CN110565129A - Electroplating formula of nonmagnetic nickel-phosphorus alloy and continuous electroplating process thereof - Google Patents
Electroplating formula of nonmagnetic nickel-phosphorus alloy and continuous electroplating process thereof Download PDFInfo
- Publication number
- CN110565129A CN110565129A CN201910904675.1A CN201910904675A CN110565129A CN 110565129 A CN110565129 A CN 110565129A CN 201910904675 A CN201910904675 A CN 201910904675A CN 110565129 A CN110565129 A CN 110565129A
- Authority
- CN
- China
- Prior art keywords
- nickel
- phosphorus alloy
- electroplating
- phosphorus
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 40
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910001096 P alloy Inorganic materials 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 10
- 239000011574 phosphorus Substances 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims abstract description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004327 boric acid Substances 0.000 claims abstract description 6
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims abstract description 6
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims abstract description 6
- 238000005238 degreasing Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims description 2
- CGHIBGNXEGJPQZ-UHFFFAOYSA-N 1-hexyne Chemical compound CCCCC#C CGHIBGNXEGJPQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 230000005291 magnetic effect Effects 0.000 abstract description 15
- KDOWHHULNTXTNS-UHFFFAOYSA-N hex-3-yne-2,5-diol Chemical compound CC(O)C#CC(C)O KDOWHHULNTXTNS-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract description 2
- 230000005389 magnetism Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002524 electron diffraction data Methods 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004685 neutron diffraction pattern Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
本发明涉及连续电镀领域，公开了一种无磁性镍磷合金的电镀配方及其连续电镀工艺，该电镀配方包括氨基磺酸镍500ml/l、氯化镍8g/l、硼酸40g/l、磷酸17g/l和3‑己炔‑2，5‑二醇1.2g/l；使用该配方电镀出的镍磷合金镀层中磷的质量百分比为11~16%；该镍磷合金镀层的特点是：1.致密性和耐腐蚀性比化学镍好；2.优异的耐磨、磁学、光学、力学优势；3.传统得到需求性能的镍磷合金是用化学镍方式完成，该工艺解决了化学镍品质不稳定、产量低、电镀成本高、含磷排放多，不环保等问题。
The invention relates to the field of continuous electroplating, and discloses a non-magnetic nickel-phosphorus alloy electroplating formula and its continuous electroplating process. The electroplating formula includes nickel sulfamate 500ml/l, nickel chloride 8g/l, boric acid 40g/l, phosphoric acid 17g/l and 3-hexyne-2, 5-diol 1.2g/l; The mass percentage of phosphorus in the nickel-phosphorus alloy coating that uses this recipe electroplating is 11～16%; The characteristics of this nickel-phosphorus alloy coating are: 1. The compactness and corrosion resistance are better than chemical nickel; 2. Excellent wear resistance, magnetism, optics, and mechanics advantages; 3. The traditional nickel-phosphorus alloy that obtains the required performance is completed by chemical nickel. This process solves the problem of chemical Unstable nickel quality, low output, high electroplating cost, high phosphorous emissions, and no environmental protection.
Description
技术领域technical field
本发明涉及连续电镀领域，特别涉及一种无磁性镍磷合金的电镀配方及其连续电镀工艺。The invention relates to the field of continuous electroplating, in particular to an electroplating formula of a non-magnetic nickel-phosphorus alloy and a continuous electroplating process thereof.
背景技术Background technique
镍磷合金具有镀层致密、耐腐蚀、耐磨、优异的磁学、光学、电学等优点，广泛应用于汽车、通讯、航空、消费性电子等产品上，长期以来采用化学镀方式实现，但化学镀作业参数难调，品质不稳定良率低，产能低，化学镍每生产五个周期（约连续生产两天）需重新建浴，报废的镀液中磷回收技术难度高，给废水处理带来困扰，因此生产成本高。Nickel-phosphorus alloy has the advantages of dense coating, corrosion resistance, wear resistance, excellent magnetism, optics, electricity, etc., and is widely used in automobiles, communications, aviation, consumer electronics and other products. The parameters of the plating operation are difficult to adjust, the quality is unstable, the yield rate is low, and the production capacity is low. The bath needs to be rebuilt every five cycles of chemical nickel production (about two days of continuous production). Come to trouble, so the production cost is high.
