CN110291151A - 树脂组合物、成形体、层叠体、涂布材料及粘接剂 - Google Patents
树脂组合物、成形体、层叠体、涂布材料及粘接剂 Download PDFInfo
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- CN110291151A CN110291151A CN201880011307.8A CN201880011307A CN110291151A CN 110291151 A CN110291151 A CN 110291151A CN 201880011307 A CN201880011307 A CN 201880011307A CN 110291151 A CN110291151 A CN 110291151A
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- resin combination
- epoxide
- curing agent
- resin
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Abstract
一种树脂组合物,其含有环氧化合物和锂部分固定型蒙皂石。
Description
技术领域
本发明涉及树脂组合物、成形体、层叠体、涂布材料及粘接剂。
背景技术
食品等的包装中使用的包装材料要求内容物的保护、耐蒸煮性、耐热性、透明性、加工性等功能。为了保持内容物的品质,阻气性特别重要。最近,不仅包装材料、对于太阳能电池、半导体等电子材料中使用的材料,也逐渐要求高的阻气性。
专利文献1中记载了通过将具有羟基的树脂及异氰酸酯化合物与粘土矿物等板状无机化合物及遮光剂组合来提高阻气性等特性。
另外,专利文献2中记载了以改性粘土为主要构成成分的材料,使用改性粘土,根据需要使用添加剂,使改性粘土结晶取向,使其致密地层叠,由此可得到具备能作为自支撑膜利用的具备机械强度、阻气性、耐水性、热稳定性及柔韧性(flexibility)的膜材。
现有技术文献
专利文献
专利文献1:国际公开第2013/027609号
专利文献2:日本特开2007-277078号公报
发明内容
发明要解决的问题
专利文献1中记载的那样的板状无机化合物的体积高、另外难以得到与树脂的良好的亲和性。因此,添加量及分散性有限制。因此难以通过增加添加量来获得更高的阻气性,即使假设能够增加填料的添加量,也得不到充分的分散性、得不到充分的阻气性。
另外,专利文献2中记载的粘土膜是在成膜后进行加热从而成为自支撑膜的,因此粘土膜成膜的基材(例如树脂基材)要求非常高的耐热性。因此,专利文献2中记载的粘土膜只能使用耐热性非常高的基材(例如树脂基材),存在使用用途受限制的问题。进而,专利文献2中记载的自支撑膜为了发挥高的阻气性而配混了大量填料。但是,若填料量过多,则组合物的柔软性受损,因此例如用于软包装用的薄膜用途等的情况下,有薄膜的柔软性不足的问题。因此,无论是填料高填充情况下、还是低填充的情况下,依然要求能够发挥高的阻气性的树脂组合物。
因此,本发明的目的在于,提供与以往的树脂组合物相比,阻气性、特别是水蒸气阻隔性及氧阻隔性更优异的树脂组合物。
用于解决问题的方案
本发明的一个方面提供一种树脂组合物,其含有环氧化合物和锂部分固定型蒙皂石。该树脂组合物在环氧化合物中组合有锂部分固定型蒙皂石,因此水蒸气阻隔性、氧阻隔性(例如高湿度下的氧阻隔性)等阻气性优异。即,利用该树脂组合物,能够得到具有优异的阻气性的树脂膜。
环氧化合物的环氧当量优选为50~3000g/eq。由此,水蒸气阻隔性及氧阻隔性进一步更优异。
环氧化合物优选包含芳香环结构及脂环结构中的至少一种结构。由此,水蒸气阻隔性及氧阻隔性进一步更优异。
锂部分固定型蒙皂石的阳离子交换容量优选为1~70meq/100g。由此,水蒸气阻隔性及氧阻隔性进一步更优异。
树脂组合物可以还含有固化剂。树脂组合物含有固化剂的情况下,能够通过热使环氧基开环聚合使其固化,能够得到具有进一步更优异的阻隔性的树脂膜。
固化剂优选为选自由酸酐系固化剂、酚系固化剂及酰胺系固化剂组成的组中的至少一种固化剂。即,树脂组合物优选含有这些固化剂中的至少一种。由此,水蒸气阻隔性及氧阻隔性进一步更优异。
锂部分固定型蒙皂石的含量相对于树脂组合物的不挥发成分总量优选为3~70质量%。通过设为这样的含量,水蒸气阻隔性及氧阻隔性优异、并且成形性进一步更优异。
本发明的一个方面提供上述树脂组合物的成形体、及在基材上具备该成形体的层叠体(具备基材和设置于该基材上的成形体的层叠体)。
本发明的一个方面的树脂组合物的水蒸气阻隔性及氧阻隔性优异,因此可适当地用于阻气材料、涂布材料、粘接剂等用途。
发明的效果
根据本发明,可提供阻气性、特别是水蒸气阻隔性及氧阻隔性更优异的树脂组合物。
具体实施方式
以下,详细地对本发明的适宜的实施方式进行说明。但是,本发明并不限定于以下的实施方式。
本实施方式的树脂组合物含有环氧化合物和锂部分固定型蒙皂石。
蒙皂石(smectite)为具有层结构的页硅酸盐矿物(层状粘土矿物)的一种。作为蒙皂石的具体的结构,已知有蒙脱石(montmorillonite)、贝得石、皂石、锂蒙脱石、硅镁石、锌蒙脱石等结构。这些当中,作为粘土材料的结构,优选选自由蒙脱石及硅镁石组成的组中的至少一种结构。这些结构在八面体片的金属元素的一部分具有与低化合价金属元素的同型置换、缺陷等。因此,八面体片带负电。其结果,这些结构在八面体片具有空位点,具有这些结构的蒙皂石如后述那样在锂离子移动后能够稳定地存在。
将作为保有的阳离子为锂离子的蒙皂石称为锂型蒙皂石(但是,本说明书中,不包括后述的锂部分固定型蒙皂石。)。作为将蒙皂石具有的阳离子转化为锂离子的方法,例如可列举出向天然的钠型蒙皂石的分散液(分散浆料)中添加氢氧化锂、氯化锂等锂盐进行阳离子交换的方法。通过调节向分散液中添加的锂的量,从而能够适宜地调节得到的锂型蒙皂石的浸出阳离子量中的锂离子所占的量。另外,锂型蒙皂石也可以通过使用了将阳离子交换树脂离子交换为锂离子的树脂的柱法、或分批法来获得。
实施方式中,锂部分固定型蒙皂石是指锂型蒙皂石中的锂离子的一部分固定化在八面体片的空位点的蒙皂石。锂部分固定型蒙皂石例如通过利用锂型蒙皂石的加热处理将层间的锂离子固定化在八面体片的空位点来获得。通过将锂离子固定化,从而使得蒙皂石耐水化。
