CN201478291U - SMD metal cover board - Google Patents
SMD metal cover board Download PDFInfo
- Publication number
- CN201478291U CN201478291U CN2009202335396U CN200920233539U CN201478291U CN 201478291 U CN201478291 U CN 201478291U CN 2009202335396 U CN2009202335396 U CN 2009202335396U CN 200920233539 U CN200920233539 U CN 200920233539U CN 201478291 U CN201478291 U CN 201478291U
- Authority
- CN
- China
- Prior art keywords
- metal cover
- cover board
- protective layer
- plate body
- smd metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses an SMD metal cover board, which comprises a board body (1). The surface of the board body (1) is coated with a nickel-coated protective layer (2). The surface of the board body (1) of the utility model is provided with the nickel-coated protective layer, thus, the SMD metal cover board not only can reduce the production cost, have strong corrosion resistance and avoid bubble, layering and desquamating phenomenons, but also can improve the reliability of soldering and sealing and reduce the melting point of soldering and sealing so as to improve the working stability.
Description
Technical field
The utility model relates to a kind of SMD metal cover board.
Background technology
SMD metal cover board in the market is the cost of manufacture height not only, and poor corrosion resistance, and the poor reliability of soldering and sealing when welding cause crystal chip soldering and sealing back job stability on this metal cover board to reduce greatly.
Summary of the invention
The utility model provides a kind of SMD metal cover board, and not only cost of manufacture is low for it, and can improve job stability.
The utility model has adopted following technical scheme: a kind of SMD metal cover board, it comprises plate body, scribbles the nickel plating protective layer on the surface of plate body.
Described plate body is an iron-nickel alloy sheet material.Described nickel plating protective layer is for being the nickel-phosphorus alloy protective layer.The thickness of described plate body is 0.08-0.2mm.
The utlity model has following beneficial effect: the surface of plate body of the present utility model is provided with the nickel plating protective layer; so not only can reduce cost of manufacture; corrosion resistance is more intense; avoid occurring the phenomenon of bubble, layering and decortication; and the reliability can improve soldering and sealing the time; fusing point when reducing soldering and sealing, thereby the stability when improving work.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Embodiment
In Fig. 1, the utility model is a kind of SMD metal cover board, and it comprises plate body 1, and the thickness of plate body 1 is 0.08-0.2mm, and plate body 1 is an iron-nickel alloy sheet material, scribbles nickel plating protective layer 2 on the surface of plate body 1, and nickel plating protective layer 2 is for being the nickel-phosphorus alloy protective layer.
Claims (4)
1. a SMD metal cover board is characterized in that it comprises plate body (1), scribbles nickel plating protective layer (2) on the surface of plate body (1).
2. SMD metal cover board according to claim 1 is characterized in that described plate body (1) is an iron-nickel alloy sheet material.
3. SMD metal cover board according to claim 1 is characterized in that described nickel plating protective layer (2) is for being the nickel-phosphorus alloy protective layer.
4. SMD metal cover board according to claim 1, the thickness that it is characterized in that described plate body (1) is 0.08-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202335396U CN201478291U (en) | 2009-08-04 | 2009-08-04 | SMD metal cover board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202335396U CN201478291U (en) | 2009-08-04 | 2009-08-04 | SMD metal cover board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201478291U true CN201478291U (en) | 2010-05-19 |
Family
ID=42414551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202335396U Expired - Fee Related CN201478291U (en) | 2009-08-04 | 2009-08-04 | SMD metal cover board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201478291U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
-
2009
- 2009-08-04 CN CN2009202335396U patent/CN201478291U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977361B (en) * | 2019-12-26 | 2024-05-03 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20170804 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |