is come out is little, and planeness is good, and smooth nothing abrades, and reaches market user's standard-required.Kovar alloy sheet material is selected in recommendation for use, and its thickness all can between 0.1～0.3 millimeter.Big for burr, have abrasively, can use polishing machine to be ground to and reach requirement.
2, electrochemical deoiling.Degreasing fluid is heated to 70 ℃-85 ℃, metal cover board is put into degreasing fluid carry out surface degreasing processing, 15 minutes time.Degreasing fluid adopts sodium hydroxide to account for 20-40g/L, and yellow soda ash accounts for 30-55g/L, and tertiary sodium phosphate 10-30g/L, emulsifying agent account for the mixed solution of 2-5g/L.
3, pickling.From degreasing fluid, take out metal cover board, put into 30% hydrochloric acid soln and soak after 10-15 minute, wash processing with deionized water.
4, electrolytic ni plating phosphorus alloy.Select the plating machine that shakes for use, the Constant Electric Current plating power supply.Anode adopts soluble anode and insoluble anode to mix and uses.Soluble anode sheet nickel, insoluble anode high-density graphite plate needs the charged groove of going into.When finishing workpiece after the plating and needing thermal treatment, must in hydrogen reducing atmosphere, carry out.As long as each component of electroplate liquid be between the following scope all can: NiSO
47H
2O 150～300g/L, NiCl
26H
2O40～80g/L, H
3PO
430～60g/L, H
3BO
340～60g/L, 65～95 ℃ of temperature, pH value 0.5～2.6, cathode current density 0.5～5A/dm
2Recommendation the best is:
NiSO
4·7H
2O 200g/L
NiCl
2·6H
2O 50g/L
H
3PO
4 60g/L
H
3BO
3 50g/L
90 ℃ of temperature
PH value 1.5
Cathode current density 4.5A/dm
2
Electroplating time generally was controlled at 30-90 minute according to the nickel layer thickness decision of customer requirement.
5, check.Metal cover board is through 40 ℃ of temperature, humidity 90-95%, and the phenomenon of corrosion does not appear in tests in 96 hours; Nickel plating thickness must reach customer requirement; Nickel dam is wanted light, high conformity, defectives such as surface no-pollution; Metal cover board carries out three crooked rear surfaces of 45-90 degree skin effect phenomenon must not occur.
Claims (1)
1, a kind of microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology, comprise punching out cover plate, electrochemical deoiling, pickling, electrolytic ni plating phosphorus alloy, inspection process, also comprise in case of necessity and move back the hydrogen treatment process after the plating, it is characterized in that (a) sheet metal with 0.1～0.3 mm thick when punch forming is a base substrate; (b) plating solution formula is: NiSO
47H
2O 150～300g/L, NiCl
26H
2O40～80g/L, H
3PO
430～60g/L, H
3BO
340～60g/L, 65～95 ℃ of temperature, pH value 0.5～2.6, cathode current density 0.5～5A/dm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101309426A CN101343760A (en) | 2008-08-28 | 2008-08-28 | Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101309426A CN101343760A (en) | 2008-08-28 | 2008-08-28 | Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101343760A true CN101343760A (en) | 2009-01-14 |
Family
ID=40245873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101309426A Pending CN101343760A (en) | 2008-08-28 | 2008-08-28 | Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology |
Country Status (1)
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|---|---|
| CN (1) | CN101343760A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101545127B (en) * | 2009-03-24 | 2011-03-16 | 宁利华 | Process for producing electronically-encapsulated metal cover plate |
| CN102021619A (en) * | 2010-12-10 | 2011-04-20 | 广州晋惠化工科技有限公司 | Electronickelling alloy solution for improving corrosion resistance of coating |
| CN102418124A (en) * | 2011-11-25 | 2012-04-18 | 中国电子科技集团公司第十八研究所 | Method for silvering kovar alloy interconnection piece |
| CN110565129A (en) * | 2019-09-24 | 2019-12-13 | 淮阴工学院 | Electroplating formula of nonmagnetic nickel-phosphorus alloy and continuous electroplating process thereof |
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
-
2008
- 2008-08-28 CN CNA2008101309426A patent/CN101343760A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101545127B (en) * | 2009-03-24 | 2011-03-16 | 宁利华 | Process for producing electronically-encapsulated metal cover plate |
| CN102021619A (en) * | 2010-12-10 | 2011-04-20 | 广州晋惠化工科技有限公司 | Electronickelling alloy solution for improving corrosion resistance of coating |
| CN102418124A (en) * | 2011-11-25 | 2012-04-18 | 中国电子科技集团公司第十八研究所 | Method for silvering kovar alloy interconnection piece |
| CN102418124B (en) * | 2011-11-25 | 2016-01-20 | 中国电子科技集团公司第十八研究所 | A kind of silver-coating method of kovar alloy interconnection piece |
| CN110565129A (en) * | 2019-09-24 | 2019-12-13 | 淮阴工学院 | Electroplating formula of nonmagnetic nickel-phosphorus alloy and continuous electroplating process thereof |
| CN110565129B (en) * | 2019-09-24 | 2020-06-05 | 淮阴工学院 | Electroplating formula of nonmagnetic nickel-phosphorus alloy and continuous electroplating process thereof |
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977361B (en) * | 2019-12-26 | 2024-05-03 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Shi Rong Document name: Notification of before Expiration of Request of Examination as to Substance |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090114 |