ES2773771T3 - Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado - Google Patents

Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado Download PDF

Info

Publication number
ES2773771T3
ES2773771T3 ES17725581T ES17725581T ES2773771T3 ES 2773771 T3 ES2773771 T3 ES 2773771T3 ES 17725581 T ES17725581 T ES 17725581T ES 17725581 T ES17725581 T ES 17725581T ES 2773771 T3 ES2773771 T3 ES 2773771T3
Authority
ES
Spain
Prior art keywords
metal
gold
electroplating
preparation
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES17725581T
Other languages
English (en)
Spanish (es)
Inventor
Rayko Ehnert
Prof Dr Frank Köster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saxonia Edelmetalle GmbH
Original Assignee
Saxonia Edelmetalle GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saxonia Edelmetalle GmbH filed Critical Saxonia Edelmetalle GmbH
Application granted granted Critical
Publication of ES2773771T3 publication Critical patent/ES2773771T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • C25B1/01Products
    • C25B1/28Per-compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54Contact plating, i.e. electroless electrochemical plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B13/00Diaphragms; Spacing elements
    • C25B13/04Diaphragms; Spacing elements characterised by the material
    • C25B13/08Diaphragms; Spacing elements characterised by the material based on organic materials
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00Electrolytic production of organic compounds
    • C25B3/01Products
    • C25B3/13Organo-metallic compounds
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00Electrolytic production of organic compounds
    • C25B3/20Processes
    • C25B3/23Oxidation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
ES17725581T 2017-05-23 2017-05-23 Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado Active ES2773771T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2017/062434 WO2018215057A1 (en) 2017-05-23 2017-05-23 Noble metal salt preparation, a method for production thereof and use for electroplating

Publications (1)

Publication Number Publication Date
ES2773771T3 true ES2773771T3 (es) 2020-07-14

Family

ID=58772561

Family Applications (1)

Application Number Title Priority Date Filing Date
ES17725581T Active ES2773771T3 (es) 2017-05-23 2017-05-23 Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado

Country Status (7)

Country Link
US (1) US20200095693A1 (enExample)
EP (1) EP3443146B1 (enExample)
JP (1) JP2020521060A (enExample)
KR (1) KR20200010340A (enExample)
CN (1) CN110770371A (enExample)
ES (1) ES2773771T3 (enExample)
WO (1) WO2018215057A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3960898A1 (en) * 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate
CN113897603B (zh) * 2021-08-31 2023-09-05 信丰正天伟电子科技有限公司 一种耐腐蚀钯类化学镀液及其应用
JP7607180B1 (ja) * 2024-07-17 2024-12-26 田中貴金属工業株式会社 金めっき方法、金めっき用組成物及びめっき液

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663005A (en) * 1985-11-15 1987-05-05 Edson Gwynne I Electropolishing process
JPS6324089A (ja) * 1986-07-16 1988-02-01 Tanaka Kikinzoku Kogyo Kk 金の電解液
US5302278A (en) 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
JP3365866B2 (ja) 1994-08-01 2003-01-14 荏原ユージライト株式会社 非シアン性貴金属めっき浴
US6251249B1 (en) 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
DE19928047A1 (de) 1999-06-19 2000-12-21 Gerhard Hoffacker Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen
JP3697181B2 (ja) * 2001-07-27 2005-09-21 日本高純度化学株式会社 無電解金メッキ液
KR100442519B1 (ko) * 2002-04-09 2004-07-30 삼성전기주식회사 모듈화 인쇄회로기판의 표면처리용 합금 도금액
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
DE102009024396A1 (de) 2009-06-09 2010-12-16 Coventya Spa Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
TWI426157B (zh) * 2011-05-18 2014-02-11 優勝奈米科技有限公司 剝金組成物以及使用方法
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
DE102012004348B4 (de) * 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen
JP6198343B2 (ja) 2012-10-04 2017-09-20 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン系電解金めっき液
DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung
CN105316718A (zh) 2014-07-31 2016-02-10 无锡永发电镀有限公司 一种亚硫酸盐无氰镀金的电镀液及电镀方法
CN105745355B (zh) 2014-08-25 2018-03-30 小岛化学药品株式会社 还原型化学镀金液及使用该镀金液的化学镀金方法
EP3159435B1 (de) * 2015-10-21 2018-05-23 Umicore Galvanotechnik GmbH Zusatz für silber-palladium-legierungselektrolyte

Also Published As

Publication number Publication date
US20200095693A1 (en) 2020-03-26
WO2018215057A1 (en) 2018-11-29
EP3443146B1 (en) 2019-12-25
CN110770371A (zh) 2020-02-07
JP2020521060A (ja) 2020-07-16
KR20200010340A (ko) 2020-01-30
EP3443146A1 (en) 2019-02-20

Similar Documents

Publication Publication Date Title
JP6370380B2 (ja) 銀−パラジウム合金の電着のための電解質、及びその析出方法
TWI468556B (zh) 酸性金合金電鍍液
US8900436B2 (en) Pd and Pd-Ni electrolyte baths
US20160024683A1 (en) Apparatus and method for electrolytic deposition of metal layers on workpieces
RU2666391C1 (ru) Ванна для электролитического нанесения покрытия из медно-никелевого сплава.
ES2773771T3 (es) Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado
EP3159435B1 (de) Zusatz für silber-palladium-legierungselektrolyte
JP2011520037A (ja) 改良された銅−錫電解液及び青銅層の析出方法
CA1291440C (en) Palladium and palladium alloy plating
TWI846730B (zh) 熱穩定銀合金層
JPH10317183A (ja) 非シアンの電気金めっき浴
US12312704B2 (en) Platinum electrolyte
JP2020117803A (ja) インジウム電気めっき組成物及びインジウムをニッケル上に電気めっきするための方法
HK40001456A (en) Noble metal salt preparation, a method for production thereof and use for electroplating
HK40001456B (en) Noble metal salt preparation, a method for production thereof and use for electroplating
US11255021B2 (en) Aqueous formulation for creating a layer of gold and silver
JP2016532004A (ja) 電気めっき浴
JP2010150606A (ja) 電解再生式の無電解スズメッキ方法