对于将锂部分固定的加热处理的温度条件,只要能够将锂离子固定化,就没有别限制。如后述,阳离子交换容量(CEC:Cation Exchange Capacity)小的情况下,配混有锂部分固定型蒙皂石的树脂组合物的水蒸气阻隔性及氧阻隔性进一步提高。因此,从有效地将锂离子固定化、使阳离子交换容量大幅降低的观点出发,优选在150℃以上进行加热。上述加热处理的温度更优选为150~600℃、进一步优选为180~600℃、特别优选为200~500℃、最优选为250~500℃。通过以上述温度进行加热,能够更有效地降低阳离子交换容量、同时能够抑制蒙皂石中的羟基的脱水反应等。上述加热处理优选用开放系的电炉来实施。该情况下,加热时的相对湿度为5%以下、压力为常压。对于上述加热处理的时间,只要能够将锂部分地固定,就没有特别限制,从生产的效率性的观点出发,优选设为0.5~48小时、更优选设为1~24小时。
可以通过X射线光电子能谱(XPS:X-ray Photoelectron Spectroscopy)分析来判断是否为锂部分固定型蒙皂石。具体而言,确认通过XPS分析测定的XPS谱图中的源自Li离子的键能的峰位置。例如,蒙皂石为蒙脱石的情况下,通过加热处理等将锂型蒙皂石制成锂部分固定型蒙皂石,XPS谱图中的源自Li离子的键能的峰位置从57.0ev偏移至55.4ev。因此,蒙皂石为蒙脱石的情况下,可以通过是否具有55.4ev的键能峰来判断是否为部分固定型。
对于锂部分固定型蒙皂石的阳离子交换容量,从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,优选为70meq/100g以下、更优选为60meq/100g以下。对于锂部分固定型蒙皂石的阳离子交换容量,从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,为1meq/100g以上、更优选为5meq/100g以上、进一步优选为10meq/100g以上。从所述观点出发,锂部分固定型蒙皂石的阳离子交换容量为1~70meq/100g,更优选为5~70meq/100g、进一步优选为10~60meq/100g。例如,蒙皂石为蒙脱石的情况下,通常离子交换容量为80~150meq/100g左右,通过进行部分固定化处理,从而可以为5~70meq/100g。锂部分固定型蒙皂石的阳离子交换容量可以不足60meq/100g、也可以为50meq/100g以下。例如,锂部分固定型蒙皂石的阳离子交换容量可以为1meq/100g以上且不足60meq/100g、可以为5meq/100g以上且不足60meq/100g、也可以为10meq/100g以上且不足60meq/100g。
蒙皂石的阳离子交换容量可以通过依据Schollenberger法(粘土手册第三版、日本粘土学会编、2009年5月、p.453-454)的方法进行测定。更具体而言,可以通过日本膨润土工业会标准试验方法JBAS-106-77中记载的方法来测定。
蒙皂石的浸出阳离子量可以如下来算出:相对于蒙皂石0.5g使用100mL的1M乙酸铵水溶液用4小时以上使蒙皂石的层间阳离子渗出,利用ICP发射光谱分析、原子吸收分析等对所得溶液中的各种阳离子的浓度进行测定,算出蒙皂石的浸出阳离子量。
锂部分固定型蒙皂石的含量相对于树脂组合物中的不挥发成分总量优选为3质量%以上。锂部分固定型蒙皂石的含量相对于不挥发成分总量为3质量%以上的情况下,水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异。从同样的观点出发,锂部分固定型蒙皂石的含量相对于树脂组合物中的不挥发成分总量可以为5质量%以上、7质量%以上、9质量%以上、10质量%以上、15质量%以上、18质量%以上、20质量%以上、25质量%以上或30质量%以上。锂部分固定型蒙皂石的含量优选相对于树脂组合物中的不挥发成分总量为70质量%以下。锂部分固定型蒙皂石的含量为70质量%以下的情况下,树脂组合物的成形性进一步更优异,并且对基材的密合性提高。另外,可在高湿度下得到更高的氧阻隔性。从同样的观点出发,锂部分固定型蒙皂石的含量相对于树脂组合物中的不挥发成分总量可以为50质量%以下、45质量%以下、40质量%以下、35质量%以下、30质量%以下。上述上限值及下限值可以任意组合。即,锂部分固定型蒙皂石的含量例如相对于树脂组合物中的不挥发成分总量可以为3~70质量%、3~50质量%、3~35质量%、5~35质量%、5~30质量%、7~30质量%、9~30质量%、10~30质量%等。本说明书中的同样的记载中,个别记载的上限值及下限值可以任意组合。需要说明的是,不挥发成分是指从树脂组合物总质量中将稀释溶剂质量、以及、环氧树脂、固化剂、修饰剂及各种添加剂中所含的挥发成分质量去除的质量。
实施方式的树脂组合物含有环氧化合物。环氧化合物是指含有环氧基的化合物。作为环氧化合物,例如可列举出活性氢化合物(优选具有2个以上活性氢的化合物)与环氧氯丙烷的缩合物、烯烃的氧化物、(甲基)丙烯酸缩水甘油酯等具有缩水甘油基的烯属不饱和化合物的聚合物等。作为上述缩合物,缩水甘油醚型的环氧化合物、缩水甘油胺型的环氧化合物、缩水甘油酯型的环氧化合物是代表性的。这些当中,优选作为双酚A、双酚F、酚醛清漆等具有2个以上羟基的化合物与环氧氯丙烷的缩合物的、缩水甘油醚型的环氧化合物。环氧化合物可以为固体,也可以为液状。环氧化合物为固体的情况下,可以用溶剂使其溶解来使用。
环氧化合物的环氧当量优选为50g/eq以上、更优选为100g/eq以上。环氧当量为50g/eq以上的情况下,将树脂膜固化而得到的成形体(固化膜)的柔软性优异。环氧化合物的环氧当量可以为5000g/eq以下,优选为3000g/eq以下、更优选为2500g/eq以下、进一步优选为2200g/eq以下。环氧当量为3000g/eq以下的情况下,水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异。从这些观点出发,环氧化合物的环氧当量例如可以为50~5000g/eq、50~3000g/eq、50~2500g/eq、50~2200g/eq、100~3000g/eq、100~2500g/eq或100~2200g/eq。环氧当量可以为150g/eq以上或180g/eq以上,也可以为2000g/eq以下、1500g/eq以下、1100g/eq以下、700g/eq以下或500g/eq。需要说明的是,环氧当量可以通过JIS K 7236:2001来测定。
