CN110662804A - 紫外线可固化有机硅端子密封剂 - Google Patents

紫外线可固化有机硅端子密封剂 Download PDF

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Publication number
CN110662804A
CN110662804A CN201780090871.9A CN201780090871A CN110662804A CN 110662804 A CN110662804 A CN 110662804A CN 201780090871 A CN201780090871 A CN 201780090871A CN 110662804 A CN110662804 A CN 110662804A
Authority
CN
China
Prior art keywords
composition
alkenyl
curable silicone
organopolysiloxane
mercapto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780090871.9A
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English (en)
Chinese (zh)
Inventor
陈其
方雷
魏鹏
赵轶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Silicones Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Silicones Corp filed Critical Dow Silicones Corp
Publication of CN110662804A publication Critical patent/CN110662804A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/132—Phenols containing keto groups, e.g. benzophenones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
CN201780090871.9A 2017-06-09 2017-06-09 紫外线可固化有机硅端子密封剂 Pending CN110662804A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/087690 WO2018223365A1 (en) 2017-06-09 2017-06-09 Uv curable silicone terminal sealant

Publications (1)

Publication Number Publication Date
CN110662804A true CN110662804A (zh) 2020-01-07

Family

ID=64566399

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780090871.9A Pending CN110662804A (zh) 2017-06-09 2017-06-09 紫外线可固化有机硅端子密封剂

Country Status (6)

Country Link
US (1) US20200109285A1 (enExample)
JP (1) JP2020528940A (enExample)
KR (1) KR20200018497A (enExample)
CN (1) CN110662804A (enExample)
TW (1) TW201903056A (enExample)
WO (1) WO2018223365A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115038739A (zh) * 2020-02-04 2022-09-09 美国陶氏有机硅公司 高频有机硅阻尼凝胶

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6978690B2 (ja) * 2018-05-25 2021-12-08 日亜化学工業株式会社 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置
EP3927550B1 (en) * 2019-02-18 2023-03-29 3M Innovative Properties Company Radiation-curable composition containing mercapto-functional polyorganosiloxanes for additive-manufacturing technology
CN110484201A (zh) * 2019-09-30 2019-11-22 杭州奥方科技有限公司 一种uv固化的硅类胶水及利用其制造密封圈的方法
US11623989B2 (en) * 2019-11-28 2023-04-11 Dow Silicones Corporation Photocurable silicone composition
CN115851221A (zh) * 2022-07-15 2023-03-28 杭州奥方科技有限公司 一种快速成型的uv固化硅类密封胶及其制备方法
EP4636042A1 (en) * 2022-12-14 2025-10-22 Momentive Performance Materials Japan LLC Ultraviolet curable silicone composition
WO2025225449A1 (ja) * 2024-04-26 2025-10-30 信越化学工業株式会社 光造形用紫外線硬化性シリコーン組成物、その硬化物および硬化方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158988A (en) * 1990-11-27 1992-10-27 Toshiba Silicone Co., Ltd. Photo-curable silicone compositions and adhesive silicone compositions
CN103338930A (zh) * 2011-01-28 2013-10-02 道康宁东丽株式会社 底漆组合物和层合物
CN103814101A (zh) * 2011-09-22 2014-05-21 株式会社钟化 固化性组合物及其固化物
WO2016156881A1 (en) * 2015-04-02 2016-10-06 Advanced Insulation Plc Coating material
CN106804110A (zh) * 2014-09-17 2017-06-06 美国道康宁公司 使用可光固化的有机硅组合物的3d印刷方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323253B1 (en) * 1998-06-01 2001-11-27 Loctite Corporation Flame-retardant UV and UV/moisture curable silicone compositions
JP2005171189A (ja) * 2003-12-15 2005-06-30 Ge Toshiba Silicones Co Ltd 紫外線硬化型シリコーンゲル組成物
US9243083B2 (en) * 2008-04-03 2016-01-26 Henkel IP & Holding GmbH Thiol-ene cured oil-resistant polyacrylate sealants for in-place gasketing applications

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158988A (en) * 1990-11-27 1992-10-27 Toshiba Silicone Co., Ltd. Photo-curable silicone compositions and adhesive silicone compositions
CN103338930A (zh) * 2011-01-28 2013-10-02 道康宁东丽株式会社 底漆组合物和层合物
CN103814101A (zh) * 2011-09-22 2014-05-21 株式会社钟化 固化性组合物及其固化物
CN106804110A (zh) * 2014-09-17 2017-06-06 美国道康宁公司 使用可光固化的有机硅组合物的3d印刷方法
WO2016156881A1 (en) * 2015-04-02 2016-10-06 Advanced Insulation Plc Coating material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115038739A (zh) * 2020-02-04 2022-09-09 美国陶氏有机硅公司 高频有机硅阻尼凝胶
CN115038739B (zh) * 2020-02-04 2023-11-14 美国陶氏有机硅公司 高频有机硅阻尼凝胶

Also Published As

Publication number Publication date
TW201903056A (zh) 2019-01-16
KR20200018497A (ko) 2020-02-19
WO2018223365A1 (en) 2018-12-13
US20200109285A1 (en) 2020-04-09
JP2020528940A (ja) 2020-10-01

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