CN110770371A - 贵金属盐制剂、其生产方法及用于电镀的用途 - Google Patents

贵金属盐制剂、其生产方法及用于电镀的用途 Download PDF

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Publication number
CN110770371A
CN110770371A CN201780091162.2A CN201780091162A CN110770371A CN 110770371 A CN110770371 A CN 110770371A CN 201780091162 A CN201780091162 A CN 201780091162A CN 110770371 A CN110770371 A CN 110770371A
Authority
CN
China
Prior art keywords
noble metal
metal salt
salt formulation
solution
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201780091162.2A
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English (en)
Chinese (zh)
Inventor
赖科·埃纳特
弗兰克·科斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saxony Edmetar Co Ltd
Original Assignee
Saxony Edmetar Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saxony Edmetar Co Ltd filed Critical Saxony Edmetar Co Ltd
Publication of CN110770371A publication Critical patent/CN110770371A/zh
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/28—Per-compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B13/00—Diaphragms; Spacing elements
    • C25B13/04—Diaphragms; Spacing elements characterised by the material
    • C25B13/08—Diaphragms; Spacing elements characterised by the material based on organic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00—Electrolytic production of organic compounds
    • C25B3/01—Products
    • C25B3/13—Organo-metallic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00—Electrolytic production of organic compounds
    • C25B3/20—Processes
    • C25B3/23—Oxidation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
CN201780091162.2A 2017-05-23 2017-05-23 贵金属盐制剂、其生产方法及用于电镀的用途 Withdrawn CN110770371A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/062434 WO2018215057A1 (en) 2017-05-23 2017-05-23 Noble metal salt preparation, a method for production thereof and use for electroplating

Publications (1)

Publication Number Publication Date
CN110770371A true CN110770371A (zh) 2020-02-07

Family

ID=58772561

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780091162.2A Withdrawn CN110770371A (zh) 2017-05-23 2017-05-23 贵金属盐制剂、其生产方法及用于电镀的用途

Country Status (7)

Country Link
US (1) US20200095693A1 (enExample)
EP (1) EP3443146B1 (enExample)
JP (1) JP2020521060A (enExample)
KR (1) KR20200010340A (enExample)
CN (1) CN110770371A (enExample)
ES (1) ES2773771T3 (enExample)
WO (1) WO2018215057A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113897603A (zh) * 2021-08-31 2022-01-07 信丰正天伟电子科技有限公司 一种耐腐蚀钯类化学镀液及其应用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3960898A1 (en) * 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate
JP7607180B1 (ja) * 2024-07-17 2024-12-26 田中貴金属工業株式会社 金めっき方法、金めっき用組成物及びめっき液

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US4663005A (en) * 1985-11-15 1987-05-05 Edson Gwynne I Electropolishing process
JPS6324089A (ja) * 1986-07-16 1988-02-01 Tanaka Kikinzoku Kogyo Kk 金の電解液
US5302278A (en) 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
JP3365866B2 (ja) 1994-08-01 2003-01-14 荏原ユージライト株式会社 非シアン性貴金属めっき浴
US6251249B1 (en) 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
DE19928047A1 (de) 1999-06-19 2000-12-21 Gerhard Hoffacker Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen
JP3697181B2 (ja) * 2001-07-27 2005-09-21 日本高純度化学株式会社 無電解金メッキ液
KR100442519B1 (ko) * 2002-04-09 2004-07-30 삼성전기주식회사 모듈화 인쇄회로기판의 표면처리용 합금 도금액
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
DE102009024396A1 (de) 2009-06-09 2010-12-16 Coventya Spa Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
TWI426157B (zh) * 2011-05-18 2014-02-11 優勝奈米科技有限公司 剝金組成物以及使用方法
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
DE102012004348B4 (de) * 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen
JP6198343B2 (ja) 2012-10-04 2017-09-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン系電解金めっき液
DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung
CN105316718A (zh) 2014-07-31 2016-02-10 无锡永发电镀有限公司 一种亚硫酸盐无氰镀金的电镀液及电镀方法
CN105745355B (zh) 2014-08-25 2018-03-30 小岛化学药品株式会社 还原型化学镀金液及使用该镀金液的化学镀金方法
EP3159435B1 (de) * 2015-10-21 2018-05-23 Umicore Galvanotechnik GmbH Zusatz für silber-palladium-legierungselektrolyte

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113897603A (zh) * 2021-08-31 2022-01-07 信丰正天伟电子科技有限公司 一种耐腐蚀钯类化学镀液及其应用
CN113897603B (zh) * 2021-08-31 2023-09-05 信丰正天伟电子科技有限公司 一种耐腐蚀钯类化学镀液及其应用

Also Published As

Publication number Publication date
US20200095693A1 (en) 2020-03-26
WO2018215057A1 (en) 2018-11-29
EP3443146B1 (en) 2019-12-25
JP2020521060A (ja) 2020-07-16
ES2773771T3 (es) 2020-07-14
KR20200010340A (ko) 2020-01-30
EP3443146A1 (en) 2019-02-20

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Application publication date: 20200207