201009128 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種含钻之鑛錫銅帶，更進一步 地’本發明係關於將含鈷鍍錫銅帶應用於太陽光電模 組傳導電能之用途。 【先前技術】 $、薄、短、小之電子產品市場趨勢已對電子組 裝產:形成—種高度工程技術與產品信賴度壓力。其 $銅▼具有輕、薄、高導電率、低成本等之優點而被 、泛做為電子產品之導電元件。傳統之銅帶（銅箔）製 程:系利用電鍍的方式在-滚輪上賴，接著視其用途 士订各種表面處理程序（例如鍍錫）並裁切成各種尺 寸。 太陽能源由於其兼具環保及來源無虞的特性，使 二=發利用成為近年來重要的課題，其中又以利用太 陽池進行發電的太陽光電系統最受矚目。在利用 太陽成電池發電的太陽光電模組中，鍍錫銅帶 (Photovoltaic咖⑽’ pV ribb〇n)被廣泛用於太陽能電 池，的銲接申聯，其功能在傳導太陽能電池（板)轉換 光月b後產生的電能，經其傳導之電能可利用蓄電裝置 儲存或直接供耗電機具使用。鍍錫銅帶依需求而有不 同寬度與厚度之規格，主要由純銅帶（299.9%)雙面 形，鍍錫層後進一步加工製成，銅帶鍍錫後有良好的 抗氧化性，可鮮性能提高。傳統之鐘錫銅箔（帶）係在 5 201009128 製成鋼帶之後在其表面上進一步利用電鍍或熱浸=的 方式錄上一層鍍錫層，鍍錫銅帶之導電率對於太陽光 ，模組之效率具有關鍵的影響，本技術領域之人相 i的=導電率的提升，可減少太陽能電池輸出之電 陽处Μ^進—步達到提升發電效果，亦即可提高太 月匕轉換之電能的使用效率。 鲁 % 純^本發明#試在現有㈣的基礎切一步提高 j錫銅帶之導電率，藉此提高太陽光c 【發明内容】 為有效提升鍍錫銅帶之導電效率，本 在開發一種高導電率之鍍錫銅帶，透過鍍晳 提t鍍錫銅帶導電性。此外，本發明之另〜^的裎 供高導電率賴鋼帶的製程，期許利用 错 即可’無須另外添置設備。更進一步地，认一 目的在將高導電率鍍錫銅帶應用於太陽 】^一 藉此提高太陽能電池(板)產生之電能的傳導效¥、且。’ 為達上述目的，本發明之鍍錫銅帶，壯' ° 該銅帶表面之鍍錫層中含有鈷，且鈷含2 於 重量係為3%wt以下。 相對於鑛錫 本發明也包含一種製造上述含鈷鍍 法，其步驟包含將銅帶熱浸鍍於含鈷之液的方 此外，本發明另包含一種上述銲錫鋼 其步驟包含將粉末型態之鈷喷灑或加壓之4方法， 表面結合後，再於該銅帶表面形成鍍錫層。$與銅帶 6 201009128 電二ΐ;;月=將蝴錫銅帶用於太 透過將歸人鑛錫銅帶中，藉此達到提升 電率之效果，利用含錯鍍錫銅帶作為太陽 ，電模、、且中的導電線路，可使太陽電池（板）產生的電 能被更有效率地傳輸利用。201009128 IX. Description of the invention: [Technical field of invention] The present invention relates to a tin-bearing copper strip containing a diamond, and further to the present invention relates to the application of a cobalt-containing tin-plated copper strip to a solar photovoltaic module for conducting electrical energy. use. [Prior Art] The trend of $, thin, short, and small electronic products has been applied to electronic assembly: the formation of a high degree of engineering technology and product reliability pressure. Its $ copper ▼ has the advantages of lightness, thinness, high electrical conductivity, low cost, etc., and is widely used as a conductive component of electronic products. The traditional copper strip (copper foil) process is based on the use of electroplating on the roller, and then various surface treatment procedures (such as tin plating) are tailored to various sizes. The solar energy source has become an important issue in recent years due to its combination of environmental protection and flawless source. Among them, the solar photovoltaic system that uses the solar pool for power generation has attracted the most attention. In the solar photovoltaic module that uses solar cells to generate electricity, tinned copper tape (Photovoltaic coffee (10) 'pV ribb〇n) is widely used in solar cells, welding Shenlian, its function is to conduct solar cell (board) conversion light After the monthly b, the electric energy generated by the electric energy can be stored by the electric storage device or directly used for the electric motor. Tinned copper strips are available in different widths and thicknesses according to requirements. They are mainly made of pure copper strip (299.9%). They are further processed after tin plating. The copper strip has good oxidation resistance after tin plating. Performance is improved. The traditional bell tin foil (belt) is made on 5 201009128 after being made into a steel strip. Further, a tin plating layer is recorded on the surface by electroplating or hot dip = the conductivity of the tinned copper strip is for sunlight, the mold The efficiency of the group has a key influence. The improvement of the conductivity of the human phase i in the technical field can reduce the electric power of the solar cell output, and the power generation effect can be improved, and the conversion of the moon can be improved. The efficiency of the use of electrical energy. Lu% pure ^ The invention # test on the basis of the existing (four) to improve the conductivity of the j-tin copper strip, thereby improving the sunlight c [Summary] In order to effectively improve the conductive efficiency of the tin-plated copper strip, the development of a high The tin-plated copper strip with conductivity is electrically conductive through the plating of tin-plated copper strip. In addition, the process of the high conductivity Lai steel strip of the present invention is expected to utilize the error, and no additional equipment is required. Further, it is recognized that the high conductivity tin-plated copper strip is applied to the sun to improve the conduction efficiency of the electric energy generated by the solar cell (board). In order to achieve the above object, the tin-plated copper strip of the present invention contains cobalt in the tin-plated layer on the surface of the copper strip, and the cobalt-containing layer 2 is less than 3% by weight. The present invention also includes a method for producing the above-described cobalt-containing plating, the step of which comprises hot-dip plating a copper strip on a liquid containing cobalt. Further, the present invention further comprises a step of including the solder steel in the step of containing the powder type. The cobalt spraying or pressurizing method 4, after surface bonding, forms a tin plating layer on the surface of the copper strip. $与铜带6 201009128 电二ΐ;;月=Use the tin-copper ribbon to pass through the tin-plated copper belt, thereby achieving the effect of increasing the electric rate, using the wrong tinned copper strip as the sun, The electric circuit, and the conductive circuit in the middle, can make the electric energy generated by the solar cell (board) be more efficiently transmitted and utilized.
【實施方式】 本發明之鍍錫銅帶，其特徵在於該銅帶表面之鍍 錫層中含有鈷，且鈷含量相對於鍍錫重量係為3wt% 以下。 在較佳的實施態樣中，鍍錫層中之鈷含量相對於 鐘錫重量係為O.lwt%至l.5wt%。 本技術領域所稱之錄錫銅帶，係指在表面具有鑛 錫層之銅帶（如第一圖所示之雙面鍍錫銅帶），如同 先刖技術中所述，鑛錫銅帶一般係利用電鑛或熱浸鑛 的方式在銅帶表面鍍上一層鍍錫層來形成（例如第二 圖所示）’常見係由純銅箔（299.9%)雙面形成鍍錫 層製成，鍍錫銅帶依據其需要可設計成不同寬度及厚 度之尺寸。在太陽光電模組中，鐘錫銅帶之作用主要 係用於太陽能電池(板）的銲接串聯，藉此傳導太陽電 池(板)轉換光能後產生的電能，經其傳導之電能可利 用蓄電裝置儲存或直接供耗電機具使用。 本發明之含钻鑛錫銅帶，其銅帶表面之錢錫層中 係含鈷（如第三圖及第四圖所示），主要之目的即用 於太陽光電模組中，一般來說用於太陽光電模組銲接 7 201009128 串聯之鍍錫銅帶，其尺寸寬度約為2.〇mm，厚度約為 0曰15mm，然當可輕易理解的是當其轉用於其他=術之 銲接串聯時，尺寸係可依據需求調整而毋需限制。 在部分的實施態樣中，鍍錫銅帶之鍍錫層中係可 進步含有銀、銅、船、Is、約、鎮、錮、鋅、金或 其混合物，混摻其他金屬元素之目的’係為改善鍍錫 銅帶之物理特性，包含、但不限於導電度及/或硬度 等。因此當可理解的是，在實質不造成導電率降低$ 情況下’可混摻於鍍錫層中之金屬並不以上述金屬為 限。 本發明之製造含鈷鍍錫銅帶的方法有二，現分述 如下： 第—種係將銅帶熱浸鍍於含鈷之液態錫中，藉此 使銅帶表面形成之鍍錫層。 本發明所使用之含鈷液態錫，其係可區分兩種類 型’其一係取含鈷之銲錫合金加以熱熔融，此時鉛共 熔於液態錫中’其二係將鈷以粉末型態存在分散於液 態錫中。使用此類型之方法製造之含鈷鍍錫銅帶，其 銘粒係分佈於鍍錫層中如第三圖下層所示。 本發明第二種製造含鈷鍍錫銅帶的方法，其步驟 包含將粉末型態之鈷喷灑加壓之方式與銅帶表面結合 後’再於該銅帶表面形成鍍錫層，其中，形成鑛錫層 之方法包含’但不限於電鐘或熱浸鑛。使用此二類型 之方法製造之含钻鑛錫銅帶，其始粒係分佈於銅帶表 面如第三圖上層所示。 然而不論採取上述兩種方法中的何種方式，都可 201009128 以使銅帶之鑛錫層中含有銘，所製得之含钴 帶’皆具有較原賴㈣更料電率 ·。’二二 輕易理解的是’第三圖鑛锡層中銘 二:二： 現本發明之創意’並非用於限制本發明。==[Embodiment] The tin-plated copper strip of the present invention is characterized in that the tin plating layer on the surface of the copper strip contains cobalt, and the cobalt content is 3% by weight or less based on the tin plating weight. In a preferred embodiment, the cobalt content in the tin-plated layer is from 0.1% by weight to 1.5% by weight based on the weight of the tin tin. The term "copper copper tape" as used in the technical field refers to a copper strip having a tin-plated layer on the surface (such as the double-sided tinned copper strip shown in the first figure), as described in the prior art, the tin-copper strip Generally, it is formed by plating a tin-plated layer on the surface of the copper strip by means of electro-mine or hot-dip ore (for example, as shown in the second figure). The common system is made of a pure copper foil (299.9%) formed on both sides of a tin-plated layer. Tinned copper strips can be designed to different widths and thicknesses depending on their needs. In the solar photovoltaic module, the role of the tin-tin copper strip is mainly used for the welding series connection of the solar cells (boards), thereby transmitting the electric energy generated by the solar cells (plates) after converting the light energy, and the electric energy transmitted through the electricity can be used to store electricity. The device is stored or used directly by the motor. The diamond-bearing tin-bearing copper strip of the invention has cobalt in the surface of the copper strip on the surface of the copper strip (as shown in the third and fourth figures), and the main purpose is to be used in a solar photovoltaic module, generally speaking For solar photovoltaic module welding 7 201009128 series of tinned copper strip, its size width is about 2. 〇 mm, thickness is about 0 曰 15mm, but can be easily understood when it is used for other welding When connected in series, the size can be adjusted according to the needs without restrictions. In some implementations, the tin-plated layer of tin-plated copper strip can be improved to contain silver, copper, ship, Is, about, town, bismuth, zinc, gold or a mixture thereof, and the purpose of blending other metal elements It is to improve the physical properties of the tinned copper strip, including but not limited to conductivity and/or hardness. Therefore, it is understood that the metal which can be incorporated into the tin-plated layer is not limited to the above metal without substantially causing a decrease in conductivity of $. There are two methods for producing a cobalt-containing tin-plated copper strip of the present invention, which are described as follows: The first type is a hot-dip-plated copper strip in a liquid tin containing cobalt, thereby forming a tin-plated layer on the surface of the copper strip. The cobalt-containing liquid tin used in the present invention can distinguish between two types, one of which is a hot-melting solder alloy containing cobalt, in which case lead is co-melted in liquid tin, and the second type is cobalt in powder form. There is dispersion in liquid tin. Cobalt-coated tin-plated copper strips produced by this type of method are distributed in the tin-plated layer as shown in the lower layer of the third figure. A second method for producing a cobalt-containing tin-plated copper strip according to the present invention, the method comprising: forming a tin-plated layer on the surface of the copper strip after the powder type of cobalt is sprayed and pressurized to bond with the surface of the copper strip; The method of forming the tin ore layer includes, but is not limited to, an electric clock or a hot dip. The copper-bearing tin-bearing copper strip produced by the two types of methods has a granule distribution on the surface of the copper strip as shown in the upper layer of the third figure. However, regardless of which of the above two methods is adopted, it can be 201009128 so that the tin-plated layer of the copper strip contains the inscription, and the cobalt-containing belt produced has a higher electrical conductivity than the original (four). It is easy to understand that 'the third figure of the mineral tin layer in the second two: two: the present invention is not intended to limit the invention. ==
