CN202425199U - Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) - Google Patents
Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) Download PDFInfo
- Publication number
- CN202425199U CN202425199U CN2012200136436U CN201220013643U CN202425199U CN 202425199 U CN202425199 U CN 202425199U CN 2012200136436 U CN2012200136436 U CN 2012200136436U CN 201220013643 U CN201220013643 U CN 201220013643U CN 202425199 U CN202425199 U CN 202425199U
- Authority
- CN
- China
- Prior art keywords
- battery protection
- thick gold
- osp
- circuit board
- protection circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP). An anti-oxidation film is respectively arranged on a pad of the battery protection circuit board, which is required to be welded; and a nickel-plated layer and a thick gold plated layer are sequentially arranged on a golden finger of the battery protection circuit board. The test pad of the battery protection circuit board is sequentially provided with the nickel-plated layer and the thick gold plated layer. The battery protection circuit board has the advantage of oxidation prevention, and the golden finger and the test pad have abrasion-resistant properties.
Description
Technical field
The utility model belongs to the wiring board technical field, relates to the battery protection wiring board that a kind of thick gold combines with OSP.
Background technology
The existing thickness of electroplating common golden battery protection circuit board gold finger is about 0.02UM; And the golden finger zone of battery protecting plate is the direct contact point of battery of mobile phone and mobile phone, charger; So often friction; Common gold-plated with other metal direct friction after the gold layer can come off, and can not cross salt fog and nitric acid experiment.Along with people's develops light, thin, weak point, miniaturization, the multifunction direction of electronic product; Printed wiring board develops towards high precision, slimming, multiple stratification, aperture direction, and the common golden battery protection wiring board of existing plating can't satisfy the requirement of technology.
The utility model content
The utility model technical problem to be solved is the deficiency that overcomes prior art; The battery protection wiring board that provides a kind of thick gold to combine with OSP; The battery protection wiring board that this thick gold combines with OSP has anti-oxidation advantage, and golden finger and testing weld pad have antiwear characteristic.
The technical solution of utility model is following:
The battery protection wiring board that a kind of thick gold combines with OSP all is provided with oxidation-resistant film on the pad of the needs of battery protection wiring board welding; On the golden finger of battery protection wiring board, be provided with nickel coating and the thick gold layer of plating successively.
On the testing weld pad of battery protection wiring board, be provided with nickel coating and the thick gold layer of plating successively.
Thick gold is the Essential Terms of wiring board technical field, and OSP is an oxidation-resistant film.
Beneficial effect:
The battery protection wiring board that this practical thick gold combines with OSP, owing to adopt thick gold and OSP combination, thereby the battery protection wiring board that this thick gold combines with OSP has anti-oxidation advantage, and golden finger and testing weld pad have antiwear characteristic.
Description of drawings
Fig. 1 is the solder side sketch map of the battery protection wiring board that combines with OSP of the thick gold of the utility model;
Fig. 2 is the cross-sectional view that needs the welding disking area of welding;
Fig. 3 is the golden finger exposed face sketch map of the battery protection wiring board that combines with OSP of the thick gold of the utility model.
Fig. 4 is the cross-sectional view in golden finger and testing weld pad zone;
Label declaration: 1-battery protection wiring board, 2-golden finger and testing weld pad zone, the welding disking area that 3-need weld; The 31-oxidation-resistant film, the copper layer of the welding disking area that 32-need weld, the thick gold layer of 21-plating; The 22-nickel coating, the copper layer in 23-golden finger and testing weld pad zone.
Embodiment
Below will combine accompanying drawing and specific embodiment that the utility model is explained further details:
Shown in Fig. 1-4, the battery protection wiring board that a kind of thick gold combines with OSP all is provided with oxidation-resistant film on the pad of the needs of battery protection wiring board welding; On the golden finger of battery protection wiring board, be provided with nickel coating and the thick gold layer of plating successively.On the testing weld pad of battery protection wiring board, be provided with nickel coating and the thick gold layer of plating successively.
The characteristic hardness of the hard thick gold of the utility model utilization reaches and is prone to the problem of coming off after Luo Shi 137 degree, Webster 83 degree and 0.5um gold thick wear-resisting power of test standard testing 4500 dew nickel (general standard is 1000 times) improve the common gold friction of plating.Utilize the anti-oxidation of characteristic of OSP, OSP is exactly on the naked copper surface of cleaning, grows the organic epithelium of one deck (OSP is a prior art) with the method for chemistry.This tunic has anti-oxidation, heat shock resistance, and moisture-proof no longer continues get rusty (oxidation or sulfuration etc.) in order to protection copper surface in normal environment; In follow-up welding high temperature, this kind diaphragm is easy to removed rapidly by scaling powder institute, can make the clean copper surface of exposing be able in the extremely short time, be combined into firm solder joint immediately with fusion scolding tin, and compliance with environmental protection requirements.
Claims (2)
1. battery protection wiring board that thick gold combines with OSP, its spy is, on the pad of the needs welding of battery protection wiring board, oxidation-resistant film is set all; On the golden finger of battery protection wiring board, be provided with nickel coating and the thick gold layer of plating successively.
2. the battery protection wiring board that thick gold according to claim 1 combines with OSP, its spy is, on the testing weld pad of battery protection wiring board, is provided with nickel coating and the thick gold layer of plating successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200136436U CN202425199U (en) | 2012-01-12 | 2012-01-12 | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200136436U CN202425199U (en) | 2012-01-12 | 2012-01-12 | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425199U true CN202425199U (en) | 2012-09-05 |
Family
ID=46749918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200136436U Expired - Lifetime CN202425199U (en) | 2012-01-12 | 2012-01-12 | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425199U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066270A (en) * | 2014-07-02 | 2014-09-24 | 三星半导体(中国)研究开发有限公司 | Surface coating used for circuit board, pad and circuit board |
| US9504152B2 (en) | 2014-07-02 | 2016-11-22 | Samsung Electronics Co., Ltd. | Printed circuit board for semiconductor package |
| WO2022048011A1 (en) * | 2020-09-03 | 2022-03-10 | Tcl华星光电技术有限公司 | Light-emitting panel and manufacturing method therefor, and display panel |
-
2012
- 2012-01-12 CN CN2012200136436U patent/CN202425199U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066270A (en) * | 2014-07-02 | 2014-09-24 | 三星半导体(中国)研究开发有限公司 | Surface coating used for circuit board, pad and circuit board |
| US9504152B2 (en) | 2014-07-02 | 2016-11-22 | Samsung Electronics Co., Ltd. | Printed circuit board for semiconductor package |
| WO2022048011A1 (en) * | 2020-09-03 | 2022-03-10 | Tcl华星光电技术有限公司 | Light-emitting panel and manufacturing method therefor, and display panel |
| US11817461B2 (en) | 2020-09-03 | 2023-11-14 | Tcl China Star Optoelectronics Technology Co., Ltd. | Light-emitting panel, method manufacturing the same, and display device having the same with connection portion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |