CN101635282A - SMD metal cover plate - Google Patents
SMD metal cover plate Download PDFInfo
- Publication number
- CN101635282A CN101635282A CN200910183882A CN200910183882A CN101635282A CN 101635282 A CN101635282 A CN 101635282A CN 200910183882 A CN200910183882 A CN 200910183882A CN 200910183882 A CN200910183882 A CN 200910183882A CN 101635282 A CN101635282 A CN 101635282A
- Authority
- CN
- China
- Prior art keywords
- plate body
- metal cover
- protective layer
- smd metal
- cover board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an SMD metal cover plate which comprises a plate body (1), wherein the surface of the plate body (1) is coated with a nickel plated protective layer (2). The surface of the plate body is provided with the nickel plated protective layer, therefore, the invention can reduce the manufacture cost and a melting point during seal welding, have higher corrosion resistance, prevent a phenomenon of generating air bubbles, delamination and decrustation and improve the reliability during seal welding, thereby improving the stability during working.
Description
Technical field
The present invention relates to a kind of SMD metal cover board.
Background technology
SMD metal cover board in the market is the cost of manufacture height not only, and poor corrosion resistance, and the poor reliability of soldering and sealing when welding cause crystal chip soldering and sealing back job stability on this metal cover board to reduce greatly.
Summary of the invention
The invention provides a kind of SMD metal cover board, not only cost of manufacture is low for it, and can improve job stability.
The present invention has adopted following technical scheme: a kind of SMD metal cover board, it comprises plate body, scribbles the nickel plating protective layer on the surface of plate body.
Described plate body is an iron-nickel alloy sheet material.Described nickel plating protective layer is for being the nickel-phosphorus alloy protective layer.The thickness of described plate body is 0.08-0.2mm.
The present invention has following beneficial effect: the surface of plate body of the present invention is provided with the nickel plating protective layer; so not only can reduce cost of manufacture; corrosion resistance is more intense; avoid occurring the phenomenon of bubble, layering and decortication; and the reliability can improve soldering and sealing the time; fusing point when reducing soldering and sealing, thereby the stability when improving work.
Description of drawings
Fig. 1 is a structural representation of the present invention
Embodiment
In Fig. 1, the present invention is a kind of SMD metal cover board, and it comprises plate body 1, and the thickness of plate body 1 is 0.08-0.2mm, and plate body 1 is an iron-nickel alloy sheet material, scribbles nickel plating protective layer 2 on the surface of plate body 1, and nickel plating protective layer 2 is for being the nickel-phosphorus alloy protective layer.
Claims (4)
1, a kind of SMD metal cover board is characterized in that it comprises plate body (1), scribbles nickel plating protective layer (2) on the surface of plate body (1).
2, SMD metal cover board according to claim 1 is characterized in that described plate body (1) is an iron-nickel alloy sheet material.
3, SMD metal cover board according to claim 1 is characterized in that described nickel plating protective layer (2) is for being the nickel-phosphorus alloy protective layer.
4, SMD metal cover board according to claim 1, the thickness that it is characterized in that described plate body (1) is 0.08-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910183882A CN101635282A (en) | 2009-08-04 | 2009-08-04 | SMD metal cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910183882A CN101635282A (en) | 2009-08-04 | 2009-08-04 | SMD metal cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101635282A true CN101635282A (en) | 2010-01-27 |
Family
ID=41594411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910183882A Pending CN101635282A (en) | 2009-08-04 | 2009-08-04 | SMD metal cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101635282A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529311A (en) * | 2016-01-11 | 2016-04-27 | 无锡中微高科电子有限公司 | Parallel seam welding alloy cover plate for package of integrated circuit and fabrication method of parallel seam welding alloy cover plate |
-
2009
- 2009-08-04 CN CN200910183882A patent/CN101635282A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529311A (en) * | 2016-01-11 | 2016-04-27 | 无锡中微高科电子有限公司 | Parallel seam welding alloy cover plate for package of integrated circuit and fabrication method of parallel seam welding alloy cover plate |
| CN105529311B (en) * | 2016-01-11 | 2018-02-23 | 无锡中微高科电子有限公司 | Parallel seam welding alloy cover plate of integrated antenna package and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103736729B (en) | The method of metal clad plate strip is prepared in a kind of rolling | |
| CN101790286B (en) | Hole machining process | |
| CN101635282A (en) | SMD metal cover plate | |
| CN201478291U (en) | SMD metal cover board | |
| CN210959013U (en) | Flexible printed circuit board | |
| CN202425197U (en) | Thick gold and immersion gold combined battery protective circuit board | |
| CN204994089U (en) | Biological identification module through realization of solid -state glue bond | |
| CN205428622U (en) | Metallization ferrocart core magnetic core and paster inductance | |
| MY138109A (en) | Electronic part and surface treatment method of the same | |
| JP2009295705A (en) | Flexible printed circuit and method of manufacturing the same | |
| CN202425199U (en) | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) | |
| CN201960236U (en) | Copper brazing graphite electrode | |
| CN2782225Y (en) | High efficiency, low energy consumption mini atomizing sheet | |
| CN202199941U (en) | Welding knife for directly welding aluminium-in-copper enamelled wire | |
| CN106650627B (en) | Biological recognition module mounting structure and mounting method thereof | |
| CN201745222U (en) | Titanium-palladium composite material plate | |
| TW200745247A (en) | Material for electronic part for high-frequency use and electronic part for high-frequency use comprising the material | |
| CN114850646B (en) | Resistance welding method between hard alloy sheet and metal matrix | |
| CN101856896A (en) | Metallic high polymer shell | |
| CN103140015A (en) | Rigid-flexible circuit board | |
| CN201751545U (en) | Aqueous layer non-soldering-terminal assembly structure of engine oil cooler | |
| CN202425185U (en) | Novel LED circuit board | |
| CN205755092U (en) | A kind of positioning carrier of the laminate for surface mount process | |
| CN201805640U (en) | Windowing structure for pressed dry film of golden finger of module board before gold plating | |
| CN103831544A (en) | Copper alloy solder strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100127 |