CN1104741C - 半导体封装及其制造方法 - Google Patents

半导体封装及其制造方法 Download PDF

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CN1104741C
CN1104741C CN97115025A CN97115025A CN1104741C CN 1104741 C CN1104741 C CN 1104741C CN 97115025 A CN97115025 A CN 97115025A CN 97115025 A CN97115025 A CN 97115025A CN 1104741 C CN1104741 C CN 1104741C
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lead
semiconductor chip
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CN1187037A (zh
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全东锡
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SK Hynix Inc
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LG Semicon Co Ltd
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Abstract

一种半导体封装包括基本为平板形的第一散热片和与第一散热片耦合的第二散热片。半导体芯片安装在第一散热片的内表面上，第三散热片固定于半导体芯片的中央部分上。多根内引线固定于半导体芯片的侧边，外引线从内引线延伸，并相对于内引线向外弯曲。导线连接内引线与半导体芯片。模制部件密封半导体芯片、内引线、部分外引线及导线。

Description

半导体封装及其制造方法
技术领域
本发明涉及一种半导体封装，特别涉及一种具有散热片的半导体封装及其制造方法。尽管本发明广泛适用于各种半导体芯片，但尤其适用于大功率芯片。
背景技术
图1是展示常规底部引线半导体封装的剖面图。参见图1，常规底部引线封装包括与印刷电路板(PCB)(未示出)电连接的多根底部引线2a，从每根底部引线2a向上弯曲的内引线2b，借助粘结材料3安装在每根底部引线2a上表面上的的半导体芯片1，电连接半导体芯片1的芯片焊盘(未示出)与内引线2b的导线4，及模制部件5。模制部件包封半导体芯片1、底部引线2a、内引线2b及导线4，但暴露出底部引线2a的下表面，以便能够安装到PCB上并与之连接。
然而，上述常规底部引线半导体封装有以下缺点，即，由于模制部件5的热传导率低，半导体芯片1产生的热不能有效地辐射到芯片外部。具体地，这种封装对于要求高热传导率的大功率芯片来说是不适用的。
发明内容
因此，本发明的目的是提供一种半导体封装及其制造方法，基本上能够解决现有技术的局限和缺点造成的一个或多个问题。
本发明的目的是提供一种能增大热传导效率的改进的半导体封装。
本发明的其它特点和优点如以下的说明书所述，部分可从说明书中显现，或可以实施本发明获知。特别是书面说明和权利要求书及附图中指出的结构将会实现和获得本发明的目的和优点。
为了获得这些和其它优点，根据本发明的目的，正如所概述和具体说明的那样，本发明的半导体封装包括：第一散热片；竖直形成在第一散热片侧部的第二散热片；安装在第一散热片表面上的半导体芯片；安装在半导体芯片上的多根引线；连接多根引线与半导体芯片的导线；半导体芯片上的粘接材料；附着在粘接材料上的第三散热片；和密封半导体芯片、多根引线及导线的模制部件。
按本发明的再一方案，一种制造半导体封装的方法包括以下步骤：形成第一散热片；在第一散热片的侧部竖直形成第二散热片；把半导体芯片安装到第一散热片上；把多根引线安装在半导体芯片上；用导线连接引线与半导体芯片；在半导体芯片上形成粘接材料；在粘接材料上形成第三散热片；及模制半导体芯片、引线及导线，构成封装。
应该明白，上述的概括说明和以下的详细说明皆是例证性和说明性的，旨在对所申请的发明作进一步地说明。
附图说明
用于进一步理解发明的各附图与说明书结合，并构成说明书的一部分，它们展示了本发明的实施例，与说明书一起说明本发明的原理。
各附图中：
图1是展示常规底部引线半导体封装的剖面图；
图2是展示本发明实施例的底部引线半导体封装的剖面图；
图3是展示本发明底部引线半导体封装的底视图；
图4是图2中“A”部分的放大剖面图；
图5是展示安装于印刷电路板(PCB)上的本发明底部引线半导体封装的剖面图；及
图6A-6H是展示本发明的制造底部引线半导体封装的方法的剖面图。
具体实施方式
下面结合示于附图中的实例对本发明的优选实施例作详细说明。
图2是展示本发明的底部引线半导体封装的剖面图。参见图2，在第一散热片(第一热沉)6的侧面部分垂直地形成第二散热片7。第二散热片可以附着在第一散热片6上，或可以与散热片6成为一体。第一和第二散热片6和7最好由具有高热传导率和良好机械强度的金属和陶瓷材料制备。半导体芯片1借助第一粘结材料3安装在第一散热片6上。第一粘结材料最好是由具有良好热传导率的材料制成。引线框2的内引线2b借助粘结材料固定到半导体芯片1的两侧，且第三散热片8借助第二粘结材料3a固定于半导体芯片1上表面的中央部分上。引线框2最好形成为使其底部引线2a从内引线2b向上弯曲，且最好由铜合金或镍合金制成。
与第一和第二散热片类似，第三散热片8最好也由具有高热传导率和良好机械强度的金属或陶瓷材料制成。另外，第三散热片8最好包括形成于第三散热片8的两侧边缘部分的凸缘11。突起部分11a从每个凸缘11延伸，如图4所示。具体地，突起部分11 a形成为圆形或多边形，用以增强第三散热片8与模制部件5的粘结强度。内引线2b和半导体芯片的芯片焊盘(未示出)由导电材料制的导线4连接。第一至第三散热片6、7和8限定的部分中填充模制树脂，以密封半导体芯片1、内引线2b、底部引线2a和导线4。如图3所示，模制部件5形成，使底部引线2a部分外露。
如图3所示，底部引线2a可以电连接PCB(未示出)，且不包括底部引线2a在内的底部引线半导体封装的底部最好大多被第三散热片8所覆盖。
图5是展示本发明的底部引线半导体封装安装在PCB(印刷电路板)上的状况的剖面图。参见图5，只有底部引线2a借助于焊料9与PCB 10连接。
图6A-6H是展示本发明的制造底部引线半导体封装的方法的剖面图。虽然这里运用了元件的“上”侧这一术语，但应该理解，该术语和其它术语只是对附图作的描绘。
图6A是展示第二散热片7垂直地与平板形第一散热片6的侧面边缘部分联接的步骤的剖面图。第一和第二散热片6和7最好形成为一体，且由具有高热传导率和机械强度的金属和陶瓷材料制成。图6B是展示在第一散热片6的上表面上均匀涂敷第一粘结材料3的步骤的剖面图。第一粘结材料3由具有良好热传导效率的材料制成。
图6C是展示利用第一粘结材料3在第一散热片6的上表面上固定半导体芯片1的步骤的剖面图。图6D是展示利用粘结材料在半导体芯片1的上表面两侧边上固定内引线2b的步骤的剖面图。引线框2从内引线2b向上弯曲，用以形成底部引线结构。
图6E中展示利用导线4连接内引线2b与半导体芯片1的芯片焊盘的步骤的剖面图。导线4由合适的导电材料制成。图6F是展示在半导体芯片1的上部中央部分上均匀涂敷第二粘结材料3a的步骤的剖面图。第二粘结部件3a由具有良好热传导率的材料制成。
图6G是展示利用第二粘结材料3a在半导体芯片1的上部中央部分固定第三散热片8的步骤的剖面图。第三散热片8由具有良好热传导率和机械强度的金属或陶瓷材料制成。图6H是展示用模制树脂填充由第一至第三散热片6、7、和8限定的部分、并使底部引线2a暴露于外的步骤的剖面图，该步骤用于密封半导体芯片1、内引线2b、底部引线2a和导线4，从而形成模制部件5。
如上所述，根据本发明的底部引线半导体封装旨在利用固定半导体芯片1上下表面及侧面的散热片6、7、和8更有效地辐射半导体芯片1产生的热。所以，本发明的底部引线半导体封装特别适用于需要高热传导效率以散发芯片工作期间产生的大量热量的大功率芯片。另外，通过由第三散热片8的凸缘11形成例如圆形或多边形的突起部分11a可以增强模制部件5的粘结强度。
显然，对于本领域的普通技术人员来说，在不脱离本发明精神或范围的情况下，可以做出各种改型和变化。但是，本发明将覆盖这些会落入所附权利要求书及其延伸的范围内的改型和变化。

