JP2020521060A5 - - Google Patents
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- Publication number
- JP2020521060A5 JP2020521060A5 JP2020515821A JP2020515821A JP2020521060A5 JP 2020521060 A5 JP2020521060 A5 JP 2020521060A5 JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020521060 A5 JP2020521060 A5 JP 2020521060A5
- Authority
- JP
- Japan
- Prior art keywords
- noble metal
- salt formulation
- organic
- metal salt
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 238000009472 formulation Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/062434 WO2018215057A1 (en) | 2017-05-23 | 2017-05-23 | Noble metal salt preparation, a method for production thereof and use for electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020521060A JP2020521060A (ja) | 2020-07-16 |
| JP2020521060A5 true JP2020521060A5 (enExample) | 2020-08-27 |
Family
ID=58772561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020515821A Pending JP2020521060A (ja) | 2017-05-23 | 2017-05-23 | 貴金属塩調合物、それの製造方法及び電気メッキのための使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20200095693A1 (enExample) |
| EP (1) | EP3443146B1 (enExample) |
| JP (1) | JP2020521060A (enExample) |
| KR (1) | KR20200010340A (enExample) |
| CN (1) | CN110770371A (enExample) |
| ES (1) | ES2773771T3 (enExample) |
| WO (1) | WO2018215057A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3960898A1 (en) * | 2020-08-31 | 2022-03-02 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on a substrate |
| CN113897603B (zh) * | 2021-08-31 | 2023-09-05 | 信丰正天伟电子科技有限公司 | 一种耐腐蚀钯类化学镀液及其应用 |
| JP7607180B1 (ja) * | 2024-07-17 | 2024-12-26 | 田中貴金属工業株式会社 | 金めっき方法、金めっき用組成物及びめっき液 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4663005A (en) * | 1985-11-15 | 1987-05-05 | Edson Gwynne I | Electropolishing process |
| JPS6324089A (ja) * | 1986-07-16 | 1988-02-01 | Tanaka Kikinzoku Kogyo Kk | 金の電解液 |
| US5302278A (en) | 1993-02-19 | 1994-04-12 | Learonal, Inc. | Cyanide-free plating solutions for monovalent metals |
| JP3365866B2 (ja) | 1994-08-01 | 2003-01-14 | 荏原ユージライト株式会社 | 非シアン性貴金属めっき浴 |
| US6251249B1 (en) | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
| DE19928047A1 (de) | 1999-06-19 | 2000-12-21 | Gerhard Hoffacker | Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen |
| JP3697181B2 (ja) * | 2001-07-27 | 2005-09-21 | 日本高純度化学株式会社 | 無電解金メッキ液 |
| KR100442519B1 (ko) * | 2002-04-09 | 2004-07-30 | 삼성전기주식회사 | 모듈화 인쇄회로기판의 표면처리용 합금 도금액 |
| JP2009191335A (ja) * | 2008-02-15 | 2009-08-27 | Ishihara Chem Co Ltd | めっき液及び電子部品 |
| DE102009024396A1 (de) | 2009-06-09 | 2010-12-16 | Coventya Spa | Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen |
| TWI426157B (zh) * | 2011-05-18 | 2014-02-11 | 優勝奈米科技有限公司 | 剝金組成物以及使用方法 |
| JP5622678B2 (ja) * | 2011-07-14 | 2014-11-12 | 石原ケミカル株式会社 | イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴 |
| DE102012004348B4 (de) * | 2012-03-07 | 2014-01-09 | Umicore Galvanotechnik Gmbh | Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen |
| JP6198343B2 (ja) | 2012-10-04 | 2017-09-20 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ノンシアン系電解金めっき液 |
| DE102013215476B3 (de) | 2013-08-06 | 2015-01-08 | Umicore Galvanotechnik Gmbh | Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung |
| CN105316718A (zh) | 2014-07-31 | 2016-02-10 | 无锡永发电镀有限公司 | 一种亚硫酸盐无氰镀金的电镀液及电镀方法 |
| CN105745355B (zh) | 2014-08-25 | 2018-03-30 | 小岛化学药品株式会社 | 还原型化学镀金液及使用该镀金液的化学镀金方法 |
| EP3159435B1 (de) * | 2015-10-21 | 2018-05-23 | Umicore Galvanotechnik GmbH | Zusatz für silber-palladium-legierungselektrolyte |
-
2017
- 2017-05-23 ES ES17725581T patent/ES2773771T3/es active Active
- 2017-05-23 US US16/616,225 patent/US20200095693A1/en not_active Abandoned
- 2017-05-23 WO PCT/EP2017/062434 patent/WO2018215057A1/en not_active Ceased
- 2017-05-23 CN CN201780091162.2A patent/CN110770371A/zh not_active Withdrawn
- 2017-05-23 JP JP2020515821A patent/JP2020521060A/ja active Pending
- 2017-05-23 EP EP17725581.7A patent/EP3443146B1/en active Active
- 2017-05-23 KR KR1020197037164A patent/KR20200010340A/ko not_active Withdrawn
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