CN105529311A - Parallel seam welding alloy cover plate for package of integrated circuit and fabrication method of parallel seam welding alloy cover plate - Google Patents
Parallel seam welding alloy cover plate for package of integrated circuit and fabrication method of parallel seam welding alloy cover plate Download PDFInfo
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- CN105529311A CN105529311A CN201610016770.4A CN201610016770A CN105529311A CN 105529311 A CN105529311 A CN 105529311A CN 201610016770 A CN201610016770 A CN 201610016770A CN 105529311 A CN105529311 A CN 105529311A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention relates to a parallel seam welding alloy cover plate for package of an integrated circuit and a fabrication method of the parallel seam welding alloy cover plate. The parallel seam welding alloy cover plate comprises an alloy cover plate body and is characterized in that a first nickel electroplating layer and a second nickel electroplating layer are respectively formed on the outer surfaces of a front surface and a side surface of the alloy cover plate body, and a chemical nickel plating layer is formed on the outer surface of a back surface of the alloy cover plate body. The fabrication method of the parallel seam welding alloy for package of the integrated circuit comprises the following steps of coating the front surface of the alloy cover plate with a first plating resistant coating layer; carrying out chemical nickel plating on the back surface of the alloy cover plate to form the chemical nickel plating layer; removing the first plating resistant layer; coating the surface of the chemical nickel plating layer with a second plating resistant layer; cutting the alloy cover plate into a single alloy cover plate; forming the first nickel electroplating layer and the second nickel electroplating layer on the front surface and the side surface of the single alloy cover plate; and removing the second plating resistant layer on the surface of the chemical nickel plating layer. With the structures of different plating layers on the front surface and the back surface, the high-reliability requirement for device package by applying a parallel seam welding sealing process is met.
Description
Technical field
Parallel seam welding alloy cover plate that the present invention relates to a kind of integrated antenna package and preparation method thereof, especially a kind of cover plate of the level Hermetic Package for pottery, metal shell, belongs to ic manufacturing technology field.
Background technology
Parallel seam welding is a kind of important cover plate for sealing technology of highly reliable integrated circuit level Hermetic Package.This technology utilizes the principle of electric resistance welding, and the heat produced by circular electrode makes the coating of cover plate reverse side melt, realize cover plate with pottery or metal shell sealing ring between weld.This welding belongs to local welding, welding current by electrode and cover plate contact position, cover plate and sealing ring contact position time produce enough heats, the coating of two contact positions is melted.
Common parallel seam welding alloy cover plate adopts nickel as overlay coating, for avoiding the too high impact on the circuit chip in package casing, device of temperature in welding process, and the nickel chemical plating technology that general employing fusing point is lower.In the process, the weight ratio of the phosphorus mixed in chemical nickel-plating liquid is generally between 8% ~ 12%, and the fusing point of its coating is 880 DEG C.In parallel seam welding, during by controlling fusing point that the size of welding current makes the temperature of cover plate and sealing ring contact position higher than chemical Ni-plating layer, seal welding therebetween can be realized.
For ensureing good sealing property, the temperature of normal conditions lower cover and sealing ring contact position is even higher at 1000 DEG C.Higher temperature will contribute to the qualification rate of parallel seam welding sealing technology, but when temperature is too high, overlay coating fusing too fully makes its protective effect as overlay coating weaken on the contrary, and the chance that bottom metal exposes is larger.Basis material due to parallel seam welding alloy cover plate is iron containing alloy, once after ferro element exposure, the decay resistance of cover plate is degenerated, and this is also adopt the encapsulating products of parallel seam welding sealing technology carrying out often occurring in salt mist test the basic reason that corrosion was lost efficacy.