发明内容Contents of the invention
发明目的：针对现有技术中存在的问题，本发明提供一种无磁性镍磷合金的电镀配方及其连续电镀工艺，使用该电镀配方和电镀工艺电镀出的镍磷合金镀层中，磷的质量百分比能达到11%以上，形成非晶态镀层，其致密性、耐腐蚀性和磁性优于化学镀。Purpose of the invention: Aiming at the problems existing in the prior art, the present invention provides a non-magnetic nickel-phosphorus alloy electroplating formula and its continuous electroplating process. The percentage can reach more than 11%, forming an amorphous coating, and its compactness, corrosion resistance and magnetic properties are better than electroless plating.
技术方案：本发明提供了一种无磁性镍磷合金的电镀配方，包括氨基磺酸镍450~550ml/l、氯化镍6~12g/l、硼酸35~45g/l、磷酸17g/l和3-己炔-2，5-二醇1.2g/l；使用该配方电镀出的镍磷合金中磷的质量百分比为11~16%。Technical solution: the invention provides a non-magnetic nickel-phosphorus alloy electroplating formula, including nickel sulfamate 450-550ml/l, nickel chloride 6-12g/l, boric acid 35-45g/l, phosphoric acid 17g/l and 3-hexyne-2,5-diol 1.2g/l; the mass percentage of phosphorus in the nickel-phosphorus alloy electroplated by using this formula is 11-16%.
本发明还提供了一种无磁性镍磷合金的连续电镀工艺，包括以下步骤：除油，酸洗，镀镍磷：使用上述的电镀无磁性镍磷合金的配方，电镀时控制温度为60℃，pH为1.5~2 ，电流密度为8~10ASD。The present invention also provides a continuous electroplating process for non-magnetic nickel-phosphorus alloy, comprising the following steps: degreasing, pickling, nickel-phosphorus plating: use the above-mentioned formula for electroplating non-magnetic nickel-phosphorus alloy, and control the temperature at 60°C during electroplating , the pH is 1.5~2, and the current density is 8~10ASD.
进一步地，在所述除油步骤中，具体包括以下操作：槽液温度60℃超声波除油→槽液温度60℃、电流密度8~15ASD、碱性除油粉水溶液电解除油→常温水洗→40~50℃热水洗。Further, the degreasing step specifically includes the following operations: ultrasonic degreasing at a bath temperature of 60°C → bath temperature at 60°C, current density of 8-15ASD, alkaline degreasing powder aqueous solution electrolytic degreasing → normal temperature water washing → Wash in hot water at 40~50°C.
进一步地，在所述酸洗步骤中，具体包括以下操作：20%硫酸浸泡8~20S→常温水洗→40~50℃热水洗。Further, the pickling step specifically includes the following operations: soaking in 20% sulfuric acid for 8-20 seconds → washing with water at normal temperature → washing with hot water at 40-50°C.
有益效果：本工艺通过对除油、酸洗、镀镍磷和镀镍磷药水中各组份参数的设定，使用价态为+5的磷酸以及半光泽剂3-己炔-2，5-二醇的配合使用，可得到磷的质量百分比高达11%以上的非晶态镍磷合金镀层，镍是顺磁物质之一，当磷镍合金中磷含量达11%以上时，其镍磷结构没有对称性和周期重复性，它的电子衍射、中子衍射和X射线衍射图是由较宽的晕和弥散的环组成，因此形成非晶态各向同性，从而具备无磁的特性。这种非晶态镍磷合金镀层的特点是：1.无磁性；2.致密性和耐腐蚀性比化学镍好；3.优异的耐磨、磁学、光学、力学优势；电镀配方中3-己炔-2，5-二醇的使用使得镍磷镀层具有光泽（或半光泽），镀层外观美观光滑美观。与传统的化学镀镍方式相比，本工艺电镀出的镍磷合金镀层品质稳定、产量高、电镀成本低、含磷排放较少且更环保，解决了化学镀镍磷合金的所有缺点，且磷含量能达到11%以上形成非晶态镍磷合金镀层，其致密性、耐腐蚀性和磁性优于化学镀。Beneficial effects: This process uses phosphoric acid with a valence of +5 and a semi-gloss agent 3-hexyne-2,5 through setting the parameters of each component in degreasing, pickling, nickel-plating phosphorus and nickel-plating phosphorus potion. The combined use of -diol can obtain an amorphous nickel-phosphorus alloy coating with a phosphorus content of more than 11% by mass. Nickel is one of the paramagnetic substances. When the phosphorus content in the phosphorus-nickel alloy reaches more than 11%, its nickel phosphorus The structure has no symmetry and periodic repetition. Its electron diffraction, neutron diffraction and X-ray diffraction patterns are composed of wider halos and diffuse rings, so it forms an amorphous state and isotropic, thus possessing non-magnetic properties. The characteristics of this amorphous nickel-phosphorus alloy coating are: 1. Non-magnetic; 2. The compactness and corrosion resistance are better than chemical nickel; 3. Excellent wear resistance, magnetic, optical and mechanical advantages; 3 in the electroplating formula - The use of hexyne-2,5-diol makes the nickel-phosphorus coating shiny (or semi-glossy), and the coating has a beautiful, smooth appearance. Compared with the traditional electroless nickel plating method, the nickel-phosphorus alloy plating produced by this process has stable quality, high output, low plating cost, less phosphorous emissions and is more environmentally friendly, which solves all the shortcomings of electroless nickel-phosphorus alloy plating, and The phosphorus content can reach more than 11% to form an amorphous nickel-phosphorus alloy coating, and its compactness, corrosion resistance and magnetic properties are superior to those of electroless plating.
