CN110462808B - 用于基板输送设备位置补偿的方法和设备 - Google Patents
用于基板输送设备位置补偿的方法和设备 Download PDFInfo
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- CN110462808B CN110462808B CN201880021563.5A CN201880021563A CN110462808B CN 110462808 B CN110462808 B CN 110462808B CN 201880021563 A CN201880021563 A CN 201880021563A CN 110462808 B CN110462808 B CN 110462808B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
- B25J9/0027—Means for extending the operation range
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
- B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
- B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/12—Programme-controlled manipulators characterised by positioning means for manipulator elements electric
- B25J9/126—Rotary actuators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1602—Programme controls characterised by the control system, structure, architecture
- B25J9/1605—Simulation of manipulator lay-out, design, modelling of manipulator
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762450818P | 2017-01-26 | 2017-01-26 | |
| US62/450818 | 2017-01-26 | ||
| US15/880,387 US10651067B2 (en) | 2017-01-26 | 2018-01-25 | Method and apparatus for substrate transport apparatus position compensation |
| US15/880387 | 2018-01-25 | ||
| PCT/US2018/015512 WO2018140769A1 (en) | 2017-01-26 | 2018-01-26 | Method and apparatus for substrate transport apparatus position compensation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110462808A CN110462808A (zh) | 2019-11-15 |
| CN110462808B true CN110462808B (zh) | 2024-05-14 |
Family
ID=62978858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880021563.5A Active CN110462808B (zh) | 2017-01-26 | 2018-01-26 | 用于基板输送设备位置补偿的方法和设备 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US10651067B2 (ja) |
| JP (2) | JP2020505775A (ja) |
| KR (2) | KR20230150410A (ja) |
| CN (1) | CN110462808B (ja) |
| WO (1) | WO2018140769A1 (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
| US11101163B2 (en) * | 2018-01-30 | 2021-08-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for automated robotic arm sensing |
| CN109760047B (zh) * | 2018-12-28 | 2021-06-18 | 浙江工业大学 | 一种基于视觉传感器的舞台机器人预测控制方法 |
| KR20220025899A (ko) | 2019-07-12 | 2022-03-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 동시 기판 이송을 위한 로봇 |
| US11574826B2 (en) | 2019-07-12 | 2023-02-07 | Applied Materials, Inc. | High-density substrate processing systems and methods |
| US11117265B2 (en) | 2019-07-12 | 2021-09-14 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| WO2021011229A1 (en) | 2019-07-12 | 2021-01-21 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| US11443973B2 (en) * | 2019-07-12 | 2022-09-13 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| US11164769B2 (en) | 2019-07-30 | 2021-11-02 | Brooks Automation, Inc. | Robot embedded vision apparatus |
| JP6983206B2 (ja) * | 2019-10-15 | 2021-12-17 | 株式会社アルバック | 基板搬送装置、および、基板搬送方法 |
| JP2021162854A (ja) | 2020-03-31 | 2021-10-11 | 住友化学株式会社 | ネガ型レジスト組成物 |
| CN112202525B (zh) * | 2020-10-29 | 2022-11-01 | 电信科学技术第五研究所有限公司 | 一种多板卡设备的pps延迟自动测量及补偿方法 |
| KR102482687B1 (ko) * | 2020-12-24 | 2022-12-28 | 동명대학교산학협력단 | 스윙 암과 통합된 패드 프로파일 측정 시스템 |
| KR102590268B1 (ko) * | 2021-03-25 | 2023-10-18 | 피에스케이 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| CN113437005A (zh) * | 2021-06-18 | 2021-09-24 | 深圳市卓兴半导体科技有限公司 | 一种可变角度的固晶方法、系统及固晶机 |
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| JP2000183128A (ja) * | 1998-12-17 | 2000-06-30 | Komatsu Ltd | ワーク搬送装置の制御装置 |
| CN1816907A (zh) * | 2003-07-04 | 2006-08-09 | 乐华股份有限公司 | 薄板状基板的运送装置及其运送控制方法 |
