CN207183247U - A kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate - Google Patents
A kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate Download PDFInfo
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- CN207183247U CN207183247U CN201721093216.2U CN201721093216U CN207183247U CN 207183247 U CN207183247 U CN 207183247U CN 201721093216 U CN201721093216 U CN 201721093216U CN 207183247 U CN207183247 U CN 207183247U
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Abstract
It the utility model is related to that a kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate, including the cover board body made of kovar alloy and golden soldering ring, the surface of the cover board body is coated with nickel dam and layer gold successively outward from interior, the golden soldering boxing is connected on the top surface of cover board body, the thickness of the nickel dam is 3um~5um, the thickness of the layer gold is 0.8um~1.3um, the thickness of the golden soldering ring is 0.03mm~0.05mm, golden soldering ring uses preforming processing, and the cover board body is connected as one with golden soldering ring by spot welding.The utility model structure design is simple, rationally, is applicable to reliability and air-tightness requires the encapsulation of high electronic component, packaging effect is good.
Description
Technical field：
The utility model belongs to Electronic Packaging field, more particularly to a kind of band gold soldering ring used for electronic packaging is gold-plated cuts down lid
Plate.
Background technology：
Electronically-encapsulated metal cover plate is widely used in the encapsulation of electronic device.But with the rapid development of electronics industry, electricity
Sub- component small product size is less and less, Product Precision more and more higher, and requirement when it is encapsulated to reliability and air-tightness is higher,
And existing Electronic Packaging cover plate poor welding quality, highly reliable air-tight packaging can not be applied to well.
Utility model content：
The purpose of this utility model is to be directed to above weak point, there is provided a kind of band gold soldering ring used for electronic packaging is gold-plated
Cover plate can be cut down, it is reasonable in design, it is applicable to highly reliable air-tight packaging.
To achieve these goals, the technical solution adopted in the utility model is：A kind of band gold soldering ring used for electronic packaging
Gold-plated to cut down cover plate, including cover board body and golden soldering ring made of kovar alloy, the surface of the cover board body is from interior past
Nickel dam and layer gold are coated with successively outside, and the golden soldering boxing is connected on the top surface of cover board body.
Further, the thickness of the nickel dam is 3um~5um；The thickness of the layer gold is 0.8um~1.3um.
Further, the thickness of the golden soldering ring is 0.03mm~0.05mm, and golden soldering ring uses preforming processing.
Further, the cover board body is connected as one with golden soldering ring by spot welding.
Further, the cover board body is rectangular-shaped with golden soldering ring, and the Outside Dimensions of golden soldering ring are than cover plate sheet
Small 0.04mm~the 0.06mm of Outside Dimensions of body.
Compared with prior art, the utility model has the following effects that：The utility model structure design is simple, reasonable, can
It is good suitable for the encapsulation of the high electronic component of reliability and air-tightness requirement, packaging effect.
Brief description of the drawings：
Fig. 1 is the organigram of the utility model embodiment；
Fig. 2 is the organigram of golden soldering ring in the utility model.
In figure：
1- cover board bodies；2- gold soldering rings.
Embodiment:
The utility model is described in more detail with reference to the accompanying drawings and detailed description.
As shown in Figure 1-2, a kind of band gold soldering ring used for electronic packaging of the utility model is gold-plated cuts down cover plate, including by that can cut down
Cover board body 1 made of alloy and golden soldering ring 2, the surface of the cover board body 1 are coated with nickel dam and layer gold successively outward from interior,
The golden soldering ring 2 is welded on the top surface of cover board body 1.
The kovar alloy is nickeliferous 29%, the Bohemian glass iron-based sealing alloy of cobalt 17%, and the alloy is in 20 ~ 450 DEG C of scopes
It is interior have with Bohemian glass similar in linear expansion coefficient and corresponding Bohemian glass can carry out effective sealing-in matching, and higher curie point
And good cryo tissue stability, the oxide-film of alloy is fine and close, and easily welding and welding, there is good plasticity, machinable
Processing.
The golden soldering ring 2 uses gold 80%, the brazing alloy of tin 20%（280 DEG C of fusing point）Eutectic material, have it is anti-oxidant
Property it is high, creep resistance is good, and wetability is good, and strength of welded joint is high and the advantages that good heat conductivity, it is gentle to be applicable to reliability
Close property requires the welding of high electronic component.
In the present embodiment, the thickness of the nickel dam is 3um~5um；The thickness of the layer gold is 0.8um~1.3um；It is described
Nickel dam, layer gold are to use plating, re-plating layer gold after first electroless nickel layer.
In the present embodiment, the thickness of the golden soldering ring 2 is 0.03mm~0.05mm, and golden soldering ring 2 is added using preforming
Work.
In the present embodiment, the cover board body 1 is connected as one with golden soldering ring 2 by spot welding.