附图说明Description of drawings
图1为无磁性镍磷合金的电镀工艺流程图；Fig. 1 is the electroplating process flowchart of non-magnetic nickel-phosphorus alloy;
图2为实施方式1电镀配方和工艺得到的镍磷合金镀层在2000倍扫描电子显微镜下的图片；Fig. 2 is the picture under the 2000 times scanning electron microscope of the nickel-phosphorus alloy coating that embodiment 1 electroplating formula and process obtain;
图3为实施方式1电镀配方和工艺得到的镍磷合金镀层在30倍扫描电子显微镜下的图片；Fig. 3 is the picture under the scanning electron microscope of 30 times of the nickel-phosphorus alloy coating that embodiment 1 electroplating formula and process obtain;
图4为图3中方框1内镍磷合金镀层的EDS测试图谱；Fig. 4 is the EDS test spectrum of nickel-phosphorus alloy coating in box 1 in Fig. 3;
图5为图3中方框2内镍磷合金镀层的EDS测试图谱。FIG. 5 is an EDS test spectrum of the nickel-phosphorus alloy coating in box 2 in FIG. 3 .
具体实施方式Detailed ways
下面结合附图对本发明进行详细的介绍。The present invention will be described in detail below in conjunction with the accompanying drawings.
实施方式1：Implementation mode 1:
本实施方式提供了一种无磁性镍磷合金的电镀配方，包括氨基磺酸镍500ml/l、氯化镍8g/l、硼酸40g/l、磷酸17g/l和3-己炔-2，5-二醇1.2g/l。This embodiment provides a non-magnetic nickel-phosphorus alloy electroplating formula, including nickel sulfamate 500ml/l, nickel chloride 8g/l, boric acid 40g/l, phosphoric acid 17g/l and 3-hexyne-2,5 - diol 1.2 g/l.
使用上述电镀配方通过以下连续电镀工艺电镀镍磷合金镀层（工艺流程如图1）：Using the above electroplating formula, the nickel-phosphorus alloy coating was electroplated by the following continuous electroplating process (the process flow is shown in Figure 1):
除油：槽液温度60℃超声波除油→槽液温度60℃、电流密度8~15ASD、碱性除油粉水溶液电解除油→常温水洗→40~50℃热水洗。Degreasing: bath temperature 60°C ultrasonic degreasing → bath temperature 60°C, current density 8~15ASD, alkaline degreasing powder aqueous solution electrolytic degreasing → normal temperature water washing → 40~50°C hot water washing.
酸洗：20%硫酸浸泡8~20S→常温水洗→40~50℃热水洗。Pickling: Soak in 20% sulfuric acid for 8~20S → wash with water at room temperature → wash with hot water at 40~50°C.
镀镍磷：使用上述的电镀无磁性镍磷合金的电镀配方，电镀时控制温度为60℃，pH为1.5~2 ，电流密度为8~10ASD。Nickel-phosphorous plating: use the above-mentioned electroplating formula for electroplating non-magnetic nickel-phosphorus alloy, control the temperature at 60°C, pH at 1.5~2, and current density at 8~10ASD during electroplating.
从图2中可以看出，使用上述电镀配方以及电镀工艺电镀出的镍磷合金镀层的结晶致密。It can be seen from FIG. 2 that the crystallization of the nickel-phosphorus alloy plating layer electroplated using the above-mentioned electroplating formula and electroplating process is dense.
从图3至图5可以看出，上述镍磷合金镀层中，在第1点，磷的质量百分比达15.268%，在第2点，磷的质量百分比达15.303%。It can be seen from Fig. 3 to Fig. 5 that in the above-mentioned nickel-phosphorus alloy coating, at the first point, the mass percentage of phosphorus reaches 15.268%, and at the second point, the mass percentage of phosphorus reaches 15.303%.
实施方式2：Implementation mode 2:
本实施方式提供了一种无磁性镍磷合金的电镀配方，包括氨基磺酸镍550ml/l、氯化镍6g/l、硼酸35g/l、磷酸17g/l和3-己炔-2，5-二醇1.2g/l。This embodiment provides a non-magnetic nickel-phosphorus alloy electroplating formula, including nickel sulfamate 550ml/l, nickel chloride 6g/l, boric acid 35g/l, phosphoric acid 17g/l and 3-hexyne-2,5 - diol 1.2 g/l.
使用上述电镀配方通过与实施方式1完全相同的连续电镀工艺电镀镍磷合金镀层，此处不做赘述。Using the above electroplating recipe, the nickel-phosphorus alloy coating is electroplated through the same continuous electroplating process as that of Embodiment 1, which will not be repeated here.
实施方式3：Implementation mode 3:
本实施方式提供了一种无磁性镍磷合金的电镀配方，包括氨基磺酸镍450ml/l、氯化镍12g/l、硼酸45g/l、磷酸17g/l和3-己炔-2，5-二醇1.2g/l。This embodiment provides a non-magnetic nickel-phosphorus alloy electroplating formula, including nickel sulfamate 450ml/l, nickel chloride 12g/l, boric acid 45g/l, phosphoric acid 17g/l and 3-hexyne-2,5 - diol 1.2 g/l.
使用上述电镀配方通过与实施方式1完全相同的连续电镀工艺电镀镍磷合金镀层，此处不做赘述。Using the above electroplating recipe, the nickel-phosphorus alloy coating is electroplated through the same continuous electroplating process as that of Embodiment 1, which will not be repeated here.
上述实施方式只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所做的等效变换或修饰，都应涵盖在本发明的保护范围之内。The above-mentioned embodiments are only for illustrating the technical concept and characteristics of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and not to limit the scope of protection of the present invention. All equivalent changes or modifications made according to the spirit of the present invention shall fall within the protection scope of the present invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904675.1A CN110565129B (en) | 2019-09-24 | 2019-09-24 | Electroplating formula of non-magnetic nickel-phosphorus alloy and its continuous electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904675.1A CN110565129B (en) | 2019-09-24 | 2019-09-24 | Electroplating formula of non-magnetic nickel-phosphorus alloy and its continuous electroplating process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110565129A true CN110565129A (en) | 2019-12-13 |
| CN110565129B CN110565129B (en) | 2020-06-05 |
Family
ID=68782049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910904675.1A Active CN110565129B (en) | 2019-09-24 | 2019-09-24 | Electroplating formula of non-magnetic nickel-phosphorus alloy and its continuous electroplating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110565129B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112064073A (en) * | 2020-08-04 | 2020-12-11 | 深圳市生利科技有限公司 | Nickel alloy electroplating solution and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3677913A (en) * | 1971-04-01 | 1972-07-18 | M & T Chemicals Inc | Nickel plating |
| JPS5770286A (en) * | 1980-10-22 | 1982-04-30 | Dainippon Printing Co Ltd | Plating bath composition and plating method |
| US4345007A (en) * | 1975-12-17 | 1982-08-17 | General Electric Company | Electro-deposition of a nonmagnetic conductive coating for memory wire protection |
| BG52096A (en) * | 1980-10-31 | 1996-09-30 | Armjanov | Method for the application of complex coating including magnetic layer on an aluminium alloy substrate |
| CN1783217A (en) * | 2004-11-30 | 2006-06-07 | 富士通株式会社 | Method of forming NiP nonmagnetic film and method of manufacturing magnetic head using the film |
| CN101343760A (en) * | 2008-08-28 | 2009-01-14 | 南平市同创电子有限公司 | Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology |
| CN101730759A (en) * | 2007-06-18 | 2010-06-09 | 维尔英科有限公司 | Method for improving cathode morphology |
-
2019
- 2019-09-24 CN CN201910904675.1A patent/CN110565129B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3677913A (en) * | 1971-04-01 | 1972-07-18 | M & T Chemicals Inc | Nickel plating |
| US4345007A (en) * | 1975-12-17 | 1982-08-17 | General Electric Company | Electro-deposition of a nonmagnetic conductive coating for memory wire protection |
| JPS5770286A (en) * | 1980-10-22 | 1982-04-30 | Dainippon Printing Co Ltd | Plating bath composition and plating method |
| BG52096A (en) * | 1980-10-31 | 1996-09-30 | Armjanov | Method for the application of complex coating including magnetic layer on an aluminium alloy substrate |