| CN103503127A (zh) * | 2011-03-11 | 2014-01-08 | 布鲁克斯自动化公司 | 基底处理工具 |
| CN104349872A (zh) * | 2012-02-10 | 2015-02-11 | 布鲁克斯自动化公司 | 基板处理设备 |
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| JP2000176876A (ja) * | 1998-12-10 | 2000-06-27 | Komatsu Ltd | ワーク搬送装置およびワーク搬送装置の姿勢保持方法 |
| JP2001127136A (ja) * | 1999-10-29 | 2001-05-11 | Applied Materials Inc | 基板搬送ロボットの検査装置 |
| US20030014155A1 (en) * | 2001-07-12 | 2003-01-16 | Applied Material, Inc. | High temperature substrate transfer robot |
| US7572092B2 (en) * | 2002-10-07 | 2009-08-11 | Brooks Automation, Inc. | Substrate alignment system |
| US6813543B2 (en) * | 2002-10-08 | 2004-11-02 | Brooks-Pri Automation, Inc. | Substrate handling system for aligning and orienting substrates during a transfer operation |
| JP2004299010A (ja) * | 2003-03-31 | 2004-10-28 | Fanuc Ltd | ロボットのたわみ補正装置及びたわみ補正方法 |
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| US8600150B2 (en) * | 2006-02-13 | 2013-12-03 | Samsung Electronics Co., Ltd. | Wafer aligning apparatus and related method |
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| JP2008105125A (ja) * | 2006-10-25 | 2008-05-08 | Nachi Fujikoshi Corp | 搬送ロボットシステムのたわみ補正装置 |
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| JP5391857B2 (ja) * | 2009-06-17 | 2014-01-15 | シンフォニアテクノロジー株式会社 | 基板搬送ロボット |
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| KR102469258B1 (ko) | 2014-11-18 | 2022-11-22 | 퍼시몬 테크놀로지스 코포레이션 | 엔드 이펙터 위치 추정을 위한 로봇의 적응형 배치 시스템 |
| DE102015013495B4 (de) * | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
| US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
| JP2023074944A (ja) * | 2021-11-18 | 2023-05-30 | 東京エレクトロン株式会社 | 連接処理容器及び基板処理方法。 |
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2018
- 2018-01-25 US US15/880,387 patent/US10651067B2/en active Active
- 2018-01-26 KR KR1020237035565A patent/KR20230150410A/ko not_active Application Discontinuation
- 2018-01-26 WO PCT/US2018/015512 patent/WO2018140769A1/en active Application Filing
- 2018-01-26 KR KR1020197024819A patent/KR102592313B1/ko active IP Right Grant
- 2018-01-26 JP JP2019540413A patent/JP2020505775A/ja active Pending
- 2018-01-26 CN CN201880021563.5A patent/CN110462808B/zh active Active
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2020
- 2020-05-12 US US16/872,864 patent/US11251059B2/en active Active
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2022
- 2022-02-15 US US17/651,183 patent/US11972965B2/en active Active
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2023
- 2023-02-13 JP JP2023020320A patent/JP2023062050A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000183128A (ja) * | 1998-12-17 | 2000-06-30 | Komatsu Ltd | ワーク搬送装置の制御装置 |
| CN1816907A (zh) * | 2003-07-04 | 2006-08-09 | 乐华股份有限公司 | 薄板状基板的运送装置及其运送控制方法 |
| CN103503127A (zh) * | 2011-03-11 | 2014-01-08 | 布鲁克斯自动化公司 | 基底处理工具 |
| CN104349872A (zh) * | 2012-02-10 | 2015-02-11 | 布鲁克斯自动化公司 | 基板处理设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023062050A (ja) | 2023-05-02 |
| KR102592313B1 (ko) | 2023-10-23 |
| KR20230150410A (ko) | 2023-10-30 |
| US20180286728A1 (en) | 2018-10-04 |
| JP2020505775A (ja) | 2020-02-20 |
| CN110462808A (zh) | 2019-11-15 |
| US11251059B2 (en) | 2022-02-15 |
| KR20190109487A (ko) | 2019-09-25 |
| US11972965B2 (en) | 2024-04-30 |
| US20220172973A1 (en) | 2022-06-02 |
| WO2018140769A1 (en) | 2018-08-02 |
| US20200273734A1 (en) | 2020-08-27 |
| WO2018140769A8 (en) | 2019-08-15 |
| US10651067B2 (en) | 2020-05-12 |
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