环氧化合物优选包含芳香环结构及脂环结构中的至少一种结构。该情况下,水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异。得到这样的效果的理由尚不明确,可以认为理由之一是:通过包含上述结构,从而得到的树脂膜的水蒸气的溶解性降低。环氧化合物可以仅包含芳香环结构及脂环结构中的一种结构,可以含有两种结构。从容易得到上述效果的观点出发,更优选使用包含芳香环结构的环氧化合物。以下,将包含芳香环结构的环氧化合物称为“芳香族环氧化合物”、将包含脂环结构的环氧化合物称为“脂环式环氧化合物”。
芳香族环氧化合物中所含的芳香环结构可以为单环、也可以为稠环。芳香环结构优选为具有碳数6~18的芳香环的结构(二价的芳香环基团)。作为这样的芳香环结构,可列举出苯环结构(亚苯基)、萘环结构(亚萘基)、菲环结构(亚菲基)、蒽环结构(亚蒽基)等。更优选为苯环结构或萘结构,进一步优选为苯环结构。芳香族环氧化合物中所含的芳香环结构的数量可以为一个,也可以为多个。
作为芳香族环氧化合物,例如可列举出双酚A型环氧化合物、双酚F型环氧化合物、双酚S型环氧化合物、双酚AD型环氧化合物、间苯二酚型环氧化合物、二羟基萘型环氧化合物、联苯型环氧化合物、四甲基联苯型环氧化合物、具有蒽、联苯、双酚A、双酚F、双酚S的结构的3官能以上的环氧化合物、苯酚酚醛清漆型环氧化合物、甲酚酚醛清漆型环氧化合物、三苯基甲烷型环氧化合物、四苯基乙烷型环氧化合物、二环戊二烯-苯酚加成反应型环氧化合物、苯酚芳烷基型环氧化合物、萘酚酚醛清漆型环氧化合物、萘酚芳烷基型环氧化合物、萘酚-苯酚共缩酚醛清漆型环氧化合物、萘酚-甲酚共缩酚醛清漆型环氧化合物、芳香族烃甲醛化合物改性苯酚化合物型环氧化合物、联苯改性酚醛清漆型环氧化合物等。这些当中,从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,优选使用双酚A型环氧化合物及双酚F型环氧化合物。双酚A型环氧化合物可以为液状也可以为固体。
作为芳香族环氧化合物,可以使用市售的芳香族环氧化合物。作为市售的芳香族环氧化合物,例如可列举出苯基缩水甘油醚(Nagase ChemteX Corporation制“DenacolEX-141”)(Denacol为注册商标。以下相同)、对叔丁基苯基缩水甘油醚(Nagase ChemteXCorporation制“Denacol EX-146”)、间苯二酚二缩水甘油醚(Nagase ChemteXCorporation制“Denacol EX-201”)、双酚A二缩水甘油醚(DIC株式会社制“EPICLON 850、850-S、860、1050、2050、3050、4050、7050、HM-091”)(EPICLON为注册商标。以下相同)、双酚F二缩水甘油醚(DIC株式会社制“EPICLON 830”)、苯酚酚醛清漆型聚缩水甘油醚(DIC株式会社制“EPICLON N-740、770、”)、甲酚酚醛清漆型聚缩水甘油醚(DIC株式会社制“EPICLON N-660”)、二环戊二烯-苯酚加成反应型聚缩水甘油醚(DIC株式会社制“EPICLON HP-7200”)、2-苯基苯酚缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-142”)、1,6-萘二缩水甘油醚(DIC株式会社制“EPICLON HP-4032”、1-氯-2,3-环氧丙烷·2,7-萘二醇·甲醛缩聚物(DIC株式会社制“EPICLON EXA-4700”)、邻苯二甲酸二缩水甘油醚(Nagase ChemteXCorporation制“Denacol EX-721”)、对苯二甲酸二缩水甘油酯(Nagase ChemteXCorporation制“Denacol EX-711”)、1,6-己二醇二缩水甘油醚(Nagase ChemteXCorporation制“Denacol EX-212”)、N,N,N’,N’-四缩水甘油基间苯二甲胺(三菱瓦斯化学株式会社制“TETRAD-X”)、三菱化学株式会社制的“jER 806”、“jER4004P”、“jER YX4000”、株式会社ADEKA制的“Adeka Resin EP-4100”、“Adeka Resin EP-4901”等。
脂环式环氧化合物中所含的脂环结构可以为单环,也可以为稠环。脂环结构优选为环烷烃结构。环烷烃结构的碳数可以为4以上、可以为10以下。例如,环烷烃结构可以为环戊烷结构、环己烷结构、环庚烷结构、环辛烷结构、环壬烷结构、环癸烷结构等。脂环式环氧化合物中所含的脂环结构的数量可以为一个,也可以为多个。
作为脂环式环氧化合物,可列举出环烯烃氧化物化合物、脂环族多元醇聚缩水甘油醚化合物等。作为脂环式环氧化合物,可以使用市售的脂环式环氧化合物。作为市售的脂环式环氧化合物,例如,可列举出3,4-环氧环己基甲基-3’,4’-环氧环己烷羧酸酯(DaicelCorporation.制“CELLOXIDE 2021P”)(CELLOXIDE为注册商标。以下相同)、1,2:8,9二环氧柠檬烯(Daicel Corporation.制“CELLOXIDE 3000”)、二环戊二烯型环氧树脂(DIC株式会社制“EPICLON HP-7200”)、氢化双酚A二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-252”)、六氢邻苯二甲酸二缩水甘油醚(阪本药品工业株式会社制“SR-HHPA”)、1,4-环己烷二甲醇二缩水甘油醚(新日本理化株式会社制“RIKARESIN DME-100”)、1,3-双氨基甲基环己烷(三菱瓦斯化学株式会社制)、1,3-双(N,N-二缩水甘油基氨基甲基)环己烷(三菱瓦斯化学株式会社制“TETRAD-C”)、2,2-双(羟基甲基)-1-丁醇的1,2-环氧-4-(2-环氧乙烷基)环己烷加成物(Daicel Corporation.制“EHPE3150”)、SYNASIA公司制的“Syna-Epoxy 21”、“Syna-Epoxy 28”等。
作为环氧化合物,可以使用不含芳香环结构及脂环结构的环氧化合物(也称为“脂肪族环氧”)。作为脂肪族环氧化合物,可以使用市售的脂肪族环氧化合物。作为市售的脂肪族环氧化合物,例如,可列举出新戊二醇二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-211”)、1,6-己二醇二缩水甘油醚(Nagase ChemteX Corporation制“DenacolEX-212P”)、乙二醇二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-810”)、聚乙二醇二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-861”)、丙二醇二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-911”)、聚丙二醇二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-941、EX-920、EX-931”)、甘油聚缩水甘油醚(阪本药品工业株式会社制“SR-GLG”)、二甘油聚缩水甘油醚(阪本药品工业株式会社制“SR-DGE”)、三羟甲基丙烷聚缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-321”)、季戊四醇聚缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-411”)、己二酸二缩水甘油醚(Nagase ChemteX Corporation制“Denacol EX-701”)、聚甘油聚缩水甘油醚(阪本药品工业株式会社制“SR-4GL”)、山梨糖醇系聚缩水甘油醚(阪本药品工业株式会社制“SR-SEP”)、聚丁二烯型环氧树脂(Daicel Corporation.制“EPOLEAD PB3600”、NagaseChemteX Corporation制“Denacol R-15EPT”、“FCA-061L”、“FCA-061M”)等。
树脂组合物可以含有含环氧基硅烷偶联剂作为环氧化合物。作为含环氧基硅烷偶联剂,例如可列举出3-环氧丙氧基丙基三甲氧基硅烷、3-环氧丙氧基丙基三乙氧基硅烷、3-环氧丙氧基丙基甲基二乙氧基硅烷、2-(3,4环氧环己基)乙基三甲氧基硅烷等。
作为环氧化合物,可以单独使用1种环氧化合物、也可以组合使用多种环氧化合物。
树脂组合物根据用途可以使环氧基开环聚合来使其固化。作为使其聚合的能量,没有特别限定,可列举出热及光。即,树脂组合物可以为热固化性、也可以为光固化性。通过热使树脂组合物固化的情况下,树脂组合物可以含有固化剂。通过光使树脂组合物固化的情况下,树脂组合物可以含有光聚合引发剂。
作为固化剂,例如,可列举出胺系固化剂、酰胺系固化剂、酸酐系固化剂、酚系固化剂、活性酯系固化剂、含羧基固化剂、硫醇系固化剂等。从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,树脂组合物优选包含选自由酸酐系固化剂、酚系固化剂及酰胺系固化剂组成的组中的至少一种固化剂,更优选包含酸酐系固化剂及酚系固化剂中的至少一者。这些固化剂可以单独使用1种,也可以组合使用2种以上。
作为胺系固化剂,例如,可列举出二氨基二苯基甲烷、二氨基二苯基乙烷、二氨基二苯基醚、二氨基二苯基砜、邻亚苯基二胺、间亚苯基二胺、对亚苯基二胺、间苯二甲胺、对苯二甲胺、二乙基甲苯二胺、二亚乙基三胺、三亚乙基四胺、异佛尔酮二胺、咪唑、BF3-胺络合物、胍衍生物及胍胺衍生物。
作为酰胺系固化剂,可列举出双氰胺、聚酰胺树脂等。聚酰胺树脂可以由亚麻酸的二聚体及乙二胺来合成。作为酰胺系固化剂,从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,优选使用双氰胺。
作为酸酐系固化剂,可列举出酐琥珀酸、邻苯二甲酸酐、偏苯三酸酐、均苯四甲酸酐、马来酸酐、四氢邻苯二甲酸酐、甲基四氢邻苯二甲酸酐、甲基纳迪克酸酐、六氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、烯基琥珀酸酐等。作为酸酐系固化剂,从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,优选使用甲基四氢邻苯二甲酸酐。
作为酚系固化剂,可例示出由多羟基化合物与甲醛合成的酚系固化剂。作为多羟基化合物,可列举出双酚A、双酚F、双酚S、间苯二酚、氢醌、芴双酚、4,4’-联苯酚、4,4’,4”-三羟基三苯基甲烷、1,1,2,2-四(4-羟基苯基)乙烷、杯芳烃等。作为酚系固化剂,具体而言,可列举出苯酚酚醛清漆树脂、甲酚酚醛清漆树脂、芳香族烃甲醛树脂、改性酚醛树脂、二环戊二烯苯酚加成型树脂、苯酚芳烷基树脂(Xylock树脂)、间苯二酚酚醛清漆树脂等。作为酚系固化剂,从水蒸气阻隔性及氧阻隔性(例如高湿度下的氧阻隔性)进一步更优异的观点出发,优选使用苯酚酚醛清漆树脂。
根据以上,树脂组合物更优选包含选自由酸酐系固化剂、苯酚酚醛清漆树脂及双氰胺组成的组中的至少一种固化剂,更优选包含选自由甲基四氢邻苯二甲酸酐、苯酚酚醛清漆树脂及双氰胺组成的组中的至少一种固化剂。
通过热使树脂组合物固化的情况下,该树脂组合物可以还含有固化促进剂(固化催化剂)。固化促进剂可以单独使用,也可以与上述固化剂组合使用。作为固化促进剂,可以使用会促进环氧化合物的固化反应的各种化合物。作为固化促进剂,例如,可列举出磷系化合物、叔胺化合物、咪唑化合物、有机酸金属盐、路易斯酸、胺配盐等。作为磷系化合物,例如可列举出三苯基膦、三对甲苯基膦、及二苯基环己基膦。作为叔胺化合物,例如可列举出N,N-二甲基苄基胺、1,8-二氮杂双环[5.4.0]-7-十一碳烯、1,5-二氮杂双环[4.3.0]壬烯-5、及三(二甲基氨基甲基)苯酚。作为咪唑化合物,例如,可列举出1-氰基乙基-2-乙基-4-甲基咪唑、及2-乙基-4-甲基咪唑。
作为光聚合引发剂,只要为用于通过光照射使环氧基开环聚合的引发剂,就没有特别限定,例如可以为光阳离子聚合引发剂。光聚合引发剂可以为离子性光产酸型、也可以为非离子性光产酸型。
作为离子性光产酸型的光阳离子聚合引发剂,没有特别限制,可列举出芳香族重氮盐、芳香族卤鎓盐、芳香族锍盐等鎓盐类、铁-芳烃络合物、二茂钛络合物、芳基硅烷醇-铝络合物等有机金属络合物类。这些离子性光产酸型的光阳离子聚合引发剂可以单独使用,也可以组合使用2种以上。
作为非离子性光产酸型的光阳离子聚合引发剂,没有特别限定,例如,可列举出硝基苄基酯、磺酸衍生物、磷酸酯、苯酚磺酸酯、重氮萘醌、N-羟基酰亚胺膦酸酯等。这些非离子性光产酸型的光阳离子聚合引发剂可以单独使用,也可以组合使用2种以上。
树脂组合物中的光聚合引发剂的配混量没有特别限定,相对于树脂组合物总量100质量份,通常为0.1~10质量份。即,树脂组合物中的光聚合引发剂的配混量相对于树脂组合物总量100质量份可以为0.1质量份以上、也可以为10质量份以下。
通过光使树脂组合物固化的情况下,为了提高光的灵敏度、及为了在光源的光的波长具有灵敏度,可以适宜添加敏化剂。为了调整固化性,所述敏化剂可以与上述光聚合引发剂(例如光阳离子聚合引发剂)组合使用。作为敏化剂,可列举出蒽系化合物、噻吨酮系化合物等。
作为用于使树脂组合物光固化的光源,只要使用在利用的光聚合引发剂及敏化剂的吸收波长发光的光源即可,通常使用包含200~450nm的范围的波长的光源。具体而言,例如,可以使用高压汞灯、超高压汞灯、金属卤化物灯、高功率金属卤化物灯、氙气灯、碳弧灯、发光二极管等。
树脂组合物可以还含有修饰剂。作为修饰剂,可列举出偶联剂、硅烷化合物等。这些修饰剂可以单独使用1种、也可以组合使用多种。树脂组合物含有这些修饰剂的情况下,锂部分固定型蒙皂石的润湿性提高,在树脂组合物中的分散性提高。需要说明的是,树脂组合物中可以含有上述酸酐作为修饰剂。
作为偶联剂,例如可列举出硅烷偶联剂、钛偶联剂、锆偶联剂、铝偶联剂等。
作为硅烷偶联剂,例如可列举出含氨基硅烷偶联剂、含(甲基)丙烯酰基硅烷偶联剂、含异氰酸酯基硅烷偶联剂等。作为含氨基硅烷偶联剂,例如可列举出3-氨基丙基三甲氧基硅烷、N-2-(氨基乙基)-3-氨基丙基甲基二甲氧基硅烷、3-三乙氧基甲硅烷基-N-(1,3-二甲基丁叉基)丙基胺、N-苯基-γ-氨基丙基三甲氧基硅烷等。作为含(甲基)丙烯酰基硅烷偶联剂,例如,可列举出3-丙烯酰氧基丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三乙氧基硅烷等。作为含异氰酸酯基硅烷偶联剂,例如可列举出3-异氰酸酯丙基三乙氧基硅烷等。
作为钛偶联剂,例如,可列举出异丙基三异硬脂酰基钛酸酯、异丙基三辛酰基钛酸酯、异丙基二甲基丙烯酸基异硬脂酰基钛酸酯、异丙基异硬脂酰基二丙烯酸基钛酸酯、异丙基三(二辛基焦磷酸酯)钛酸酯、四辛基双(二(十三烷基)亚磷酸酯)钛酸酯、四(2,2-二烯丙氧基甲基-1-丁基)双(二(十三烷基))亚磷酸酯钛酸酯、双(二辛基焦磷酸酯)氧基乙酸酯钛酸酯、双(二辛基焦磷酸酯)亚乙基钛酸酯等。
作为锆偶联剂,例如,可列举出乙酸锆、碳酸锆铵、氟化锆等。
作为铝偶联剂,可列举出乙酰烷氧基二异丙酸铝、二异丙氧基单乙基乙酰乙酸铝、三乙基乙酰乙酸铝、三乙酰基丙酮铝等。
作为硅烷化合物,可列举出烷氧基硅烷、硅氮烷、硅氧烷等。作为烷氧基硅烷,可列举出甲基三甲氧基硅烷、二甲基二甲氧基硅烷、苯基三甲氧基硅烷、甲基三乙氧基硅烷、二甲基二乙氧基硅烷、苯基三乙氧基硅烷、正丙基三甲氧基硅烷、正丙基三乙氧基硅烷、己基三甲氧基硅烷、己基三乙氧基硅烷、辛基三乙氧基硅烷、癸基三甲氧基硅烷、1,6-双(三甲氧基甲硅烷基)己烷、三氟丙基三甲氧基硅烷等。作为硅氮烷,可列举出六甲基二硅氮烷等。作为硅氧烷,可列举出含水解性基团的硅氧烷等。
作为修饰剂的配混量,相对于锂部分固定型蒙皂石总量,优选为0.1~50质量%。修饰剂的配混量为0.1质量%以上时,锂部分固定型蒙皂石在树脂组合物中的分散性更良好。另外,修饰剂的配混量为50质量%以下时,能够抑制修饰剂对树脂组合物的机械物性的影响。修饰剂的配混量优选为0.3~30质量%、更优选为0.5~15质量%。
树脂组合物根据使用用途可以含有溶剂。作为溶剂,可列举出有机溶剂,例如可列举出甲乙酮、丙酮、乙酸乙酯、乙酸丁酯、甲苯、二甲基甲酰胺、乙腈、甲基异丁基酮、甲醇、乙醇、丙醇、甲氧基丙醇、环己酮、甲基溶纤剂、二乙二醇单乙醚乙酸酯、丙二醇单甲基醚乙酸酯等。溶剂的种类及用量根据使用用途来适宜选择即可。
树脂组合物在不损害本发明的效果的范围内可以含有各种添加剂(除了相当于环氧化合物、锂部分固定型蒙皂石及修饰剂的化合物以外)。作为添加剂,例如,可以例示出有机填料、无机填料、稳定剂(抗氧化剂、热稳定剂、紫外线吸收剂等)、增塑剂、抗静电剂、滑剂、防粘连剂、着色剂、结晶成核剂、氧捕捉剂(具有氧捕捉功能的化合物)、增粘剂等。这些各种添加剂可以单独使用或组合使用两种以上。
添加剂中,作为无机填料,可列举出金属、金属氧化物、树脂、矿物等无机物及这些的复合物。作为无机填料的具体例,可列举出二氧化硅、氧化铝、钛、氧化锆、铜、铁、银、云母、滑石、铝鳞片、玻璃鳞片、粘土矿物。这些当中,出于提高阻气性的目的,优选使用粘土矿物,粘土矿物之中,更优选使用溶胀性无机层状化合物。
作为溶胀性无机层状化合物,例如可列举出含水硅酸盐(页硅酸盐矿物等)、高岭石族粘土矿物(埃洛石(halloysite)等)、蒙皂石族粘土矿物(蒙脱石、贝得石、绿脱石、皂石、锂蒙脱石、锌蒙脱石、硅镁石等)、蛭石族粘土矿物(蛭石等)等。这些矿物可以为天然粘土矿物,也可以为合成粘土矿物。
作为具有氧捕捉功能的化合物,例如可列举出受阻酚系化合物、维生素C、维生素E、有机磷化合物、没食子酸、连苯三酚等与氧反应的低分子有机化合物、钴、锰、镍、铁、铜等过渡金属化合物等。
作为增粘剂,可列举出二甲苯树脂、萜烯树脂、酚醛树脂(酚系固化剂除外)、松香树脂等。通过添加增粘剂,从而能够提高对刚刚涂布后的各种薄膜材料的粘合性。增粘剂的添加量相对于树脂组合物总量100质量份优选为0.01~5质量份。
实施方式的成形体可以将上述树脂组合物成形而得到。成形方法是任意的,根据用途适时选择即可。成形体可以由树脂组合物形成、也可以由树脂组合物的固化物形成。成形体的形状没有限制,可以为板状、片状、或薄膜状,可以具有立体形状,可以为涂布于基材而成者,也可以为以存在于基材与基材之间的形态成形而成者。
制造板状、片状的成形体的情况下,例如可列举出使用挤出成形法、平面压制、异形挤出成形法、吹塑成形法、压缩成形法、真空成形法、注射成形法等将树脂组合物成形的方法。另外,制造薄膜状的成形体的情况下,例如可列举出熔融挤出法、溶液浇铸法、吹胀薄膜成形、浇铸成形、挤出挤压成形、压延成形、片成形、纤维成形、吹塑成形、注射成形、旋转成形、覆盖成形。为利用热或活性能量射线进行固化的树脂组合物的情况下,可以利用使用了热或活性能量射线的各种固化方法将树脂组合物成形。
树脂组合物为液状的情况下,可以通过涂覆进行成形。作为涂覆方法,可列举出喷雾法、旋转涂布法、浸渍法、辊涂法、刮刀涂布法、刮刀辊(doctor roll)法、刮刀(doctorblade)法、帘式涂布法、狭缝涂布法、丝网印刷法、喷墨法、分配法等。
实施方式的层叠体为在基材上具备上述成形体的物体。层叠体可以为2层结构、也可以为3层结构以上。
基材的材质没有特别限定,根据用途适宜选择即可,例如可列举出木材、金属、塑料、纸、硅或改性硅等,可以为将不同的原材料接合而得到的基材。基材的形状没有特别限制,可以为平板、片状、或在三维形状整面、或一部分具有曲率等符合目的的任意形状。另外,基材的硬度、厚度等也没有限制。
层叠体可以通过在基材上层叠上述成形体来获得。层叠于基材上的成形体可以通过对基材直接涂覆或直接成形来形成,也可以将树脂组合物的成形体层叠。直接涂覆的情况下,作为涂覆方法,没有特别限定,可列举出喷雾法、旋转涂布法、浸渍法、辊涂法、刮刀涂布法、刮刀辊法、刮刀法、帘式涂布法、狭缝涂布法、丝网印刷法、喷墨法等。直接成形的情况下,可列举出模内成形、嵌入成形、真空成形、挤出层压成形、压制成形等。层叠树脂组合物的成形体的情况下,可以将未固化或半固化的树脂组合物层层叠于基材上后使其固化,也可以将使树脂组合物完全固化而成的固化物层层叠于基材上。
另外,层叠体可以通过对树脂组合物的固化物涂覆基材的前体并使其固化来获得,也可以通过使基材的前体或树脂组合物在未固化或半固化的状态下粘接后使其固化来获得。作为基材的前体,没有特别限定,可列举出各种固化性树脂组合物等。另外,可以通过使用实施方式的树脂组合物作为粘接剂来制作层叠体。
上述树脂组合物的水蒸气阻隔性及氧阻隔性优异,因此可以适当地用作阻气材料。阻气材料包含上述树脂组合物即可。
另外,上述树脂组合物可以适当地用作涂布材料。涂布材料包含上述树脂组合物即可。只要满足作为阻隔涂布材料的各特性,涂布材料的形态就没有限定。例如,为热固化型的涂布材料时,可以采用预先使环氧化合物和固化剂混合后,配混锂部分固定型蒙皂石的单液型的涂布材料,也可以采用将环氧化合物和固化剂分开的二液混合型的涂布材料。二液混合型的情况下,可以预先在环氧化合物及固化剂中的任一者或两者中混合锂部分固定型蒙皂石。
作为涂布材料的涂布方法,没有特别限制。作为具体的方法,可以例示出辊涂、凹版涂布等各种涂布方法。另外,对涂布装置也没有特别限定。上述树脂组合物具有高的阻气性,因此能够适当地作为阻气用涂布材料利用。
另外,上述树脂组合物的粘接性优异,因此能够适当地作为粘接剂使用。粘接剂只要包含上述树脂组合物即可。粘接剂的形态没有特别限定,可以采用液状或糊状的粘接剂,也可以采用固态状的粘接剂。树脂组合物具有高的阻气性,因此该粘接剂可以适当地作为阻气用粘接剂利用。
液状或糊状的粘接剂的情况下,可以采用单液型的粘接剂,也可以采用将固化剂分开的二液型的粘接剂。液状或糊状的粘接剂的情况下,作为使用方法,没有特别限定,可以在涂布于一个粘接面后贴合另一粘接面使其粘接,也可以注入到粘接面的界面后使其粘接。
固态状的粘接剂的情况下,可以通过将成形为粉末状、小片状、或片状的粘接剂设置在粘接面的界面,使其热溶解而进行粘接、使其固化。
实施例
以下,通过实施例更具体地对本发明进行说明,但本发明不限定于此。
作为树脂组合物中含有的填料,使用锂部分固定型蒙皂石或锂部分未固定的蒙皂石。锂部分固定型蒙皂石使用KUNIMINE INDUSTRIES CO.,LTD.制的蒙脱石浆料(商品名:RCEC-W、阳离子交换容量:39.0meq/100g)。该分散浆料中的锂部分固定型蒙皂石的含量(w/w%)为20w/w%。另外,锂部分未固定的蒙皂石使用天然蒙脱石(商品名:KUNIPIA F、阳离子交换容量:108meq/100g、KUNIMINE INDUSTRIES CO.,LTD.制)(KUNIPIA为注册商标)。
作为修饰剂,使用作为硅烷偶联剂的KBM-503(3-甲基丙烯酰氧基丙基三甲氧基硅烷、商品名、信越化学工业株式会社制)或作为硅烷化合物的KBM-3033(正丙基三甲氧基硅烷、商品名、信越化学工业株式会社制)。
(实施例1)
相对于双酚A型液状环氧化合物(商品名:EPICLON 850-S、DIC株式会社制)100质量份,加入上述锂部分固定型蒙皂石浆料210质量份、作为溶剂的、乙腈384质量份、水43质量份、及2-丙醇93质量份、和修饰剂溶液59.5质量份,保持8小时搅拌。其后,加入甲基四氢邻苯二甲酸酐(商品名:EPICLON B-570H、DIC株式会社制)90质量份、及N,N-二甲基苄基胺(和光纯药工业株式会社制)1质量份。由此,得到实施例1的树脂组合物。将其作为涂覆液1。需要说明的是,修饰剂溶液通过对包含2.8质量份的KBM-503、0.6质量份的水、56.0质量份的2-丙醇、及0.1质量份的盐酸(浓度:0.1mol/l)的溶液搅拌2小时来制备。
用棒涂机将得到的涂覆液1以干燥后涂覆厚度成为2μm的方式涂覆于25μm的聚酰亚胺薄膜(DU PONT-TORAY CO.,LTD.制Kapton薄膜)(Kapton为注册商标。以下相同)。将涂覆后的聚酰亚胺薄膜在涂覆后立即在120℃的干燥机中加热1分钟。其后,在120℃的干燥机中进行3小时加热处理,进而在175℃的干燥机中进行5小时加热处理。由此,在聚酰亚胺薄膜上形成实施例1的树脂组合物的成形体,得到实施例1的层叠薄膜。
上述实施例1的树脂组合物及成形体中,锂部分固定型蒙皂石的含量(填料量)相对于不挥发成分总量为18质量%。
(实施例2~10)
使用表1所示的环氧化合物来代替EPICLON 850-S,根据情况使用甲乙酮(MEK)来代替作为溶剂而使用的乙腈及水(参照实施例5及实施例6。),将各成分的配混量变更为表1所示的值,且作为修饰剂溶液使用按表1所示的配混量制备的修饰剂溶液,除此以外,与实施例1同样地操作,得到实施例2~10的树脂组合物。将这些分别作为涂覆液2~10。需要说明的是,修饰剂溶液使用表1所示的、溶液的制备中使用的各成分的配混量的合计量。另外,实施例2~6及实施例10中,将环氧化合物预先溶解于少量的MEK而使用。此时,实施例2~4及10中,使环氧化合物100质量份溶解于42.9质量份的MEK。实施例5中,使环氧化合物100质量份溶解于78.6质量份的MEK。实施例6中,使环氧化合物100质量份溶解于150质量份的MEK。
接着,分别使用涂覆液2~10来代替涂覆液1,除此以外,与实施例1同样地操作,在25μm的聚酰亚胺薄膜(DU PONT-TORAY CO.,LTD.制Kapton薄膜)上形成实施例2~10的树脂组合物的成形体,得到实施例2~10的层叠薄膜。
实施例2~10的树脂组合物及成形体中,锂部分固定型蒙皂石的含量(填料量)均相对于不挥发成分总量为18质量%。
(实施例11~13)
使用表2所示的固化剂来代替B-570H,不使用作为催化剂(固化促进剂)的N,N-二甲基苄基胺,根据情况不使用作为溶剂的水(参照实施例12。),将各成分的配混量变更为表2所示的值,且作为修饰剂溶液使用按表2所示的配混量制备的修饰剂溶液,除此以外,与实施例1同样地操作,得到实施例11~13的树脂组合物。将这些分别作为涂覆液11~13。需要说明的是,修饰剂溶液使用表2所示的、溶液的制备中使用的各成分的配混量的合计量。
接着,分别使用涂覆液11~13来代替涂覆液1,除此以外,与实施例1同样地操作,在25μm的聚酰亚胺薄膜(DU PONT-TORAY CO.,LTD.制Kapton薄膜)上形成实施例11~13的树脂组合物的成形体,得到实施例11~13的层叠薄膜。
实施例11~13的树脂组合物及成形体中,锂部分固定型蒙皂石的含量(填料量)均相对于不挥发成分总量为18质量%。
(实施例14)
作为修饰剂,使用KBM3033来代替KBM-503,将各成分的配混量变更为表2所示的值,且作为修饰剂溶液使用按表2所示的配混量制备的修饰剂溶液,除此以外,与实施例1同样地操作,得到实施例14的树脂组合物。将其作为涂覆液14。需要说明的是,修饰剂溶液使用表2所示的、溶液的制备中使用的各成分的配混量的合计量。
接着,使用涂覆液14来代替涂覆液1,除此以外,与实施例1同样地操作,在25μm的聚酰亚胺薄膜(DU PONT-TORAY CO.,LTD.制Kapton薄膜)上形成实施例14的树脂组合物的成形体,得到实施例14的层叠薄膜。
实施例14的树脂组合物及成形体中,锂部分固定型蒙皂石的含量(填料量)相对于不挥发成分总量为18质量%。
(实施例15~18)
将各成分的配混量变更为表2所示的值,且作为修饰剂溶液使用按表2所示的配混量制备的修饰剂溶液,除此以外,与实施例1同样地操作,得到实施例15~18的树脂组合物。将这些分别作为涂覆液15~18。需要说明的是,修饰剂溶液使用表2所示的、溶液的制备中使用的各成分的配混量的合计量。
接着,分别使用涂覆液15~18来代替涂覆液1,除此以外,与实施例1同样地操作,在25μm的聚酰亚胺薄膜(DU PONT-TORAY CO.,LTD.制Kapton薄膜)上形成实施例15~18的树脂组合物的成形体,得到实施例15~18的层叠薄膜。
实施例15~18的树脂组合物及成形体中,锂部分固定型蒙皂石的含量(填料量)分别相对于不挥发成分总量为5质量%、10质量%、30质量%、70质量%。
(比较例1)
相对于双酚A型液状环氧化合物(商品名:EPICLON 850-S、DIC株式会社制)100质量份,加入上述天然蒙脱石(KUNIPIA F)446质量份、和作为溶剂的、乙腈3841质量份、水427质量份及2-丙醇64质量份、和修饰剂溶液126.5份,保持8小时搅拌。其后,加入甲基四氢邻苯二甲酸酐(商品名:EPICLON B-570H、DIC株式会社制)90质量份、及N,N-二甲基苄基胺(和光纯药工业株式会社制)1质量份。由此,得到比较例1的树脂组合物。将其作为涂覆液19。需要说明的是,修饰剂溶液通过将包含24.2质量份的KBM503、5.3质量份的水、97.0质量份的2-丙醇、及0.1质量份的盐酸(浓度:0.1mol/l)的溶液搅拌2小时来制备。
接着使用涂覆液19来代替涂覆液1,除此以外,与实施例1同样地操作,形成比较例1的树脂组合物的成形体,得到比较例1的层叠薄膜。
上述比较例1的树脂组合物及成形体中,天然蒙脱石的含量(填料量)相对于不挥发成分总量为70质量%,修饰剂的配混量(修饰剂量)相对于天然蒙脱石(填料)总量为5质量%。
(比较例2)
相对于双酚A型液状环氧化合物(商品名:EPICLON 850-S、DIC株式会社制)100质量份,加入乙腈500质量份,保持8小时搅拌。其后,加入甲基四氢邻苯二甲酸酐(商品名:EPICLON B-570H、DIC株式会社制)90质量份、及N,N-二甲基苄基胺(和光纯药工业株式会社制)1质量份。由此,得到比较例2的树脂组合物。将其作为涂覆液20。
接着使用涂覆液20来代替涂覆液1,除此以外,与实施例1同样地操作,形成比较例2的树脂组合物的成形体,得到比较例2的层叠薄膜。
<评价>
对实施例1~18及比较例1~2的层叠薄膜评价成膜性、氧透过性及水蒸气透过性。评价结果如表1及表2所示。需要说明的是,成膜性、氧透过性及水蒸气透过性的评价按照以下的方法来实施。
(成膜性)
对于成膜性,将层叠薄膜的涂覆面平滑的情况评价为“A”、将涂覆面不平滑的情况评价为“B”。
(氧透过率)
对于氧透过率的测定,依据JIS-K7126(等压法),使用MOCON公司制氧透过率测定装置OX-TRAN1/50,在温度23℃、湿度0%RH的气氛下、及、温度23℃、湿度90%RH的气氛下实施。需要说明的是,RH表示相对湿度。
(水蒸气透过率)
对于水蒸气透过率的测定,依据JIS-K7129,使用Illinois公司制水蒸气透过率测定装置7001,在温度40℃、湿度90%RH的气氛下测定。
[表1]
[表2]
表1及表2所示的各环氧化合物及固化剂的详情如下。
[芳香族环氧化合物]
·EP850S:双酚A型液状环氧化合物、商品名:EPICLON 850-S、DIC株式会社制、环氧当量:185g/eq
·EP1050:双酚A型固体环氧化合物、商品名:EPICLON 1050、DIC株式会社制、环氧当量:500g/eq
·EP2050:双酚A型固体环氧化合物、商品名:EPICLON 2050、DIC株式会社制、环氧当量:650g/eq
·EP4050:双酚A型固体环氧化合物、商品名:EPICLON 4050、DIC株式会社制、环氧当量:1000g/eq
·EO7050:双酚A型固体环氧化合物、商品名:EPICLON 7050、DIC株式会社制、环氧当量:2100g/eq
·HM-091:双酚A型固体环氧化合物、商品名:EPICLON HM-091、DIC株式会社制、环氧当量:2310g/eq
·EP830:双酚F型环氧化合物、商品名:EPICLON 830、DIC株式会社制、环氧当量:170g/eq
[脂环式环氧化合物]
·2021P:3,4-环氧环己基甲基-3’,4’-环氧环己烷羧酸酯、商品名:CELLOXIDE2021P、Daicel Corporation.、环氧当量:130g/eq
