CN212324650U - Shielding piece, PCB and electronic equipment - Google Patents
Shielding piece, PCB and electronic equipment Download PDFInfo
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- CN212324650U CN212324650U CN202020964124.2U CN202020964124U CN212324650U CN 212324650 U CN212324650 U CN 212324650U CN 202020964124 U CN202020964124 U CN 202020964124U CN 212324650 U CN212324650 U CN 212324650U
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Abstract
The application discloses shielding piece, PCB board and electronic equipment belongs to consumer electronics technical field. The shielding piece comprises a copper alloy layer and an aluminum alloy layer, wherein the copper alloy layer is provided with a first surface and a second surface which are arranged oppositely; the aluminum alloy layer is provided with a third surface and a fourth surface which are arranged in an opposite way, the first surface of the copper alloy layer is connected with the third surface of the aluminum alloy layer through a heat conduction bonding layer, and the fourth surface of the aluminum alloy layer is provided with an electroplated layer; the first surface of the copper alloy layer is provided with a first adsorption structure, the third surface of the aluminum alloy layer is provided with a second adsorption structure, and the first adsorption structure is in adsorption connection with the second adsorption structure. Through carrying out the combination of range upon range of in proper order with copper alloy-layer, aluminium alloy layer and electroplated layer in the shield that this application embodiment provided, the set has played the advantage on each layer for whole shield possesses the quality and lighter, intensity is higher, the heat conductivility is outstanding and be convenient for with the characteristics of other device connections.
Description
Technical Field
The application belongs to the technical field of consumer electronics, and particularly relates to a shielding piece, a PCB and electronic equipment.
Background
With the development of science and technology, consumer electronic devices gradually move into thousands of households to become necessities of life of people. Among various consumer electronic devices, smart phones have become a bright star, and particularly, with the advent of the 5G era, smart phones have become typical representatives of consumer electronic devices. In recent years, new materials and new structures are applied to smart phones more and more widely, and with the progress of technology, consumers put forward more requirements on smart phones, such as the desire that the smart phones run faster, have lighter weight, better hand feeling, generate less heat, and the like. However, in contrast, as the operation speed of the mobile phone is increased, power consumption during operation of parts such as chips is increased, and thus, the amount of heat generated is increased. Most of electronic components of the current mobile phone are integrated on a mobile phone mainboard, the mobile phone mainboard becomes a main heat transfer and heat conduction structure of the components, and the structural parts on the mobile phone mainboard have general heat conduction capability and heavy mass, so that a scheme of a structural part with high heat conduction and ultra-light weight is sought to become a new direction of research in the industry in recent years.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present application is to provide a shielding element, a PCB and an electronic device, so as to provide a structural member with light weight and strong heat conductivity.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a shield, which includes:
the copper alloy layer is provided with a first surface and a second surface which are arranged oppositely;
the first surface of the copper alloy layer is connected with the third surface of the aluminum alloy layer through a heat conduction bonding layer, and the fourth surface of the aluminum alloy layer is provided with an electroplated layer;
the first surface of the copper alloy layer is provided with a first adsorption structure, the third surface of the aluminum alloy layer is provided with a second adsorption structure, and the first adsorption structure is in adsorption connection with the second adsorption structure.
In a second aspect, an embodiment of the present application provides a PCB board, which includes the shielding element according to the first aspect and a substrate, wherein the copper alloy layer of the shielding element is connected to the substrate.
In a third aspect, an embodiment of the present application provides an electronic device, which includes the PCB board as described in the second aspect.
The technical scheme adopted by the application can achieve the following beneficial effects:
through carrying out the combination of range upon range of in proper order with copper alloy-layer, aluminium alloy layer and electroplated layer in the shield that this application embodiment provided, the set has played the advantage on each layer for whole shield possesses the quality and lighter, intensity is higher, the heat conductivility is outstanding and be convenient for with the characteristics of other device connections.
Drawings
Fig. 1 is a schematic structural diagram of a shielding member according to an embodiment of the present application;
FIG. 2 is an enlarged schematic view of a copper alloy layer and an aluminum alloy layer of a shield according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a PCB provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The shielding member, the PCB and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
The embodiment of the present application provides a shielding member, which is shown in fig. 1 and includes a copper alloy layer 101 and an aluminum alloy layer 103; the copper alloy layer 101 has a first surface and a second surface which are arranged oppositely; the aluminum alloy layer 103 is provided with a third surface and a fourth surface which are arranged oppositely; the first surface of the copper alloy layer 101 is connected with the third surface of the aluminum alloy layer 103 through a heat conducting bonding layer 102; an electroplated layer is arranged on the fourth surface of the aluminum alloy layer 103; the first surface of the copper alloy layer 101 is provided with a first adsorption structure, the third surface of the aluminum alloy layer 103 is provided with a second adsorption structure, and the first adsorption structure is connected with the second adsorption structure in an adsorption manner.
The shielding member provided by the embodiment of the present application is provided with several sub-layers, i.e., the copper alloy layer 101, the aluminum alloy layer 103, and the plating layer, which are sequentially stacked and combined, in order to integrate the advantages of each sub-layer. The copper alloy layer 101 has excellent soldering performance, and the whole shielding piece is convenient to be connected to a main board of electronic equipment; the aluminum alloy layer 103 has excellent heat conductivity, and the aluminum alloy layer 103 has low density and high strength, so that the shielding part can realize light weight and strong heat conduction effect; the provision of the plating allows the shield to be connected to other components of the electronic device. To sum up, the shielding piece that this application embodiment provided is through carrying out range upon range of combination in proper order with copper alloy layer 101, aluminum alloy layer 103 and electroplated layer, and the set has played the advantage on each layer for whole shielding piece possesses the quality and is lighter, intensity is higher, the heat conductivility is outstanding and be convenient for with the characteristics of other device connections. In addition, since the first adsorption structure is provided on the first surface of the copper alloy layer 101, the second adsorption structure is provided on the third surface of the aluminum alloy layer 103, and the first adsorption structure and the second adsorption structure are connected by adsorption, the copper alloy layer 101 and the aluminum alloy layer 103 can be closely connected; in addition, since the heat conductive adhesive layer 102 is provided between the copper alloy layer 101 and the aluminum alloy layer 103, the firmness of the connection between the copper alloy layer 101 and the aluminum alloy layer 103 can be further improved, and the heat conductive performance between the two can also be improved.
Referring to fig. 2, in one embodiment, a first surface of the copper alloy layer 101 is provided with a plurality of first saw-tooth structures, and a third surface of the aluminum alloy layer 103 is provided with a plurality of second saw-tooth structures, wherein the first saw-tooth structures and the second saw-tooth structures are in mutual engagement connection.
In this embodiment, the first adsorption structure is specifically a plurality of first saw-tooth structures disposed on the first surface of the copper alloy layer 101; the second adsorption structure is specifically a plurality of second sawtooth structures arranged on the third surface of the aluminum alloy layer 103. Specifically, optionally, the first surface of the copper alloy layer 101 and the third surface of the aluminum alloy layer 103 are both subjected to surface wire drawing treatment, after the wire drawing treatment, a plurality of first sawtooth structures are formed on the first surface of the copper alloy layer 101, a plurality of second sawtooth structures are formed on the third surface of the aluminum alloy layer 103, the copper alloy layer 101 and the aluminum alloy layer 103 are combined through mutual meshing connection of the plurality of first sawtooth structures and the plurality of second sawtooth structures, and compared with connection of two smooth surfaces, the combination tightness of the copper alloy layer 101 and the aluminum alloy layer 103 can be effectively improved. Alternatively, a rolling process may be used to further increase the bonding tightness between the copper alloy layer 101 and the aluminum alloy layer 103, so that the copper alloy layer 101 and the aluminum alloy layer 103 are bonded more densely.
Referring to fig. 2, in one embodiment, the first saw tooth structure has a first angle and the second saw tooth structure has a second angle; the first angle is greater than the second angle, or the second angle is greater than the first angle.
Referring to fig. 2, specifically, alternatively, for example, the first angle θ 1 of the first saw-tooth structure may be set to 30 to 90 °, the second angle θ 2 of the second saw-tooth structure may be set to 40 to 90 °, and the second angle θ 2 is 5 to 10 ° larger than the first angle θ 1, so that the first saw-tooth structure and the second saw-tooth structure can be more tightly engaged with each other without a gap when the copper alloy layer 101 is combined with the aluminum alloy layer 103, thereby enhancing the coupling force between the copper alloy layer 101 and the aluminum alloy layer 103. Of course, the first angle θ 1 may be set to be larger than the second angle θ 2, for example, by 5 to 10 °, and the function of improving the connection force between the copper alloy layer 101 and the aluminum alloy layer 103 may be also performed.
Referring to fig. 1, in one embodiment, the copper alloy layer 101 has a first thickness and the aluminum alloy layer 103 has a second thickness, the first thickness being less than the second thickness.
The aluminum alloy has a small density and excellent heat conductivity, specifically, the density (g/cm) of the aluminum alloy3) 2.7 and a thermal conductivity (W/(m.K)) of 135; density (g/cm) of titanium alloy3) 4.51 and a thermal conductivity (W/(m.K)) of 15.2; density (g/cm) of stainless steel3) It was 7.93, and the thermal conductivity (W/(m.K)) was 16. Therefore, setting the thickness of the aluminum alloy layer 103 to be larger than that of the copper alloy layer 101 is advantageous in reducing the mass of the entire shield and ensuring a good heat conduction capability of the entire shield. For example, specifically alternatively, the thickness of the aluminum alloy layer 103 may be twice the thickness of the copper alloy layer 101. Specifically, the thickness of the whole shield may alternatively be 0.05-0.4 mm. Through reasonable design, the density (g/cm) of the whole shielding part can be ensured3) Around 4.25.
In one embodiment, the material of the copper alloy layer 101 includes cupronickel.
Specifically, the foreign white copper is one of zinc white copper, nickel white copper and nickel zinc white copper; the copper-nickel alloy has the characteristics of beautiful color, and excellent ductility, fatigue resistance and corrosion resistance. Particularly, the copper albedo has excellent soldering performance, and the shielding piece can be conveniently connected to a main board of the electronic equipment.
In one embodiment, the material of the thermally conductive adhesive layer 102 includes graphene.
The graphene has excellent heat conductivity, the adhesive is added into the graphene to form the heat-conducting bonding layer 102, so that the copper alloy layer 101 and the aluminum alloy layer 103 can be connected more tightly, the heat transfer capacity between the copper alloy layer 101 and the aluminum alloy layer 103 can be improved, the heat dissipation effect of the material can be improved by the graphene, and the heat conductivity coefficient of the connected copper alloy layer 101 and the connected aluminum alloy layer 103 is higher than that of a monomer material.
Referring to fig. 1, in one embodiment, the plating layer includes a nickel plating layer 104 and a tin plating layer 105, a fourth surface of the aluminum alloy layer 103 is bonded to the nickel plating layer 104, and the nickel plating layer 104 is bonded to the tin plating layer 105.
The electroplated nickel layer 104 is used as a surface priming layer of the aluminum alloy layer 103, so that the corrosion can be prevented, and the wear resistance, the gloss and the aesthetic degree can be increased. The tin-plated layer 105 has excellent solderability, making the shield easy to solder to other components in the electronic device.
Referring to fig. 3, an embodiment of the present application further provides a PCB, which includes the shielding member 1 and the substrate 3, wherein the copper alloy layer 101 of the shielding member 1 is connected to the substrate 3. In one embodiment, the copper alloy layer 101 is welded to the substrate 3 by soldering.
Referring to fig. 3, specifically, solder paste 2 is applied on the substrate 3 according to the shape and size of the shield 1, and SMT (surface mount technology) is used to connect the copper alloy layer 101 of the shield 1 with the substrate 3, so that copper foil bonding and thermal conductive adhesive coating are not required, and the PCB is not only convenient to operate and high in yield, but also the shield 1 and the substrate 3 are organically combined, thereby improving the overall strength and heat dissipation capability of the PCB.
An embodiment of the present application further provides an electronic device, which includes the PCB board as described above.
The electronic device according to the embodiment of the present application may be, for example, a mobile phone.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A shield, comprising:
the copper alloy layer is provided with a first surface and a second surface which are arranged oppositely;
the first surface of the copper alloy layer is connected with the third surface of the aluminum alloy layer through a heat conduction bonding layer, and the fourth surface of the aluminum alloy layer is provided with an electroplated layer;
the first surface of the copper alloy layer is provided with a first adsorption structure, the third surface of the aluminum alloy layer is provided with a second adsorption structure, and the first adsorption structure is in adsorption connection with the second adsorption structure.
2. The shield of claim 1, wherein the first surface of the copper alloy layer is provided with a first plurality of saw-toothed structures, and the third surface of the aluminum alloy layer is provided with a second plurality of saw-toothed structures, wherein the first plurality of saw-toothed structures and the second plurality of saw-toothed structures are in interlocking engagement.
3. The shield of claim 2, wherein the first serration structure has a first angle and the second serration structure has a second angle; the first angle is greater than the second angle, or the second angle is greater than the first angle.
4. The shield of claim 1, wherein the copper alloy layer has a first thickness and the aluminum alloy layer has a second thickness, the first thickness being less than the second thickness.
5. The shield of claim 1, wherein the copper alloy layer comprises cupronickel.
6. The shield of claim 1, wherein the thermally conductive adhesive layer comprises graphene.
7. The shield of claim 1, wherein the electroplated layer includes an electroplated nickel layer and an electroplated tin layer, the fourth face of the aluminum alloy layer being bonded to the electroplated nickel layer, the electroplated nickel layer being bonded to the electroplated tin layer.
8. A PCB board comprising the shield of any one of claims 1 to 7 and a substrate, the copper alloy layer of the shield being connected to the substrate.
9. The PCB panel of claim 8, wherein the copper alloy layer is soldered to the substrate by soldering.
10. An electronic device comprising the PCB board of claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020964124.2U CN212324650U (en) | 2020-05-29 | 2020-05-29 | Shielding piece, PCB and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020964124.2U CN212324650U (en) | 2020-05-29 | 2020-05-29 | Shielding piece, PCB and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212324650U true CN212324650U (en) | 2021-01-08 |
Family
ID=74025977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020964124.2U Active CN212324650U (en) | 2020-05-29 | 2020-05-29 | Shielding piece, PCB and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212324650U (en) |
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2020
- 2020-05-29 CN CN202020964124.2U patent/CN212324650U/en active Active
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