CN203093594U - Copperplate print made from metallurgical bonding copper-aluminum composite board - Google Patents
Copperplate print made from metallurgical bonding copper-aluminum composite board Download PDFInfo
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- CN203093594U CN203093594U CN 201320087177 CN201320087177U CN203093594U CN 203093594 U CN203093594 U CN 203093594U CN 201320087177 CN201320087177 CN 201320087177 CN 201320087177 U CN201320087177 U CN 201320087177U CN 203093594 U CN203093594 U CN 203093594U
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- copper
- copperplate
- copperplate print
- composite board
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Abstract
The utility model discloses a copperplate print made from a metallurgical bonding copper-aluminum composite board. The copperplate print comprises a copper foil and a baseplate, wherein the baseplate is an aluminum plate; the copper foil is metallurgically bonded on the baseplate; and a copperplate print is arranged on the copper foil. The copperplate print which is made from the metallurgical bonding copper-aluminum composite board can effectively reduce the total quantity of per unit volume, and simultaneously, can greatly reduce production cost; and metallurgical bonding can avoid phenomena of layering and breaking-off, and bonding strength is not less than 100Mpa, thus satisfying a technological requirement of the corrosion of corrosive liquid or directly carving by a needle or cutter in a process of making the copperplate print; the copperplate print made from the metallurgical bonding copper-aluminum composite board is good in mechanical performance, and copper and aluminum are free from layering and breaking-off when the copperplate print is bent; the copperplate print, when being bent by 180 degrees, is free from edge crack, and is stable in product quality; and the copperplate print making effect is identical to the effect of a copperplate print made from a pure copper board, thus being favorable for long-term preservation.
Description
Technical field
The utility model belongs to the copperplate etching technical field, the copperplate print that in particular a kind of metallurgical binding copper-aluminum composite board is made.
Background technology
Copperplate print also claims " etched plate picture ", " the mechanical picture of copper ", " copper erosion plate is drawn ", " etched plate picture ", is a kind of of plate picture.Finger is drawn with corrosive liquid corrosion or the direct a kind of plate that forms with pin or graduating with cutter system on metallograph.Traditional copperplate etching be on pure copper plate and true yellow copper coin with corrosive liquid corrosion or directly make with pin or graduating with cutter mode because amount of copper consuming is big, cause cost occupy high-leveled and difficult down, unit volume is heavy.
Summary of the invention
The purpose of this utility model produces thus, proposes the copperplate print that a kind of metallurgical binding copper-aluminum composite board is made, and has in light weightly, and cost is low, and plate is drawn the characteristics such as effective of making.
The utility model realizes that the technical scheme that above-mentioned purpose is taked is: the copperplate print that a kind of metallurgical binding copper-aluminum composite board is made, comprise Copper Foil and substrate, and described substrate is an aluminium sheet, the Copper Foil metallurgical binding has copperplate etching on the described Copper Foil on substrate.
Copper Foil metallurgical binding described in the utility model is on the single or double of described aluminium sheet.
Substrate thickness described in the utility model is 0.25 ~ 3.5mm, and described copper thickness is 0.05-0.35mm.
The beneficial effects of the utility model are: adopt the metallurgical binding copper-aluminum composite board to make copperplate print, because substrate is an aluminium sheet, Copper Foil is that metallurgical binding is on substrate, so just effectively reduce the total amount of unit volume, greatly reduce production cost simultaneously, and metallurgical binding layering can not occur, the phenomenon that breaks away from, bond strength 〉=100Mpa, satisfied corrosive liquid corrosion in the manufacturing process of copperplate print or directly with the technological requirement of pin or graduating with cutter, made metallurgical binding copper-aluminum composite board copperplate print mechanical property is good, copper aluminium is not stratified during bending, do not break away from, 180 degree bendings are raw edges not, constant product quality, plate are drawn and are made the copperplate etching that effect is equal to the making of fine copper plate, are beneficial to permanent preservation.
Description of drawings
Fig. 1 is the side view that the utility model single face covers copper.
Among the figure: 1, substrate; 2, Copper Foil.
The specific embodiment
In conjunction with the accompanying drawings, it is as follows to provide embodiment of the present utility model:
As shown in Figure 1: the copperplate print that the described metallurgical binding copper-aluminum composite board of present embodiment is made, comprise Copper Foil 2 and substrate 1, described substrate 1 is an aluminium sheet, and Copper Foil 2 metallurgical binding are on substrate, substrate 1 thickness is 0.25 ~ 3.5mm, and Copper Foil 2 thickness are 0.05-0.35mm.Described Copper Foil 2 be the single or double metallurgical binding on aluminium sheet 1, Copper Foil 2 is red copper or brass.On described Copper Foil, adopt traditional handicraft to be manufactured with copperplate etching, can carry out the single or double etching and draw a picture.
Claims (3)
1. the copperplate print made of a metallurgical binding copper-aluminum composite board, it is characterized in that: comprise Copper Foil (2) and substrate (1), described substrate (1) is an aluminium sheet, and Copper Foil (2) metallurgical binding is on substrate (1), and described Copper Foil has copperplate etching on (2).
2. the copperplate print that metallurgical binding copper-aluminum composite board according to claim 1 is made, it is characterized in that: described Copper Foil (2) metallurgical binding is on the single or double of described aluminium sheet (1).
3. the copperplate print that metallurgical binding copper-aluminum composite board according to claim 1 is made, it is characterized in that: described substrate (1) thickness is 0.25 ~ 3.5mm, described Copper Foil (2) thickness is 0.05 ~ 0.35mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320087177 CN203093594U (en) | 2013-02-27 | 2013-02-27 | Copperplate print made from metallurgical bonding copper-aluminum composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320087177 CN203093594U (en) | 2013-02-27 | 2013-02-27 | Copperplate print made from metallurgical bonding copper-aluminum composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203093594U true CN203093594U (en) | 2013-07-31 |
Family
ID=48845025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320087177 Expired - Fee Related CN203093594U (en) | 2013-02-27 | 2013-02-27 | Copperplate print made from metallurgical bonding copper-aluminum composite board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203093594U (en) |
-
2013
- 2013-02-27 CN CN 201320087177 patent/CN203093594U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20170227 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |