CN104625623A - Cu-W/Cu-Cu composite board preparation method - Google Patents
Cu-W/Cu-Cu composite board preparation method Download PDFInfo
- Publication number
- CN104625623A CN104625623A CN201410777736.XA CN201410777736A CN104625623A CN 104625623 A CN104625623 A CN 104625623A CN 201410777736 A CN201410777736 A CN 201410777736A CN 104625623 A CN104625623 A CN 104625623A
- Authority
- CN
- China
- Prior art keywords
- composite board
- sheet material
- composite
- hip
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a Cu-W/Cu-Cu composite board preparation method. According to the method, based on sealing weld and hot isostatic pressure technologies, structure optimization is conducted on sandwich composite materials, and finally near-net formed products are prepared. The Cu-W/Cu-Cu composite board preparation method is short in technological process, near-net in forming, especially suitable for large-scale industrial production and high in composite interlamination binding force, the strength and thermal property of the composite materials are guaranteed effectively, and the heat dissipation problem of high-dissipation-power electronic devices can be solved.
Description
Technical field
The present invention is a kind of method preparing Cu-W/Cu-Cu composite board, belongs to composite board preparing technical field.
Background technology
The development of, power miniaturized, integrated along with chip, the heat sink material of high heat conduction is the development trend of electronic devices and components encapsulation always.
Tungsten copper heat-sink material, by regulating two matcheds, make thermal coefficient of expansion and pottery wait nonmetal basal body close, thus after soldering, residual stress is less.But the thermal conductivity of tungsten copper the highest can only 190W/ (mK) left and right, close to its theoretical value, rethought raising and be restricted.
For making up the deficiency in homogenous material performance, the heat sink material that current Foreign High Power equipment uses much all uses with the form of multilayer materials, sandwich formats composite as this in Cu-Mo/Cu-Cu and Cu-W/Cu-Cu.Domesticly only carried out research for Cu-Mo/Cu-Cu material at present, and for Cu-W/Cu-Cu composite, domestic do not have pertinent literature to report, Cu-W/Cu-Cu composite places one's entire reliance upon external import, offshore company sells overall on power tube equipment for this Material cladding, do not sell material separately, the preparation technology of material also maintains secrecy completely.
Summary of the invention
The present invention designs for above-mentioned prior art situation a kind of method preparing Cu-W/Cu-Cu composite board that provides just, its objective is the blank filling up domestic Cu-W/Cu-Cu composite board manufacturing technology field.
The content of technical solution of the present invention is:
This kind prepares the method for Cu-W/Cu-Cu composite board, it is characterized in that: steps of the method are:
Step one: by coated for the side perimeters Cu skin (3) of the W/Cu sheet material (2) being positioned at composite board intermediate layer, then W/Cu sheet material (2) upper and lower surface laminating Cu sheet material (1), at the Ni-based or ag-cu solder of the upper filling in the gap (4) of laminating, to the Cu skin (3) of W/Cu sheet material (2) side and Cu sheet material (1) vacuum brazing of upper and lower laminating with it, form the soldering and sealing to inner W/Cu sheet material (2);
Step 2: the slab of the three ply board material welded is placed in high temperature insostatic pressing (HIP) stove and carries out high temperature insostatic pressing (HIP), obtains surface by the Cu-W/Cu-Cu composite board of copper clad;
Step 3: the clout around excision Cu-W/Cu-Cu composite board, side makes the W/Cu sheet material (2) in Cu-W/Cu-Cu composite board intermediate layer come out, then machined is carried out to the upper and lower surface of Cu-W/Cu-Cu composite board smooth, and split by finished size, obtain final products after surface treatment.
The solder of the connection gap filling of three ply board material is BNi2.
Cu sheet material (1) and Cu skin (3) are made for oxygenless copper material.
The thickness that Cu sheet material (1) is 1: 1 ~ 3, Cu-W/Cu-Cu composite board final products with the Thickness Ratio of W/Cu sheet material (2) is 1.5mm ~ 50mm.
In W/Cu sheet material (2), the percentage by volume of Cu is 30% ~ 70%.