What conventional parallel seam welding alloy cover plate adopted is that overall chemical nickel plating technology forms plated surface nickel dam, its positive and negative coating structure is consistent, although coating fusing point is not high, but because in parallel seam welding process, front still defines overlapping solder joint, when parallel seam welding electric current is higher, be difficult to the exposure of the ferro element avoided in coating base substrate, the corrosion Problem of Failure therefore in salt mist test happens occasionally, and brings hidden danger to the reliability in circuit application.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, parallel seam welding alloy cover plate that a kind of integrated antenna package is provided and preparation method thereof, improve the salt spray corrosion resistance of parallel seam welding alloy cover plate, by the different coating structure of positive and negative, meet the high reliability request adopting parallel seam welding sealing technology packaging.
According to technical scheme provided by the invention, a kind of parallel seam welding alloy cover plate of integrated antenna package, comprise alloy cover board body, feature is: the outer surface in described alloy cover board body front forms the first electroless nickel layer, the side exterior surface of alloy cover board body forms the second electroless nickel layer, and the opposite exterior surface of alloy cover board body forms chemical Ni-plating layer.
Further, at the opposite exterior surface of described alloy cover board body, there is mark.
Further, the thickness of described first electroless nickel layer and the second electroless nickel layer is 2 μm ~ 8.89 μm.
Further, the thickness of described chemical Ni-plating layer is 2 μm ~ 8.89 μm.
Further, described first electroless nickel layer and the second electroless nickel layer are high purity nickel, and fusing point is 1455 DEG C.
Further, described chemical Ni-plating layer is nickel-phosphorus alloy, and fusing point is 880 DEG C.
Further, in described nickel-phosphorus alloy, the weight ratio of phosphorus is 8% ~ 12%.
Further, described alloy cover board body adopts Covar cover plate or iron-nickel alloy cover plate.
The preparation method of the parallel seam welding alloy cover plate of described integrated antenna package, feature is, comprises the following steps:
Step one: alloy plate sheet material, after cleaning, hinders plating coating in front surface coated first, carries out drying to the first resistance plating coating;
Step 2: carry out chemical nickel plating at the reverse side of alloy plate sheet material, forms chemical Ni-plating layer;
Step 3: remove the first resistance plating coating, cleans after removing the first resistance plating coating;
Step 4: hinder plating coating in the surface-coated second of chemical Ni-plating layer, carries out drying to the second resistance plating coating;
Step 5: alloy cover plate plate cutting is become single alloy cover plate, carries out deburring process to single alloy cover plate after cutting;
Step 6: electronickelling is carried out to single alloy cover plate, in the front of alloy cover plate, side forms the first electroless nickel layer and the second electroless nickel layer;
Step 7: the second resistance plating coating removing chemical Ni-plating layer surface, completes alloy cover plate and make after cleaning.
Further, also comprised before step 2 makes chemical Ni-plating layer: form mark at the reverse side of alloy plate sheet material by laser.
The present invention has the following advantages:
(1) compared with existing parallel seam welding nickel plating cover plate, the present invention can obtain identical sealing effectiveness without the need to increasing welding current;
(2) compared with existing parallel seam welding nickel plating cover plate, alloy cover plate of the present invention has better salt spray corrosion resistance, can meet the salt mist environment application demand that integrated circuit (IC) products is harsher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the parallel seam welding alloy cover plate of integrated antenna package of the present invention.
Fig. 2-1 ~ Fig. 2-8 is the preparation process schematic diagram of the parallel seam welding alloy cover plate of integrated antenna package of the present invention, wherein:
Fig. 2-1 is the schematic diagram hindering plating coating in alloy plate sheet material front surface coated first.
Fig. 2-2 is the schematic diagram making mark at alloy plate sheet material reverse side.
Fig. 2-3 is the schematic diagram making chemical Ni-plating layer at alloy plate sheet material reverse side.
Fig. 2-4 is the schematic diagram that removal first hinders plating coating.
Fig. 2-5 is the schematic diagram hindering plating coating in chemical Ni-plating layer surface-coated second.
Fig. 2-6 is schematic diagram alloy cover plate plate cutting being become single alloy cover plate.
Fig. 2-7 is the schematic diagram of making first electroless nickel layer and the second electroless nickel layer.
Fig. 2-8 is the schematic diagram that removal second hinders plating coating.
