JP2020521060A - 貴金属塩調合物、それの製造方法及び電気メッキのための使用 - Google Patents

貴金属塩調合物、それの製造方法及び電気メッキのための使用 Download PDF

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JP2020521060A
JP2020521060A JP2020515821A JP2020515821A JP2020521060A JP 2020521060 A JP2020521060 A JP 2020521060A JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020521060 A JP2020521060 A JP 2020521060A
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Prior art keywords
noble metal
metal salt
salt formulation
sulfonate
formulation according
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Pending
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JP2020515821A
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English (en)
Japanese (ja)
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JP2020521060A5 (enExample
Inventor
エーネルト・ライコ
ケスター・フランク
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ザクソニア・エーデルメタレ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
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Publication of JP2020521060A publication Critical patent/JP2020521060A/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/28—Per-compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B13/00—Diaphragms; Spacing elements
    • C25B13/04—Diaphragms; Spacing elements characterised by the material
    • C25B13/08—Diaphragms; Spacing elements characterised by the material based on organic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00—Electrolytic production of organic compounds
    • C25B3/01—Products
    • C25B3/13—Organo-metallic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00—Electrolytic production of organic compounds
    • C25B3/20—Processes
    • C25B3/23—Oxidation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
JP2020515821A 2017-05-23 2017-05-23 貴金属塩調合物、それの製造方法及び電気メッキのための使用 Pending JP2020521060A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/062434 WO2018215057A1 (en) 2017-05-23 2017-05-23 Noble metal salt preparation, a method for production thereof and use for electroplating

Publications (2)

Publication Number Publication Date
JP2020521060A true JP2020521060A (ja) 2020-07-16
JP2020521060A5 JP2020521060A5 (enExample) 2020-08-27

Family

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Family Applications (1)

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JP2020515821A Pending JP2020521060A (ja) 2017-05-23 2017-05-23 貴金属塩調合物、それの製造方法及び電気メッキのための使用

Country Status (7)

Country Link
US (1) US20200095693A1 (enExample)
EP (1) EP3443146B1 (enExample)
JP (1) JP2020521060A (enExample)
KR (1) KR20200010340A (enExample)
CN (1) CN110770371A (enExample)
ES (1) ES2773771T3 (enExample)
WO (1) WO2018215057A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023539306A (ja) * 2020-08-31 2023-09-13 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 基板上にパラジウム被覆を析出させるための組成物
JP7607180B1 (ja) * 2024-07-17 2024-12-26 田中貴金属工業株式会社 金めっき方法、金めっき用組成物及びめっき液

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113897603B (zh) * 2021-08-31 2023-09-05 信丰正天伟电子科技有限公司 一种耐腐蚀钯类化学镀液及其应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663005A (en) * 1985-11-15 1987-05-05 Edson Gwynne I Electropolishing process
JPS6324089A (ja) * 1986-07-16 1988-02-01 Tanaka Kikinzoku Kogyo Kk 金の電解液
JP2003041378A (ja) * 2001-07-27 2003-02-13 Japan Pure Chemical Co Ltd 無電解金メッキ液
JP2003313674A (ja) * 2002-04-09 2003-11-06 Samsung Electro Mech Co Ltd モジュール化プリント基板の表面処理用合金メッキ液
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
US20120292201A1 (en) * 2011-05-18 2012-11-22 Uwin Nanotech Co., Ltd. Stripping Gold Components and the Method of Stripping Gold
WO2017067985A1 (en) * 2015-10-21 2017-04-27 Umicore Galvanotechnik Gmbh Additive for silver-palladium alloy electrolytes

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302278A (en) 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
JP3365866B2 (ja) 1994-08-01 2003-01-14 荏原ユージライト株式会社 非シアン性貴金属めっき浴
US6251249B1 (en) 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
DE19928047A1 (de) 1999-06-19 2000-12-21 Gerhard Hoffacker Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen
DE102009024396A1 (de) 2009-06-09 2010-12-16 Coventya Spa Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
DE102012004348B4 (de) * 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen
JP6198343B2 (ja) 2012-10-04 2017-09-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン系電解金めっき液
DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung
CN105316718A (zh) 2014-07-31 2016-02-10 无锡永发电镀有限公司 一种亚硫酸盐无氰镀金的电镀液及电镀方法
CN105745355B (zh) 2014-08-25 2018-03-30 小岛化学药品株式会社 还原型化学镀金液及使用该镀金液的化学镀金方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663005A (en) * 1985-11-15 1987-05-05 Edson Gwynne I Electropolishing process
JPS6324089A (ja) * 1986-07-16 1988-02-01 Tanaka Kikinzoku Kogyo Kk 金の電解液
JP2003041378A (ja) * 2001-07-27 2003-02-13 Japan Pure Chemical Co Ltd 無電解金メッキ液
JP2003313674A (ja) * 2002-04-09 2003-11-06 Samsung Electro Mech Co Ltd モジュール化プリント基板の表面処理用合金メッキ液
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
US20120292201A1 (en) * 2011-05-18 2012-11-22 Uwin Nanotech Co., Ltd. Stripping Gold Components and the Method of Stripping Gold
WO2017067985A1 (en) * 2015-10-21 2017-04-27 Umicore Galvanotechnik Gmbh Additive for silver-palladium alloy electrolytes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023539306A (ja) * 2020-08-31 2023-09-13 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 基板上にパラジウム被覆を析出させるための組成物
JP7607180B1 (ja) * 2024-07-17 2024-12-26 田中貴金属工業株式会社 金めっき方法、金めっき用組成物及びめっき液

Also Published As

Publication number Publication date
US20200095693A1 (en) 2020-03-26
WO2018215057A1 (en) 2018-11-29
EP3443146B1 (en) 2019-12-25
CN110770371A (zh) 2020-02-07
ES2773771T3 (es) 2020-07-14
KR20200010340A (ko) 2020-01-30
EP3443146A1 (en) 2019-02-20

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