The heating-up temperature of the high temperature insostatic pressing (HIP) described in step 2 is 850 DEG C ~ 960 DEG C, and pressure is 120 ~ 200MPa, and the time is 2 ~ 4h.
In technical solution of the present invention, by regulating the thickness ratio of Cu sheet material (1) and W/Cu plate (2) in Cu-W/Cu-Cu composite board, the thermal conductivity of Cu-W/Cu-Cu composite board and thermal coefficient of expansion are optimized, first, because Cu-W/Cu-Cu composite board surface is copper, its thermal conductivity reaches as high as 400W/ (mK), material surface has good lateral heat diffusion ability, the thermal conductivity of material monolithic also can be reached and reveal higher thermal conductivity than single W/Cu material list; Secondly, Cu-W/Cu-Cu composite board and power tube Al
2o
3pottery matched coefficients of thermal expansion good, soldering test show the residual deformation of shell and stress little; Three, Cu-W/Cu-Cu composite board is applicable to soldering and the electroplating technology of power tube shell, and processing compatibility is good.Current laminar composite main preparation methods has roll-bonding method, explosive welding composite algorithm, soldering composite algorithm etc., and the present invention is different from said method, with soldering and sealing and high temperature insostatic pressing (HIP) for Process ba-sis, forms the near-net-shape technology of preparation Cu-W/Cu-Cu composite board.The soldering and sealing of Cu-W/Cu-Cu composite board does not need jacket, adopts at the side perimeters Cu skin (3) of W/Cu sheet material (2) coated, makes the connection between the foreign material between three ply board material be converted into the soldering and sealing of same material between Cu-Cu.Then carry out the high temperature insostatic pressing (HIP) compound under high temperature and gas-phase high pressure, the basis not affecting Thickness Ratio allows Cu-W/Cu-Cu form compact siro spinning technology, ensure that the intensity of Cu-W/Cu-Cu composite board and the heat transfer property of all directions.Adopt the method to prepare Cu-W/Cu-Cu composite board, have the advantage of high strength, high heat conduction, good manufacturability, the heat radiation of high dissipated power electronic device, encapsulation problem can be solved.
Accompanying drawing explanation
Fig. 1 is the syndeton schematic diagram of three ply board material in the inventive method
Fig. 2 is the schematic diagram in the inventive method, W/Cu sheet material 2 being formed to vacuum seal
The well-distributed pressure schematic diagram of the high temperature insostatic pressing (HIP) used in Fig. 3 the inventive method
Fig. 4 is the cutting schematic diagram to the final products of Cu-W/Cu-Cu composite board in inventive method
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is further elaborated.
Embodiment 1
The present embodiment is that in 1: 1: 1, W/Cu sheet material 2, Cu volume fraction is the 3mm Cu-W/Cu-Cu composite board of 50% for preparing Thickness ratio, and preparation process comprises the following steps:
Step one: select the oxygen-free copper Cu sheet material 1 two pieces of thickness being 1.1mm (leaving the processing clout of 0.1mm), one piece of Cu volume fraction is selected to be that the 1mm W/Cu sheet material 2 of 50% is (because high temperature insostatic pressing (HIP) pressure medium is gas phase well-distributed pressure, substantially can not have an impact to the final size of dense matter), coated Cu skin 3 is 0.1mm.Oxygen-free copper Cu sheet material 1 and the Cu skin 3 on upper and lower surface fit tightly, and are wrapped up completely (Fig. 1) by tungsten copper, outer copper and tungsten copper core are fixed by frock.Use resistant to elevated temperatures BNi2 solder, to the Cu skin 3 of W/Cu sheet material 2 side and Cu sheet material 1 vacuum brazing of upper and lower laminating with it, form the soldering and sealing to inner W/Cu sheet material 2, form the vacuum environment being applicable to subsequent thermal isostatic pressed.By fluoroscopic examination, guarantee in box to be vacuum condition, seal completely.