Number in the figure: alloy cover board body 1, first electroless nickel layer 2, second electroless nickel layer 3, chemical Ni-plating layer 4, mark 5, the first resistance plating coating 30, second hinder plating coating 40.
Embodiment
Below in conjunction with concrete accompanying drawing, the invention will be further described.
As shown in Figure 1, the parallel seam welding alloy cover plate of integrated antenna package of the present invention, comprise alloy cover board body 1, the outer surface in this alloy cover board body 1 front adopts electroplating technology to form the first electroless nickel layer 2, the side exterior surface of this alloy cover board body 1 adopts electroplating technology to form the second electroless nickel layer 3, the opposite exterior surface of this alloy cover board body 1 adopts chemical plating process to form chemical Ni-plating layer 4, thus forms the alloy covers plate structure that has the different coating structure of positive and negative surface employing; The reverse side of described alloy cover board body 1 is solder side, adopt laser marking technique to form the mark 5 of a round dot or other shapes in centre position or other positions at the opposite exterior surface of alloy cover board body 1, this mark 5 is for distinguishing the obverse and reverse of alloy cover plate.
Described first electroless nickel layer 2 and the second electroless nickel layer 3 are high purity nickel, and fusing point is higher, is 1455 DEG C.
Described chemical Ni-plating layer 4 is nickel-phosphorus alloy, and wherein the weight ratio of phosphorus is 8% ~ 12%, and fusing point is much lower compared with electronickelling, is 880 DEG C.
Described alloy cover board body 1 adopts Covar cover plate or iron-nickel alloy cover plate.
The preparation method of the parallel seam welding alloy cover plate of said integrated circuit encapsulation, comprises the following steps:
Step one: as shown in Fig. 2-1, without the alloy plate sheet material cut after cleaning, hinders plating coating 30 in front surface coated first, carries out drying to the first resistance plating coating 30, and the first resistance plating coating 30 can adopt existing paint resistance coating or resistance plating glue etc.;
Step 2: as shown in Fig. 2-2, forms the mark 5 of round point shape or other shapes by laser in the reverse side centre position (or other positions) of alloy plate sheet material according to the size of the alloy cover plate of required production;
Step 3: as Figure 2-3, adopts standard chemical nickel plating technology to carry out chemical nickel plating at the reverse side of alloy plate sheet material, forms the chemical Ni-plating layer 4 that thickness is 2 μm ~ 8.89 μm;
Step 4: as in Figure 2-4, adopts releasing process to remove the first resistance plating coating 30, fully cleans after removing the first resistance plating coating 30;
Step 5: as shown in Figure 2-5, hinders plating coating 40 in the surface-coated second of chemical Ni-plating layer 4, carries out drying to the second resistance plating coating 40;
Step 6: as shown in figures 2-6, alloy cover plate plate cutting is become single alloy cover plate by the size according to the alloy cover plate of required production, carries out deburring process after cutting to single alloy cover plate;
Step 7: as illustrated in figs. 2-7, adopts standard plating processes to carry out electronickelling to the single alloy cover plate cut, and in the front of alloy cover plate, to form thickness be first electroless nickel layer 2 and second electroless nickel layer 3 of 2 μm ~ 8.89 μm in side;
Step 8: as illustrated in figs. 2 through 8, adopts releasing process to remove the second resistance plating coating 40 on chemical Ni-plating layer 4 surface, completes alloy cover plate and make after fully cleaning.
The parallel seam welding cover plate profile of alloy cover plate of the present invention and current standard is consistent, and not needing to change existing packaging technology in use procedure can normally use.Because cover plate outer surface and side have employed dystectic electroless nickel layer, parallel seam welding process outer surface commissure can not form obvious spot welds, be reduced to minimum to the destruction of the coating structure of outer surface, improvement can be played even avoid encapsulating the corrosion phenomenon of rear product in salt mist test, the requirement of highly reliable ceramic packaging for salt mist test can be met.