| CN1783217A (en) * | 2004-11-30 | 2006-06-07 | 富士通株式会社 | Method of forming NiP nonmagnetic film and method of manufacturing magnetic head using the film |
| CN101730759A (en) * | 2007-06-18 | 2010-06-09 | 维尔英科有限公司 | Method for improving cathode morphology |
| CN101343760A (en) * | 2008-08-28 | 2009-01-14 | 南平市同创电子有限公司 | Microelectron packaging metal cover plate electroplating nickel phosphor alloy production technology |
Non-Patent Citations (1)
| Title |
|---|
| 李雪城 等: "脉冲电铸非晶态镍磷合金试验研究", 《电加工与模具》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112064073A (en) * | 2020-08-04 | 2020-12-11 | 深圳市生利科技有限公司 | Nickel alloy electroplating solution and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110565129B (en) | 2020-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103014681B (en) | Preparation method of Ni-P alloy gradient coating | |
| Chen et al. | Effects of fluoride ions as electrolyte additives for a PEO/Ni-P composite coating onto Mg alloy AZ31B | |
| CN106893953B (en) | Cobalt-based amorphous alloy powder and production method thereof | |
| CN101287354B (en) | Electro-magnetic shielding material of tin-nickel alloy and preparing method thereof | |
| JP5452458B2 (en) | Nickel plating solution and nickel plating method | |
| CN102002692A (en) | Chemical plating Ni (nickel)-P (phosphorus)/Ni-P-PTFE (polytetrafluoroethylene) compound structure plating layer and preparation process | |
| CN106893954A (en) | A kind of Co-based amorphous alloy powder and its preparation process | |
| CN110565129A (en) | Electroplating formula of nonmagnetic nickel-phosphorus alloy and continuous electroplating process thereof | |
| CN101597780A (en) | A kind of method for preparing the nickel-silver alloy steel strip that battery case uses | |
| CN104775119B (en) | Laser cladding preparation method for low-friction-coefficient Fe-base amorphous alloy coating | |
| CN102965652A (en) | Stainless steel plate surface blackening treatment process | |
| CN102330130A (en) | Process method for preplating nickel on surface of minuteness aluminum wire before copper plating | |
| CN104294349B (en) | A kind of steel surface covers the method for cold black coslettising film | |
| JP2009270184A (en) | Copper-zinc alloy electroplating bath and plating method using the same | |
| CN104846408A (en) | Plating solution formula and electroplating method for plating compact rhenium film on copper substrate | |
| CN101514449A (en) | Composite chemical nickel and phosphor plating method | |
| CN104120465B (en) | A kind of Electroplate liquid of alkaline zinc-nickel alloy and its preparation method and application | |
| JP6547232B2 (en) | Plating solution and method of producing plated product | |
| Daugherty et al. | The influence of an aqueous-butanol plating bath on the microstructure and corrosion resistance of electrodeposited nickel coatings | |
| CN101537490B (en) | Preparation method of nickel-phosphorus alloy-coated iron powder | |
| CN106119914B (en) | A kind of cobalt manganese alloy electroplate liquid and its application | |
| CN101949043B (en) | Formulation for electroplating black rhodium layer and method thereof | |
| CN104962896A (en) | Zinc-system phosphating solution additive and use method thereof | |
| CN108300990A (en) | A kind of environment-friendly type coloring process of stainless steel cloth | |
| CN106756908A (en) | A kind of high temperature resistant Ni B Ce Composite electroless deposits layer and its ultrasound wave auxiliary preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231108 Address after: 523000 No. 2, Yinhu Third Road, shishuikou, Qiaotou town, Dongguan City, Guangdong Province Patentee after: DONGGUAN STANDARD ELECTRONIC MATERIAL CO.,LTD. Address before: Room 393, No. 68, Dongcheng Section, Yunhe West 1st Road, Dongcheng Street, Dongguan City, Guangdong Province, 523000 Patentee before: Dongguan Guanxing Intellectual Property Agency Co.,Ltd. Effective date of registration: 20231108 Address after: Room 393, No. 68, Dongcheng Section, Yunhe West 1st Road, Dongcheng Street, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Guanxing Intellectual Property Agency Co.,Ltd. Address before: 223005 Huaian 1 Jiangsu economic and Technological Development Zone Patentee before: HUAIYIN INSTITUTE OF TECHNOLOGY |
|
| TR01 | Transfer of patent right |