CN113707617A - High-reliability parallel seam welding alloy cover plate and preparation method thereof - Google Patents
High-reliability parallel seam welding alloy cover plate and preparation method thereof Download PDFInfo
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- CN113707617A CN113707617A CN202110989954.XA CN202110989954A CN113707617A CN 113707617 A CN113707617 A CN 113707617A CN 202110989954 A CN202110989954 A CN 202110989954A CN 113707617 A CN113707617 A CN 113707617A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 58
- 239000000956 alloy Substances 0.000 title claims abstract description 58
- 238000003466 welding Methods 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 90
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 45
- 239000002121 nanofiber Substances 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 23
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 12
- 238000002955 isolation Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 abstract description 12
- 239000007921 spray Substances 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 10
- 238000005260 corrosion Methods 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 229910000833 kovar Inorganic materials 0.000 description 9
- 239000000126 substance Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3192—Multilayer coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
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Abstract
The invention relates to integrated circuit electronic packaging, in particular to a high-reliability parallel seam welding alloy cover plate and a preparation method thereof. The utility model provides a high reliability parallel seam welding alloy apron, includes the alloy apron body, the side and the upper surface of alloy apron body all are equipped with nanofiber reinforcing nickel protective layer, the lower surface of alloy apron body with all wrap up the gilt layer on the nanofiber reinforcing nickel protective layer. The high-reliability parallel seam welding alloy cover plate provided by the invention has better salt spray corrosion resistance, can meet the more harsh salt spray environment application requirements of integrated circuit products, and realizes the high-reliability requirements of parallel seam welding packaging devices.
Description
Technical Field
The invention relates to integrated circuit electronic packaging, in particular to a high-reliability parallel seam welding alloy cover plate and a preparation method thereof.
Background
Parallel seam welding is the most common packaging form in high-reliability airtight ceramic packaging, and the technology utilizes the principle of resistance welding, and realizes the melting and resolidification of the plating layers on the lower surface of the cover plate and the surface of the welding frame through the heat generated by pulse power applied to the surface of the cover plate by a roller electrode, so as to realize the welding of the cover plate and the welding frame. With the rolling of the roller electrodes on the cover plate, under the action of pulse power, welding spots are formed one by one in succession and overlapped with each other to form a fish-scale-shaped connected welding line, so that the air-tight packaging is realized. Because the heat of parallel seam welding process is mainly concentrated in the welding seal area, the heat can be in time transmitted to the environment through heat conduction and heat radiation, therefore, the chip in the tube shell can not receive the effect of high temperature.
The conventional parallel seam welding cover plate adopts kovar alloy substrate surface chemical nickel plating, in the process, the weight ratio of phosphorus doped in chemical nickel plating solution is generally between 8 and 12 percent, and the melting point of a plating layer is 880 ℃. Therefore, to ensure good sealing performance, the temperature at which the cover plate contacts the seal ring is typically 1000 ℃ or higher. Although the higher temperature is beneficial to the yield of the parallel seam welding sealing process, when the temperature is too high, the kovar substrate is exposed under the actions of melting, flowing and the like of the surface chemical nickel plating layer, so that the corrosion resistance of the cover plate is seriously reduced, and the root cause of the corrosion failure of the edge of the cover plate frequently occurs in a salt spray test of a packaging product adopting the parallel seam welding sealing process. Cover plate corrosion can lead to failure of hermetic package, which brings serious hidden danger to reliability in circuit application. Therefore, how to improve the salt spray corrosion resistance of parallel seam welding is a problem to be solved urgently.
Disclosure of Invention
The invention provides a high-reliability parallel seam welding alloy cover plate, which aims to solve the problem of hidden trouble of circuit reliability caused by corrosion failure in a salt spray test due to exposure of a Kovar substrate caused by melting of a coating in the parallel seam welding process of a conventional parallel seam welding alloy cover plate adopting chemical nickel plating, and the specific technical scheme is as follows:
the utility model provides a high reliability parallel seam welding alloy apron, includes the alloy apron body, the side and the upper surface of alloy apron body all are equipped with nanofiber reinforcing nickel protective layer, the lower surface of alloy apron body with all wrap up the gilt layer on the nanofiber reinforcing nickel protective layer.
Preferably, the thickness of the nanofiber reinforced nickel protective layer is 0.1-15 μm.
Furthermore, the nickel in the nanofiber reinforced nickel protective layer is high-purity nickel, and the melting point is 1455 ℃.
Preferably, the gold of the gold-plated layer is pure gold, and the melting point is 1064 ℃.
Wherein the thickness of the gold-plating layer is 0.01-6 μm.
A preparation method of a high-reliability parallel seam welding alloy cover plate comprises the following steps:
the method comprises the following steps: machining to obtain an alloy cover plate body;
step two: after the alloy cover plate body is cleaned, coating an isolation layer on the lower surface, and drying the isolation layer;
step three: growing reinforcement nano-fibers on the upper surface and the side surface of the alloy cover plate body;
step four: carrying out nickel plating treatment on the reinforcing body nanofiber to obtain a nanofiber reinforced nickel protective layer;
step five: removing the isolation layer, cleaning and drying;
step six: carrying out gold plating treatment on the alloy cover plate body to obtain a gold plating layer;
step seven: and cleaning and drying to finish the manufacture of the parallel seam welding alloy cover plate.
Preferably, the reinforcing body nano fiber is one or more of carbon fiber, carbon nano tube, silicon carbide fiber, alumina fiber, nickel fiber or copper fiber.
Compared with the prior art, the invention has the following beneficial effects:
the high-reliability parallel seam welding alloy cover plate and the preparation method thereof provided by the invention have the following beneficial effects:
(1) the existence of the nano fibers can effectively improve the melting point and the strength of the nickel layer, the nano fiber reinforced nickel protective layers on the upper surface and the side surfaces of the alloy cover plate can effectively prevent the kovar alloy matrix from being exposed in the environment in the process of parallel seam welding, meanwhile, the high strength and the high hardness of the nano fiber reinforced nickel protective layers can also avoid the damage of the electrode to the kovar cover plate, and the salt mist corrosion resistance of the cover plate is enhanced while the integrity of the kovar cover plate is ensured;
(2) compared with the existing parallel seam welding chemical nickel plating cover plate, the high-reliability parallel seam welding alloy cover plate provided by the invention has better salt spray corrosion resistance, can meet the more harsh salt spray environment application requirements of integrated circuit products, and realizes the high reliability requirement of parallel seam welding packaging devices.
Drawings
FIG. 1 is a schematic view of an isolation layer coated on the lower surface of an alloy cover plate body;
FIG. 2 is a schematic view of the growth of reinforcement nanofibers on the top and sides of an alloy cover plate body;
FIG. 3 is a schematic diagram of nickel plating on the upper surface and the side surface of the alloy cover plate body to obtain a nanofiber-reinforced nickel protective layer;
FIG. 4 is a schematic view of the isolation layer being removed;
fig. 5 is a schematic diagram of manufacturing a gold plating layer.
Detailed Description
The invention will now be further described with reference to the accompanying drawings.
Example one
As shown in fig. 5, the high-reliability parallel seam welding alloy cover plate comprises an alloy cover plate body 1, wherein the side surface and the upper surface of the alloy cover plate body 1 are both provided with a nanofiber-reinforced nickel protective layer 3, and the lower surface of the alloy cover plate body 1 and the nanofiber-reinforced nickel protective layer 3 are both wrapped with gold-plated layers 4.
The thickness of the nanofiber reinforced nickel protective layer 3 is 0.1-15 μm.
The nickel in the nanofiber reinforced nickel protective layer 3 is high-purity nickel, and the melting point is 1455 ℃.
The gold of the gold-plated layer 4 is pure gold, and the melting point is 1064 ℃.
The thickness of the gold-plating layer 4 is 0.01 to 6 μm.
Generally, damage to the cover plate body and the coating layer by a parallel seam welding process is inevitable, and only the damage can be controlled through process improvement, and the problem of damage to the cover plate body and the coating layer cannot be solved fundamentally. The high reliability parallel seam welding alloy apron that this embodiment provided can obtain the high melting point in the upper surface and the side of alloy apron body, high rigidity, the nanofiber reinforcing nickel coating structure of high strength, the exposure of apron body in the environment not only can be protected to the nanofiber reinforcing nickel layer that obtains, can effectively avoid the damage of apron body simultaneously, better salt spray corrosion resistance has, can satisfy the requirement of high reliable ceramic package to the salt spray test, can adapt to the harsher salt spray environment application demand of integrated circuit product, realize the high reliability requirement of parallel seam welding encapsulation device.