Claims (10)
1. the parallel seam welding alloy cover plate of an integrated antenna package, comprise alloy cover board body (1), it is characterized in that: the outer surface in described alloy cover board body (1) front forms the first electroless nickel layer (2), the side exterior surface of alloy cover board body (1) forms the second electroless nickel layer (3), and the opposite exterior surface of alloy cover board body (1) forms chemical Ni-plating layer (4).
2. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 1, is characterized in that: have mark (5) at the opposite exterior surface of described alloy cover board body (1).
3. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 1, is characterized in that: the thickness of described first electroless nickel layer (2) and the second electroless nickel layer (3) is 2 μm ~ 8.89 μm.
4. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 1, is characterized in that: the thickness of described chemical Ni-plating layer (4) is 2 μm ~ 8.89 μm.
5. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 1, is characterized in that: described first electroless nickel layer (2) and the second electroless nickel layer (3) are high purity nickel, and fusing point is 1455 DEG C.
6. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 1, it is characterized in that: described chemical Ni-plating layer (4) is nickel-phosphorus alloy, fusing point is 880 DEG C.
7. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 6, is characterized in that: in described nickel-phosphorus alloy, the weight ratio of phosphorus is 8% ~ 12%.
8. the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 1, is characterized in that: described alloy cover board body (1) adopts Covar cover plate or iron-nickel alloy cover plate.
9. a preparation method for the parallel seam welding alloy cover plate of integrated antenna package, is characterized in that, comprise the following steps:
Step one: alloy plate sheet material, after cleaning, hinders plating coating (30) in front surface coated first, carries out drying to the first resistance plating coating (30);
Step 2: carry out chemical nickel plating at the reverse side of alloy plate sheet material, forms chemical Ni-plating layer (4);
Step 3: remove the first resistance plating coating (30), cleans after removing the first resistance plating coating (30);
Step 4: hinder plating coating (40) in the surface-coated second of chemical Ni-plating layer (4), carries out drying to the second resistance plating coating (40);
Step 5: alloy cover plate plate cutting is become single alloy cover plate, carries out deburring process to single alloy cover plate after cutting;
Step 6: electronickelling is carried out to single alloy cover plate, in the front of alloy cover plate, side forms the first electroless nickel layer (2) and the second electroless nickel layer (3);
Step 7: second resistance plating coating (40) of removing chemical Ni-plating layer (4) surface, completes alloy cover plate and make after cleaning.
10. the preparation method of the parallel seam welding alloy cover plate of integrated antenna package as claimed in claim 9, is characterized in that: also comprised before step 2 makes chemical Ni-plating layer (4): form mark (5) at the reverse side of alloy plate sheet material by laser.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610016770.4A CN105529311B (en) | 2016-01-11 | 2016-01-11 | Parallel seam welding alloy cover plate of integrated antenna package and preparation method thereof |
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| CN201610016770.4A CN105529311B (en) | 2016-01-11 | 2016-01-11 | Parallel seam welding alloy cover plate of integrated antenna package and preparation method thereof |
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| CN105529311B CN105529311B (en) | 2018-02-23 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846643A (en) * | 2019-11-22 | 2020-02-28 | 中国电子科技集团公司第五十八研究所 | Method for enhancing reliability of parallel seam welding packaging salt fog |
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977362A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Salt-fog-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
| CN113707617A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | High-reliability parallel seam welding alloy cover plate and preparation method thereof |
| CN113707618A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | Salt-spray-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110846643A (en) * | 2019-11-22 | 2020-02-28 | 中国电子科技集团公司第五十八研究所 | Method for enhancing reliability of parallel seam welding packaging salt fog |
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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| CN110977361B (en) * | 2019-12-26 | 2024-05-03 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977362B (en) * | 2019-12-26 | 2024-05-07 | 中国电子科技集团公司第五十八研究所 | Salt spray corrosion resistant parallel seam welding alloy cover plate and preparation method thereof |
| CN113707617A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | High-reliability parallel seam welding alloy cover plate and preparation method thereof |
| CN113707618A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | Salt-spray-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
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| CN105529311B (en) | 2018-02-23 |
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