CN110620071A - 一种自动化点胶封装运输的二极管封装装置 - Google Patents
一种自动化点胶封装运输的二极管封装装置 Download PDFInfo
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- CN110620071A CN110620071A CN201911055567.8A CN201911055567A CN110620071A CN 110620071 A CN110620071 A CN 110620071A CN 201911055567 A CN201911055567 A CN 201911055567A CN 110620071 A CN110620071 A CN 110620071A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 105
- 210000000078 claw Anatomy 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims abstract description 34
- 230000033001 locomotion Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 abstract description 9
- 230000032258 transport Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911055567.8A CN110620071B (zh) | 2019-10-31 | 2019-10-31 | 一种自动化点胶封装运输的二极管封装装置 |
Applications Claiming Priority (1)
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CN201911055567.8A CN110620071B (zh) | 2019-10-31 | 2019-10-31 | 一种自动化点胶封装运输的二极管封装装置 |
Publications (2)
Publication Number | Publication Date |
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CN110620071A true CN110620071A (zh) | 2019-12-27 |
CN110620071B CN110620071B (zh) | 2021-12-10 |
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CN201911055567.8A Active CN110620071B (zh) | 2019-10-31 | 2019-10-31 | 一种自动化点胶封装运输的二极管封装装置 |
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CN (1) | CN110620071B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111347309A (zh) * | 2020-04-09 | 2020-06-30 | 林锡贵 | 一种用于木材加工的实木板非安装面拉丝装置 |
CN112893018A (zh) * | 2021-02-04 | 2021-06-04 | 深圳群芯微电子有限责任公司 | 一种汽车集成电路芯片点胶封装装置 |
CN115064463A (zh) * | 2022-05-18 | 2022-09-16 | 深圳市麦思浦半导体有限公司 | 二极管封装设备及其封装方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102179342A (zh) * | 2011-04-12 | 2011-09-14 | 深圳利亚德光电有限公司 | Led自动灌胶系统 |
CN206301759U (zh) * | 2017-01-03 | 2017-07-04 | 江苏新智达新能源设备有限公司 | 一种二极管封装的点胶取晶固晶机构 |
CN107146839A (zh) * | 2017-05-04 | 2017-09-08 | 厦门大学 | 一种led连续固晶装置及其固晶方法 |
CN107845720A (zh) * | 2017-06-13 | 2018-03-27 | 泉州台商投资区华奥电子科技有限公司 | 一种改进式led点胶封装设备 |
CN207250465U (zh) * | 2017-08-30 | 2018-04-17 | 太仓天宇电子有限公司 | 一种用于二极管封装的点胶装置 |
CN110369222A (zh) * | 2019-07-24 | 2019-10-25 | 安庆师范大学 | 一种应用于物理微电子封装的微电子点胶设备 |
-
2019
- 2019-10-31 CN CN201911055567.8A patent/CN110620071B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102179342A (zh) * | 2011-04-12 | 2011-09-14 | 深圳利亚德光电有限公司 | Led自动灌胶系统 |
CN206301759U (zh) * | 2017-01-03 | 2017-07-04 | 江苏新智达新能源设备有限公司 | 一种二极管封装的点胶取晶固晶机构 |
CN107146839A (zh) * | 2017-05-04 | 2017-09-08 | 厦门大学 | 一种led连续固晶装置及其固晶方法 |
CN107845720A (zh) * | 2017-06-13 | 2018-03-27 | 泉州台商投资区华奥电子科技有限公司 | 一种改进式led点胶封装设备 |
CN207250465U (zh) * | 2017-08-30 | 2018-04-17 | 太仓天宇电子有限公司 | 一种用于二极管封装的点胶装置 |
CN110369222A (zh) * | 2019-07-24 | 2019-10-25 | 安庆师范大学 | 一种应用于物理微电子封装的微电子点胶设备 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111347309A (zh) * | 2020-04-09 | 2020-06-30 | 林锡贵 | 一种用于木材加工的实木板非安装面拉丝装置 |
CN111347309B (zh) * | 2020-04-09 | 2021-01-29 | 黄玉敏 | 一种用于木材加工的实木板非安装面拉丝装置 |
CN112893018A (zh) * | 2021-02-04 | 2021-06-04 | 深圳群芯微电子有限责任公司 | 一种汽车集成电路芯片点胶封装装置 |
CN112893018B (zh) * | 2021-02-04 | 2021-12-21 | 深圳群芯微电子有限责任公司 | 一种汽车集成电路芯片点胶封装装置 |
CN115064463A (zh) * | 2022-05-18 | 2022-09-16 | 深圳市麦思浦半导体有限公司 | 二极管封装设备及其封装方法 |
CN115064463B (zh) * | 2022-05-18 | 2024-05-14 | 深圳市麦思浦半导体有限公司 | 二极管封装设备及其封装方法 |
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CN110620071B (zh) | 2021-12-10 |
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Effective date of registration: 20211125 Address after: No. 189, Jiefang Road, Yancheng City, Jiangsu Province Applicant after: YANCHENG POWER SUPPLY BRANCH, STATE GRID JIANGSU ELECTRIC POWER Co.,Ltd. Applicant after: YANCHENG DAFENG POWER SUPPLY BRANCH OF STATE GRID JIANGSU ELECTRIC POWER Co.,Ltd. Applicant after: DAFENG LONGSHENG INDUSTRIAL Co.,Ltd. Address before: 427000 1205, Donghui building, No. 384, Ziwu West Road, Yongding District, Zhangjiajie City, Hunan Province Applicant before: Li Na |
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