[脂肪族环氧化合物]
·EX-212:1,6-己二醇二缩水甘油醚、商品名:Denacol EX-212、Nagase ChemteXCorporation、环氧当量:116g/eq
·EX-861:聚乙二醇二缩水甘油醚、商品名:Denacol EX-861、Nagase ChemteXCorporation、环氧当量:550g/eq
[酸酐系固化剂]
·B-570H:甲基四氢邻苯二甲酸酐、商品名:EPICLON B-570H、DIC株式会社制
[酰胺系固化剂]
·DICY7:双氰胺、商品名、三菱化学株式会社制
[酚系固化剂]
·TD-2090:苯酚酚醛清漆树脂、商品名PHENOLITETD-2090、DIC株式会社制
[胺系固化剂]
·IPD:异佛尔酮二胺、商品名:VESTAMIN IPD、EVONIK公司制
产业上的可利用性
本发明的树脂组合物的阻气性、特别是水蒸气阻隔性及氧阻隔性优异,因此能适当地用于以包装材料为首的电子材料、建筑材料等各种领域。
Claims (12)
1.一种树脂组合物,其含有环氧化合物和锂部分固定型蒙皂石。
2.根据权利要求1所述的树脂组合物,其中,所述环氧化合物的环氧当量为50~3000g/eq。
3.根据权利要求1或2所述的树脂组合物,其中,所述环氧化合物包含芳香环结构及脂环结构中的至少一种结构。
4.根据权利要求1~3中任一项所述的树脂组合物,其中,所述锂部分固定型蒙皂石的阳离子交换容量为1~70meq/100g。
5.根据权利要求1~4中任一项所述的树脂组合物,其中,还含有固化剂。
6.根据权利要求5所述的树脂组合物,其中,所述固化剂为选自由酸酐系固化剂、酚系固化剂及酰胺系固化剂组成的组中的至少一种固化剂。
7.根据权利要求1~6中任一项所述的树脂组合物,其中,所述锂部分固定型蒙皂石的含量相对于所述树脂组合物的不挥发成分总量为3~70质量%。
8.一种成形体,其为权利要求1~7中任一项所述的树脂组合物的成形体。
9.一种层叠体,其具备:基材、和设置于该基材上的权利要求8所述的成形体。
10.一种阻气材料,其包含权利要求1~7中任一项所述的树脂组合物。
11.一种涂布材料,其包含权利要求1~7中任一项所述的树脂组合物。
12.一种粘接剂,其包含权利要求1~7中任一项所述的树脂组合物。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06136242A (ja) * | 1992-10-28 | 1994-05-17 | Toho Rayon Co Ltd | エポキシ樹脂組成物及びプリプレグ |
US20030039812A1 (en) * | 2001-08-09 | 2003-02-27 | Industrial Technology Research Institute, Nan Ya Plastics Corporation | Epoxy/clay nanocomposite for making printed circuit boards |
JP2008247695A (ja) * | 2007-03-30 | 2008-10-16 | Hitachi Chem Co Ltd | 合成粘土材料及び粘土フィルム |
CN102448884A (zh) * | 2009-06-19 | 2012-05-09 | 独立行政法人产业技术综合研究所 | 电子器件用防湿膜 |
JP2013023502A (ja) * | 2011-07-14 | 2013-02-04 | Jnc Corp | 樹脂組成物およびそれを用いた薄膜 |
Family Cites Families (5)
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JP5099412B2 (ja) * | 2006-03-11 | 2012-12-19 | 独立行政法人産業技術総合研究所 | 変性粘土を用いた膜 |
JP4930917B2 (ja) * | 2006-08-28 | 2012-05-16 | 株式会社巴川製紙所 | 粘土薄膜フィルム、その製造方法および粘土薄膜積層体 |
EP2080613B1 (en) * | 2006-11-16 | 2016-03-16 | Mitsubishi Plastics, Inc. | Gas barrier film laminate |
JP5648814B2 (ja) * | 2010-06-03 | 2015-01-07 | 独立行政法人産業技術総合研究所 | 水蒸気バリア性フィルム及びその製造方法 |
JP2012121777A (ja) * | 2010-12-09 | 2012-06-28 | National Institute Of Advanced Industrial Science & Technology | もみ殻灰を用いた合成粘土及び粘土膜の製造方法 |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06136242A (ja) * | 1992-10-28 | 1994-05-17 | Toho Rayon Co Ltd | エポキシ樹脂組成物及びプリプレグ |
US20030039812A1 (en) * | 2001-08-09 | 2003-02-27 | Industrial Technology Research Institute, Nan Ya Plastics Corporation | Epoxy/clay nanocomposite for making printed circuit boards |
JP2008247695A (ja) * | 2007-03-30 | 2008-10-16 | Hitachi Chem Co Ltd | 合成粘土材料及び粘土フィルム |
CN102448884A (zh) * | 2009-06-19 | 2012-05-09 | 独立行政法人产业技术综合研究所 | 电子器件用防湿膜 |
JP2013023502A (ja) * | 2011-07-14 | 2013-02-04 | Jnc Corp | 樹脂組成物およびそれを用いた薄膜 |
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