Example two
As shown in fig. 1 to 5, a method for preparing a high-reliability parallel seam welding alloy cover plate includes the following steps:
the method comprises the following steps: machining to obtain an alloy cover plate body 1;
step two: after the alloy cover plate body 1 is cleaned, the lower surface is coated with the isolation layer 30, and the isolation layer 30 is dried, as shown in fig. 1;
step three: growing reinforcement nanofibers 2 on the upper surface and the side surfaces of the alloy cover plate body 1, as shown in fig. 2;
step four: carrying out nickel plating treatment on the reinforcing body nano fiber 2 to obtain a nano fiber reinforced nickel protective layer 3 as shown in figure 3;
step five: removing the isolation layer 30, cleaning and drying, as shown in fig. 4;
step six: performing gold plating treatment on the alloy cover plate body to obtain a gold plating layer 4, as shown in fig. 5;
step seven: and cleaning and drying to finish the manufacture of the parallel seam welding alloy cover plate.
The nano-fiber formed when the reinforcing body nano-fiber is formed is one or more of carbon fiber, carbon nano-tube, silicon carbide fiber, alumina fiber, nickel fiber and copper fiber, and the nano-fiber mainly comprises organic nano-fiber and inorganic nano-fiber.
The means used in forming the first nanofiber-reinforced nickel protective layer is to use an electroplating technique.
The existence of nanofiber can effectively improve the melting point and the intensity of nickel layer, and the nanofiber reinforcing nickel protective layer of alloy apron upper surface and side can effectively prevent the exposure of parallel seam welding in-process base member kovar alloy in the environment, and simultaneously, electrode pair kovar apron's damage also can be avoided to high strength, the high rigidity of nanofiber reinforcing nickel protective layer itself, when guaranteeing the integrality of kovar apron, the anti salt spray corrosion behavior of reinforcing apron
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive step, which shall fall within the scope of the appended claims.
Claims (7)
1. The utility model provides a high reliability parallel seam welding alloy apron, its characterized in that, includes alloy apron body (1), the side and the upper surface of alloy apron body (1) all are equipped with nanofiber reinforcing nickel protective layer (3), the lower surface of alloy apron body (1) with all wrap up gold-plated layer (4) on nanofiber reinforcing nickel protective layer (3).
2. The high-reliability parallel seam welding alloy cover plate according to claim 1, wherein the thickness of the nanofiber-reinforced nickel protective layer (3) is 0.1-15 μm.
3. A high reliability parallel gap welding alloy cover plate according to claim 1, wherein the nickel in the nanofiber reinforced nickel protective layer (3) is high purity nickel with a melting point of 1455 ℃.
4. A highly reliable parallel seam welding alloy cover plate according to claim 1, characterized in that the gold of said gold plating layer (4) is pure gold with a melting point of 1064 ℃.
5. The high-reliability parallel seam welding alloy cover plate according to claim 1, wherein the thickness of the gold plating layer (4) is 0.01-6 μm.
6. A preparation method of a high-reliability parallel seam welding alloy cover plate is characterized by comprising the following steps:
the method comprises the following steps: machining to obtain an alloy cover plate body;
step two: after the alloy cover plate body is cleaned, coating an isolation layer on the lower surface, and drying the isolation layer;
step three: growing reinforcement nano-fibers on the upper surface and the side surface of the alloy cover plate body;
step four: carrying out nickel plating treatment on the reinforcing body nanofiber to obtain a nanofiber reinforced nickel protective layer;
step five: removing the isolation layer, cleaning and drying;
step six: carrying out gold plating treatment on the alloy cover plate body to obtain a gold plating layer;
step seven: and cleaning and drying to finish the manufacture of the parallel seam welding alloy cover plate.
7. The method for preparing a high-reliability parallel seam welding alloy cover plate according to claim 6, wherein the reinforcement nano fibers are one or more of carbon fibers, carbon nanotubes, silicon carbide fibers, aluminum oxide fibers, nickel fibers or copper fibers.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110989954.XA CN113707617A (en) | 2021-08-26 | 2021-08-26 | High-reliability parallel seam welding alloy cover plate and preparation method thereof |
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| CN202110989954.XA CN113707617A (en) | 2021-08-26 | 2021-08-26 | High-reliability parallel seam welding alloy cover plate and preparation method thereof |
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| CN211840836U (en) * | 2019-12-26 | 2020-11-03 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate resistant to salt mist corrosion |
-
2021
- 2021-08-26 CN CN202110989954.XA patent/CN113707617A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002246490A (en) * | 2001-02-16 | 2002-08-30 | Nippon Avionics Co Ltd | Package for semiconductor integrated circuit and its manufacturing method |
| CN1585261A (en) * | 2003-07-30 | 2005-02-23 | 京瓷株式会社 | Method for manufacturing a piezoelectric oscillator |
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