„錫之銅帶’鍍錫層中的鈷係可與錫形J 參 如表面)，且依據製程之不ί 銅泊又面鍍錫層帽的分佈係可相同或不同。 έ 月ΐ含钻鍍錫銅帶係開發以用於太陽光電榲 帶用於太陽光電模組中電能料之用途 錢锡鋼 以下實施態樣係用於進一步了解本發明之優點， 並非用於限制本發明之申請專利範圍。 實施例·含始艘踢麵帶之導電率 為展示含钻鍵錫鋼帶之導電率的提升，遂進 阻值之量測（量_之料溫度為m：)，待測物包 含不含鈷之錫棒、含鈷之錫棒（錫棒之規格為 26.5X4.5X2.3cm，2.5Kg)、未鍍錫之銅帶、鍍錫銅帶 (不含鈷）以及含鈷鍍錫輞帶之導電率（銅帶之規格為 2.〇X〇.15mm，果係如下表所示: 不含姑電卩且值 含鈷電阻值(ιηΩ) 0.047The cobalt in the tin-plated tin layer can be the same as the tin-shaped J, and the distribution of the tin-plated caps can be the same or different depending on the process. Tinned copper strips are developed for use in solar photovoltaic strips for use in solar photovoltaic modules. The following embodiments are used to further understand the advantages of the present invention and are not intended to limit the patent application of the present invention. Scope. Example: Conductivity of the initial kneading belt is shown to increase the conductivity of the tin-containing steel strip with the drill key, and the measurement of the resistance value (the temperature of the material is m:), the test object contains Cobalt-free tin rod, cobalt-containing tin rod (26.5X4.5X2.3cm, 2.5Kg for tin rod), untinned copper strip, tinned copper strip (without cobalt), and cobalt-plated tin The conductivity of the ribbon (the specification of the copper strip is 2.〇X〇.15mm, and the fruit is as shown in the following table: The value of the cobalt is not included and the value of the cobalt is (ιηΩ) 0.047
锡棒 銅帶 201009128Tin rod copper belt 201009128
ΐίϋίίί因為含钻鍵錫層的製造方法不同而數值不同，但仍 數值’應係肇因於不同製備方法會影響其含結鍵 之材料ϋ、為鈷錫合金或含鈷粒之鍍錫層而在電阻值有些微差 由於電阻值越小’代表阻抗越小，導電率越好， 因此由上表可知，相較於銅帶及鍍錫銅帶，含鈷鍍錫 銅帶確實能降低電阻值，達到提升導電率之效果。Ϊ́ίϋίίί differs in the manufacturing method of the tin layer containing the drill key, but the value 'should be due to different preparation methods affecting the material containing the bond, the cobalt tin alloy or the tin plating layer containing the cobalt particles. The resistance value is slightly different because the smaller the resistance value is, the smaller the impedance is, the better the conductivity is. Therefore, it can be seen from the above table that the cobalt-containing tin-plated copper strip can reduce the resistance value compared to the copper strip and the tin-plated copper strip. , to achieve the effect of improving conductivity.
綜上所述，透過於鍍錫銅帶的鍍錫層中的鈷的添 加，確實能達到提升導電率的效果，此一效應對於提 升太陽光電模組的發電供電效率將有所助益。 基你實施饈樺· 、在本說明書中所揭露的所有特徵都可能與其他方 法結合’本說明書中所揭露的每一個特徵都可能選擇 性的以相同、相等或相似目的特徵所取代’因此，除 了特別顯著的特徵之外，所有的本說明書所揭露的特 徵僅是相等或相似特徵中的一個例子。 雖然本發明已以較佳實施例揭露如上，然其並非 用U限定本發明’任何熟悉此技藝者，在不脫離本發 明之精神和範圍内’當可作各種之更動與潤飾。 201009128In summary, the addition of cobalt in the tin-plated layer of the tin-plated copper strip can indeed achieve the effect of improving the conductivity. This effect will be helpful for improving the power generation efficiency of the solar photovoltaic module. Based on your implementation, all features disclosed in this specification may be combined with other methods. 'Each feature disclosed in this specification may be selectively replaced with the same, equal or similar purpose characteristics'. All of the features disclosed in this specification are only one example of equal or similar features, except for the particularly salient features. While the invention has been described above in terms of the preferred embodiments, the invention is not limited by the scope of the invention, and may be modified and modified without departing from the spirit and scope of the invention. 201009128
❿ 【圖式簡單說明】 第一圖係為鍍錫銅帶之結構示意圖。 第二圖係為鍍錫銅帶之表面電子顯微鏡影像圖。 第三圖含鈷鍍錫銅帶之結構示意圖。 第四圖係為含鈷鍍錫銅帶之表面電子顯微鏡影像 11❿ [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the tinned copper strip. The second figure is a surface electron microscope image of a tinned copper strip. The third figure shows the structure of the cobalt-tinned copper strip. The fourth picture is a surface electron microscope image of a cobalt-coated tin-plated copper strip. 11