Claims (12)

1.一种半导体封装，该封装包括：
第一散热片；
竖直形成在第一散热片侧部的第二散热片；
安装在第一散热片表面上的半导体芯片；
安装在半导体芯片上的多根引线；
连接多根引线与半导体芯片的导线；
半导体芯片上的粘接材料；
附着在粘接材料上的第三散热片；和
密封半导体芯片、多根引线及导线的模制部件。
2.根据权利要求1的半导体封装，其特征在于，第二散热片与第一散热片成为一体。
3.根据权利要求1的半导体封装，其特征在于，第三散热片包括至少在其一个边缘部分的凸缘。
4.根据权利要求3的半导体封装，其特征在于，凸缘包括从凸缘延伸的突起部分。
5.根据权利要求1的半导体封装，其特征在于，所述引线部分暴露于外侧。
6.根据权利要求1的半导体封装，其特征在于，多根引线利用粘接材料与半导体芯片连接。
7.根据权利要求1的半导体封装，其特征在于，第一、第二散热片为金属或陶瓷材料。
8.一种制造半导体封装的方法，该方法包括以下步骤：
形成第一散热片；
在第一散热片的侧部竖直形成第二散热片；
把半导体芯片安装到第一散热片上；
把多根引线安装在半导体芯片上；
用导线连接引线与半导体芯片；
在半导体芯片上形成粘接材料；
在粘接材料上形成第三散热片；及
模制半导体芯片、引线及导线，构成封装。
9.根据权利要求8的方法，其特征在于，第二散热片与第一散热片形成为一体。
10.根据权利要求8的方法，其特征在于，第三散热片包括在其至少一个边缘部分的凸缘。
11.根据权利要求10的方法，其特征在于，凸缘包括从凸缘延伸的突起部分。
12.根据权利要求8的方法，其特征在于，所述引线部分暴露于外侧。
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