In the present embodiment, the cover board body 1 is rectangular-shaped with golden soldering ring 2, and the Outside Dimensions of golden soldering ring 2 are than lid
Small 0.04mm~the 0.06mm of Outside Dimensions of plate body 1, the inner ring size of golden soldering ring 2 is according to the electronic component and collection of encapsulation
Into the bigger 0.04mm~0.06mm of lumen size of circuit case.
The cover board body 1 is processed by punching press or etching, and the surrounding of cover board body 1 and golden soldering ring 2 is set respectively
There is fillet.
The foregoing is only preferred embodiment of the present utility model, it is all done according to present utility model application the scope of the claims it is equal
Deng change and modification, it should all belong to covering scope of the present utility model.
Claims (5)
1. a kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate, it is characterised in that：Including being covered made of kovar alloy
Plate body and golden soldering ring, the surface of the cover board body are coated with nickel dam and layer gold, the golden soldering boxing successively outward from interior
It is connected on the top surface of cover board body.
2. a kind of band gold soldering ring used for electronic packaging according to claim 1 is gold-plated to cut down cover plate, it is characterised in that：It is described
The thickness of nickel dam is 3um~5um；The thickness of the layer gold is 0.8um~1.3um.
3. a kind of band gold soldering ring used for electronic packaging according to claim 1 is gold-plated to cut down cover plate, it is characterised in that：It is described
The thickness of golden soldering ring is 0.03mm~0.05mm, and golden soldering ring uses preforming processing.
4. a kind of band gold soldering ring used for electronic packaging according to claim 3 is gold-plated to cut down cover plate, it is characterised in that：It is described
Cover board body is connected as one with golden soldering ring by spot welding.
5. a kind of band gold soldering ring used for electronic packaging according to claim 1 is gold-plated to cut down cover plate, it is characterised in that：It is described
Cover board body is rectangular-shaped with golden soldering ring, and the Outside Dimensions of golden soldering ring are smaller 0.04mm than the Outside Dimensions of cover board body~
0.06mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093216.2U CN207183247U (en) | 2017-08-30 | 2017-08-30 | A kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093216.2U CN207183247U (en) | 2017-08-30 | 2017-08-30 | A kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207183247U true CN207183247U (en) | 2018-04-03 |
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ID=61738381
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721093216.2U Active CN207183247U (en) | 2017-08-30 | 2017-08-30 | A kind of band gold soldering ring used for electronic packaging is gold-plated to cut down cover plate |
Country Status (1)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109698135A (en) * | 2018-12-21 | 2019-04-30 | 中国电子科技集团公司第四十七研究所 | The encapsulating method of integrated circuit sealing structure with gold-tin eutectic solder ring |
| CN110026705A (en) * | 2019-03-08 | 2019-07-19 | 南昌大学 | A kind of coating and its preparation process of enhancing Sn base solder/Kovar alloy interconnection welding spot reliability |
| CN110899978A (en) * | 2019-12-26 | 2020-03-24 | 江阴丽晶电子科技有限公司 | Gold-tin solder laser attachment assembly of ceramic cover plate and attachment method thereof |
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN115001444A (en) * | 2022-06-02 | 2022-09-02 | 安徽晶赛科技股份有限公司 | Quartz crystal resonator gold-tin soldering preformed upper cover and manufacturing method thereof |
| CN115666210A (en) * | 2022-12-12 | 2023-01-31 | 南京中旭电子科技有限公司 | Ceramic air-tight packaged high-sensitivity Hall element and packaging device thereof |
-
2017
- 2017-08-30 CN CN201721093216.2U patent/CN207183247U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109698135A (en) * | 2018-12-21 | 2019-04-30 | 中国电子科技集团公司第四十七研究所 | The encapsulating method of integrated circuit sealing structure with gold-tin eutectic solder ring |
| CN109698135B (en) * | 2018-12-21 | 2020-06-02 | 中国电子科技集团公司第四十七研究所 | Sealing method of integrated circuit sealing structure with gold-tin alloy solder ring |
| CN110026705A (en) * | 2019-03-08 | 2019-07-19 | 南昌大学 | A kind of coating and its preparation process of enhancing Sn base solder/Kovar alloy interconnection welding spot reliability |
| CN110899978A (en) * | 2019-12-26 | 2020-03-24 | 江阴丽晶电子科技有限公司 | Gold-tin solder laser attachment assembly of ceramic cover plate and attachment method thereof |
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977361B (en) * | 2019-12-26 | 2024-05-03 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN115001444A (en) * | 2022-06-02 | 2022-09-02 | 安徽晶赛科技股份有限公司 | Quartz crystal resonator gold-tin soldering preformed upper cover and manufacturing method thereof |
| CN115666210A (en) * | 2022-12-12 | 2023-01-31 | 南京中旭电子科技有限公司 | Ceramic air-tight packaged high-sensitivity Hall element and packaging device thereof |
| CN115666210B (en) * | 2022-12-12 | 2023-04-07 | 南京中旭电子科技有限公司 | Ceramic air-tight packaged high-sensitivity Hall element and packaging device thereof |
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