Step 2: inner chamber vacuum coater slab good for soldering and sealing in step one is placed in high temperature insostatic pressing (HIP) stove and carries out high temperature insostatic pressing (HIP), heating-up temperature is 900 DEG C, pressure is 120MPa, and the time is 2h, obtains all surface by the Cu-W/Cu-Cu composite board (Fig. 3) of copper clad.
Step 3: to Cu-W/Cu-Cu composite board excision clout (Fig. 4) in step 2, machined is carried out to upper and lower surface smooth, remove the 0.1mm surplus of upper and lower surface.
Step 4: the Cu-W/Cu-Cu composite board obtained in step 3 is carried out the segmentation (Fig. 4) for finished size, and Nickel Plating Treatment is carried out to it, obtaining Thickness ratio is that in 1:1:1, W/Cu layer, Cu volume fraction is the 3mm Cu-W/Cu-Cu composite board of 50%.
Embodiment 2
The present embodiment is that in 1: 3: 1, W/Cu layer, Cu volume fraction is the 15mm Cu-W/Cu-Cu composite board of 30% for preparing Thickness ratio, and preparation process comprises the following steps:
Step one: select the oxygen-free copper Cu sheet material 1 two pieces of thickness being 3.1mm (leaving the processing clout of 0.1mm), one piece of Cu volume fraction is selected to be that the 9mm W/Cu sheet material 2 of 30% is (because high temperature insostatic pressing (HIP) pressure medium is gas phase well-distributed pressure, substantially can not have an impact to the final size of dense matter), coated Cu skin 3 is 0.1mm.Oxygen-free copper Cu sheet material 1 and the Cu skin 3 on upper and lower surface fit tightly, and are wrapped up completely (Fig. 1) by tungsten copper, outer copper and tungsten copper core are fixed by frock.Use resistant to elevated temperatures BNi2 solder, to the Cu skin 3 of W/Cu sheet material 2 side and Cu sheet material 1 vacuum brazing of upper and lower laminating with it, form the soldering and sealing to inner W/Cu sheet material 2, form the vacuum environment being applicable to subsequent thermal isostatic pressed.By fluoroscopic examination, guarantee in box to be vacuum condition, seal completely.
Step 2: inner chamber vacuum coater slab good for soldering and sealing in step one is placed in high temperature insostatic pressing (HIP) stove and carries out high temperature insostatic pressing (HIP), heating-up temperature is 950 DEG C, pressure is 150MPa, and the time is 2.5h, obtains all surface by the Cu-W/Cu-Cu composite board (Fig. 3) of copper clad.
Step 3: to Cu-W/Cu-Cu composite board excision clout (Fig. 4) in step 2, machined is carried out to upper and lower surface smooth, remove the 0.1mm surplus of upper and lower surface.
Step 4: the Cu-W/Cu-Cu composite board obtained in step 3 is carried out the segmentation (Fig. 4) for finished size, and Nickel Plating Treatment is carried out to it, obtaining Thickness ratio is that in 1:3:1, W/Cu layer, Cu volume fraction is the 15mm Cu-W/Cu-Cu composite board of 30%.
The present invention has the following advantages:
(1) the present invention use special construction soldering and sealing and high temperature insostatic pressing (HIP) complex technique can ensure in implementation process interface zero defect combine, prevent the oxidation of surfaces externally and internally, reach the high request that final CWC composite plate is good to horizontal and vertical heat radiation.
(2) the present invention use special construction soldering and sealing and high temperature insostatic pressing (HIP) complex technique, few clout is even without clout (clout is reusable), affect final molding size hardly, near-net-shape effect can be reached, and use volume of equipment large, large-sized product can be obtained, so be particularly suitable for large-scale industrial production while enhancing productivity.
Claims (6)
1. prepare a method for Cu-W/Cu-Cu composite board, it is characterized in that: steps of the method are:
Step one: by coated for the side perimeters Cu skin (3) of the W/Cu sheet material (2) being positioned at composite board intermediate layer, then W/Cu sheet material (2) upper and lower surface laminating Cu sheet material (1), at the Ni-based or ag-cu solder of the upper filling in the gap (4) of laminating, to the Cu skin (3) of W/Cu sheet material (2) side and Cu sheet material (1) vacuum brazing of upper and lower laminating with it, form the soldering and sealing to inner W/Cu sheet material (2);
Step 2: the slab of the three ply board material welded is placed in high temperature insostatic pressing (HIP) stove and carries out high temperature insostatic pressing (HIP), obtains surface by the Cu-W/Cu-Cu composite board of copper clad;
Step 3: the clout around excision Cu-W/Cu-Cu composite board, side makes the W/Cu sheet material (2) in Cu-W/Cu-Cu composite board intermediate layer come out, then machined is carried out to the upper and lower surface of Cu-W/Cu-Cu composite board smooth, and split by finished size, obtain final products after surface treatment.
2. the method preparing Cu-W/Cu-Cu composite board according to claim 1, is characterized in that: the solder of the connection gap filling of three ply board material is BNi2.
3. the method preparing Cu-W/Cu-Cu composite board according to claim 1, is characterized in that: Cu sheet material (1) and Cu skin (3) are made for oxygenless copper material.
4. the method preparing Cu-W/Cu-Cu composite board according to claim 1, it is characterized in that: the thickness that Cu sheet material (1) is 1: 1 ~ 3, Cu-W/Cu-Cu composite board final products with the Thickness Ratio of W/Cu sheet material (2) is 1.5mm ~ 50mm.
5. the method preparing Cu-W/Cu-Cu composite board according to claim 1, is characterized in that: in W/Cu sheet material (2), the percentage by volume of Cu is 30% ~ 70%.
6. the method preparing Cu-W/Cu-Cu composite board according to claim 1, is characterized in that: the heating-up temperature of the high temperature insostatic pressing (HIP) described in step 2 is 850 DEG C ~ 960 DEG C, and pressure is 120 ~ 200MPa, and the time is 2 ~ 4h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410777736.XA CN104625623A (en) | 2014-12-15 | 2014-12-15 | Cu-W/Cu-Cu composite board preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410777736.XA CN104625623A (en) | 2014-12-15 | 2014-12-15 | Cu-W/Cu-Cu composite board preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104625623A true CN104625623A (en) | 2015-05-20 |
Family
ID=53205101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410777736.XA Pending CN104625623A (en) | 2014-12-15 | 2014-12-15 | Cu-W/Cu-Cu composite board preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104625623A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108067621A (en) * | 2016-11-15 | 2018-05-25 | 核工业西南物理研究院 | Copper chromium zirconium-stainless steel explosion weldering composite plate linkage interface hot isostatic pressing restorative procedure |
| CN109822248A (en) * | 2019-02-28 | 2019-05-31 | 华中科技大学 | A kind of hot isostatic pressing for thin-wall construction-soldering combined shaping method |
| CN112872573A (en) * | 2021-01-19 | 2021-06-01 | 西部金属材料股份有限公司 | Large-specification metal blank containing easily segregated elements, super-large-specification metal blank and preparation method and application thereof |
| CN114160949A (en) * | 2021-12-24 | 2022-03-11 | 安徽宝泰特种材料有限公司 | Preparation method of tungsten copper-copper explosive welding composite board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4950554A (en) * | 1989-05-30 | 1990-08-21 | Amax Inc. | Composite copper-molybdenum sheet |
| US4957823A (en) * | 1989-05-30 | 1990-09-18 | Amax Inc. | Composite sheet made of molybdenum and dispersion-strengthened copper |
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| CN102794612A (en) * | 2012-08-25 | 2012-11-28 | 安泰科技股份有限公司 | Preparation method of W/Cu composite component |
| CN103057202A (en) * | 2013-01-05 | 2013-04-24 | 江苏鼎启科技有限公司 | Lamination-structured heat sink material and preparation method |
| CN103264219A (en) * | 2013-06-04 | 2013-08-28 | 成都国光电气股份有限公司 | Manufacturing method of composite metal material |
-
2014
- 2014-12-15 CN CN201410777736.XA patent/CN104625623A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4950554A (en) * | 1989-05-30 | 1990-08-21 | Amax Inc. | Composite copper-molybdenum sheet |
| US4957823A (en) * | 1989-05-30 | 1990-09-18 | Amax Inc. | Composite sheet made of molybdenum and dispersion-strengthened copper |
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| CN102794612A (en) * | 2012-08-25 | 2012-11-28 | 安泰科技股份有限公司 | Preparation method of W/Cu composite component |
| CN103057202A (en) * | 2013-01-05 | 2013-04-24 | 江苏鼎启科技有限公司 | Lamination-structured heat sink material and preparation method |
| CN103264219A (en) * | 2013-06-04 | 2013-08-28 | 成都国光电气股份有限公司 | Manufacturing method of composite metal material |
Non-Patent Citations (1)
| Title |
|---|
| 肖阳等: "Cu/WCu/Cu复合薄板的组织和性能研究", 《稀有金属材料与工程》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108067621A (en) * | 2016-11-15 | 2018-05-25 | 核工业西南物理研究院 | Copper chromium zirconium-stainless steel explosion weldering composite plate linkage interface hot isostatic pressing restorative procedure |
| CN109822248A (en) * | 2019-02-28 | 2019-05-31 | 华中科技大学 | A kind of hot isostatic pressing for thin-wall construction-soldering combined shaping method |
| CN112872573A (en) * | 2021-01-19 | 2021-06-01 | 西部金属材料股份有限公司 | Large-specification metal blank containing easily segregated elements, super-large-specification metal blank and preparation method and application thereof |
| CN114160949A (en) * | 2021-12-24 | 2022-03-11 | 安徽宝泰特种材料有限公司 | Preparation method of tungsten copper-copper explosive welding composite board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6028987B2 (en) | Heat dissipation substrate and method for manufacturing the heat dissipation substrate | |
| JP5698947B2 (en) | Heat sink for electronic device and method for manufacturing the same | |
| CN104858435B (en) | Method for preparing sandwich structure diamond-Al composite material | |
| CN104625623A (en) | Cu-W/Cu-Cu composite board preparation method | |
| CN102941702B (en) | Infiltration preparation method of Cu-MoCu-Cu three-layer composite plate | |
| CN102574361B (en) | Laminate and manufacture method thereof | |
| JPWO2016035796A1 (en) | Heat dissipation member and method for manufacturing heat dissipation member | |
| CN110763059B (en) | Ultrathin uniform temperature plate and manufacturing method thereof | |
| CN103934534B (en) | The vacuum welding method of a kind of thick film substrate and power shell | |
| CN106041350B (en) | tungsten/copper or tungsten/steel joint and preparation method thereof | |
| CN102169839B (en) | Method for packaging preforming sheet by using Au-Sn solder | |
| CN205303452U (en) | Heat sink material of diamond copper | |
| CN103441077A (en) | Method for manufacturing shell of microwave high-power pipe | |
| CN106476395B (en) | A kind of fast preparation method of titanium copper layered electrode composite material | |
| CN104708192A (en) | Diffusion welding method for W-Ti alloy target assembly | |
| CN106270889A (en) | A kind of add the method that TC4 and Ceramic brazing performance are improved in foam copper intermediate layer | |
| JP2012091975A (en) | Method for manufacturing joined body of ceramic material and metallic material | |
| CN107004654A (en) | The manufacture method of heat-radiating substrate and the heat-radiating substrate | |
| CN114284857B (en) | Method for integrating secondary heat sink and liquid cooling heat sink, integrated heat sink and application | |
| CN107946248A (en) | A kind of ceramic contact pin shell mechanism and its manufacture method | |
| WO2021040030A1 (en) | Heat dissipation plate, semiconductor package and semiconductor module | |
| CN103057202A (en) | Lamination-structured heat sink material and preparation method | |
| CN104014921A (en) | Method for rapidly preparing copper-molybdenum multi-layer composite material | |
| CN103706797B (en) | The preparation method of broad-width multi-layer Cu-CuMo70-Cu composite | |
| CN109226951A (en) | The connection method of titanium alloy precision complex structural member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150520 |