CN202455652U - Printed circuit board with immersion Au layer and antioxidation layer - Google Patents
Printed circuit board with immersion Au layer and antioxidation layer Download PDFInfo
- Publication number
- CN202455652U CN202455652U CN2012200383147U CN201220038314U CN202455652U CN 202455652 U CN202455652 U CN 202455652U CN 2012200383147 U CN2012200383147 U CN 2012200383147U CN 201220038314 U CN201220038314 U CN 201220038314U CN 202455652 U CN202455652 U CN 202455652U
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- CN
- China
- Prior art keywords
- layer
- circuit board
- turmeric
- immersion
- antioxidation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the technology of a printed circuit board (PCB) in the electronic industry, in particular to a printed circuit board with an immersion Au layer and an antioxidation layer. The printed circuit board is characterized in that copper foil circuit boards which are formed by etching a plurality of copper foils are arranged on a substrate of the printed circuit board; the immersion Au layer and the antioxidation layer are formed on each of the copper foil circuit boards; the immersion Au layer is formed on a gold finger or a plug part; and the antioxidation layer is directly formed on each of the copper foil circuit boards. Through the immersion Au layer, a plating layer is smooth and the weldability is high; the antioxidation layer has the characteristics of antioxidation performance, heat shock resistance and moisture resistance; and by the protection of the immersion Au layer and the antioxidation layer, environment protection indexes and a welding effect of the surface mount technology (SMT) also can be achieved.
Description
Technical field
The utility model relates to technology on the PCB printed substrate of electron trade, particularly a kind of circuit board with the anti-oxidant surface of turmeric.
Background technology
Printed substrate (PCB) is the indispensable fundamental parts of all electronic products, is the carrier of all electronic devices and components, is the main support body of electronics spare part when installing with interconnection.
In recent years; Because environmental requirement all over the world is in continuous increase; PCB also must get into environmental protection series as the part of electronics assembling; Past PCB surface treatment all adopts tin spray process to obtain the tin layer on surface mostly, is unfavorable for environmental protection, and in the process of lead-free tin spray because the higher meeting of temperature produces bigger influence to the flexibility of sheet material.
Therefore, the processing method of superficial layer is improved and is adopted the electrogilding surface treatment to improve environmental protection, and still, electrogilding is relatively poor for the welding performance of surface mount (SMT), can not satisfy welding effect.
The utility model content
The utility model has proposed a kind of circuit board with the anti-oxidant surface of turmeric to above-mentioned deficiency, and through turmeric layer and the anti oxidation layer that is provided with, both environmental protection can be satisfied the welding effect of surface mount (SMT) again.
The technical scheme of the utility model is following:
Circuit board with the anti-oxidant surface of turmeric; It is characterized in that: the wiring board that has some Copper Foil etchings to form on the base material of circuit board; Said wiring board is provided with turmeric layer and anti oxidation layer; Said turmeric layer is arranged on golden finger or the plug position, and said anti oxidation layer directly is arranged on the copper foil circuit plate.
Said turmeric layer is the turmeric nickel dam, i.e. nickel gold plate, and the colour stable of this nickel gold plate, glossiness is good, and coating is smooth, good weldability.
Also be provided with turmeric gold layer on the said turmeric nickel dam, color is more stable, and glossiness is better, and coating is smooth, and solderability is very good.
Said anti oxidation layer is a kind of one deck organic membrane that generates with chemical method, and this tunic no longer continues get rusty (oxidation or sulfuration etc.) in order to the protection copper foil surface in normal environment; But in follow-up welding high temperature, this kind diaphragm must be easy to again removed rapidly by scaling powder institute, so can make the clean copper surface of exposing be able in the extremely short time, to be combined into firm solder joint immediately with fusion scolding tin and be beneficial to welding.
The beneficial effect of the utility model is following:
The turmeric layer of the utility model through being provided with, coating is smooth, good weldability; The anti oxidation layer that is provided with has the characteristic of anti-oxidation, heat shock resistance, moisture-proof; Through this two-layer protection, the utility model both can reach the welding effect that environmental protection index also can satisfy surface mount (SMT).
Description of drawings
Fig. 1 is the structural representation of the utility model
Wherein, Reference numeral is: 1 base material, 2 copper foil circuit plates, 3 turmeric nickel dams, 4 turmerics gold layer, 5 anti oxidation layers.
Embodiment
As shown in Figure 1; Circuit board with the anti-oxidant surface of turmeric; The wiring board 2 that has some Copper Foil etchings to form on the base material 1 of circuit board; Said wiring board 2 is provided with turmeric layer and anti oxidation layer 5, and said turmeric layer is arranged on golden finger or the plug position, and said anti oxidation layer 5 directly is arranged on the copper foil circuit plate 2.
Said turmeric layer is a turmeric nickel dam 3, i.e. nickel gold plate, and the colour stable of this nickel gold plate, glossiness is good, and coating is smooth, good weldability.
Also be provided with turmeric gold layer 4 on the said turmeric nickel dam 3, color is more stable, and glossiness is better, and coating is smooth, and solderability is very good.
Said anti oxidation layer 5 is a kind of organic epitheliums of one deck that generate with chemical method, and this tunic no longer continues get rusty (oxidation or sulfuration etc.) in order to the protection copper foil surface in normal environment; But in follow-up welding high temperature, this kind diaphragm must be easy to again removed rapidly by scaling powder institute, so can make the clean copper surface of exposing be able in the extremely short time, to be combined into firm solder joint immediately with fusion scolding tin and be beneficial to welding.
Claims (4)
1. the circuit board that has the anti-oxidant surface of turmeric; It is characterized in that: the wiring board that has some Copper Foil etchings to form on the base material of circuit board; Said wiring board is provided with turmeric layer and anti oxidation layer; Said turmeric layer is arranged on golden finger or the plug position, and said anti oxidation layer directly is arranged on the copper foil circuit plate.
2. circuit board according to claim 1 is characterized in that: said turmeric layer turmeric nickel dam, i.e. nickel gold plate.
3. circuit board according to claim 2 is characterized in that: also be provided with turmeric gold layer on the said turmeric nickel dam.
4. according to claim 1 or 3 described circuit boards, it is characterized in that: said anti oxidation layer is the organic epithelium of one deck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200383147U CN202455652U (en) | 2012-02-07 | 2012-02-07 | Printed circuit board with immersion Au layer and antioxidation layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200383147U CN202455652U (en) | 2012-02-07 | 2012-02-07 | Printed circuit board with immersion Au layer and antioxidation layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455652U true CN202455652U (en) | 2012-09-26 |
Family
ID=46871470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200383147U Expired - Fee Related CN202455652U (en) | 2012-02-07 | 2012-02-07 | Printed circuit board with immersion Au layer and antioxidation layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455652U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110867508A (en) * | 2018-08-28 | 2020-03-06 | 青岛海信电器股份有限公司 | PCB (printed circuit board), manufacturing method thereof, lamp panel and display device |
-
2012
- 2012-02-07 CN CN2012200383147U patent/CN202455652U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110867508A (en) * | 2018-08-28 | 2020-03-06 | 青岛海信电器股份有限公司 | PCB (printed circuit board), manufacturing method thereof, lamp panel and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20140207 |