CN110265305B - 一种贴片式红外支架及其生产工艺、红外接收头 - Google Patents
一种贴片式红外支架及其生产工艺、红外接收头 Download PDFInfo
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Abstract
本发明公开一种贴片式红外支架,包括PCB基材板以及设置在所述PCB基材板上的若干个金属支架单元,所述支架单元包括单元本体、导电孔、A面引脚焊盘和B面引脚焊盘,所述单元本体和所述A面引脚焊盘均设置在所述PCB基材板的一面,所述B面引脚焊盘设置在所述PCB基材板的另一面,所述A面引脚焊盘和所述B面引脚焊盘通过所述导电孔电性连接。本发明的贴片式红外支架采用PCB基材板代替金属工艺边框,降低生产成本,而支架单元从工艺边框上分离产生的毛刺为非金属材料,可以采用腐蚀液进行处理,降低加工难度以及提高产品质量;与传统的支架相比,本发明的支架单元采用双面设计,减少了支架单元的平面面积,增加了支架单元的排版数量,提高生产效率以及降低生产成本。
Description
技术领域
本发明涉及电器信号接收组件领域,具体涉及一种贴片式红外支架及其生产工艺、红外接收头。
背景技术
请参照图1-2,现有红外支架一般包括工艺边框1和设置在工艺边框1内的若干个支架单元2,该工艺边框1和支架单元2均采用金属材料,这样的红外支架不但生产成本高,而且支架单元2不便于从工艺边框1中分离。另外,分离后的支架单元2的边缘存在毛刺,由于该毛刺为金属材料,质地硬,不便于去除,导致产品质量低。
发明内容
针对现有技术的不足,本发明提供一种贴片式红外支架,用于解决生产成本高以及产品质量低的问题。
本发明的内容如下:
一种贴片式红外支架,包括PCB基材板以及设置在所述PCB基材板上的若干个金属支架单元,所述支架单元包括单元本体、导电孔、A面引脚焊盘和B面引脚焊盘,所述单元本体和所述A面引脚焊盘均设置在所述PCB基材板的一面,所述B面引脚焊盘设置在所述PCB基材板的另一面,所述A面引脚焊盘和所述B面引脚焊盘通过所述导电孔电性连接。
优选的,所述PCB基材板包括玻璃纤维基板。
优选的,所述A面引脚焊盘和所述B面引脚焊盘相匹配,所述A面引脚焊盘包括电源焊盘、输出焊盘和至少一个接地焊盘,所述接地焊盘与所述单元本体电性连接。
优选的,所述接地焊盘的数量为两个,其中一个接地焊盘通过第一直角折线与所述电源焊盘电性连接,另一个接地焊盘通过第二直角折线与所述输出焊盘电性连接。
优选的,所述单元本体、所述A面引脚焊盘和所述B面引脚焊盘的表面设置有防氧化层。
进一步的,所述防氧化层为镍金层或镍银层。
本发明还公开了一种红外接收头,包括封装胶体以及均设置在所述封装胶体内的红外支架、光敏元件和红外接收芯片,所述光敏元件和所红外接收芯片电性连接,所述红外支架包括PCB基材板以及均设置在所述PCB基材板上的单元本体、导电孔、A面引脚焊盘和B面引脚焊盘,所述单元本体和所述A面引脚焊盘均设置在所述PCB基材板的一面,所述B面引脚焊盘设置在所述PCB基材板的另一面,所述A面引脚焊盘和所述B面引脚焊盘通过所述导电孔电性连接,所述红外接收芯片与所述A面引脚焊盘电性连接。
优选的,所述A面引脚焊盘和所述B面引脚焊盘相匹配,所述A面引脚焊盘包括电源焊盘、输出焊盘和至少一个接地焊盘,所述接地焊盘与所述单元本体电性连接,所述红外接收芯片分别与所述电源焊盘、所述输出焊盘和所述接地焊盘电性连接。
优选的,所述光敏元件的数量为两个,所述接地焊盘的数量为两个。
本发明还公开了一种贴片式红外支架的生产工艺,包括以下步骤:
S1.选择覆铜板作为基板并对基板进行剪裁;
S2.在裁剪后的基板上按照预设的孔径在预设的位置进行钻孔;
S3.通过化学沉积的方式在基板的孔内沉上一层铜,使不导电的孔成为导电的金属孔;
S4.对基板表面和金属孔进行电镀处理,加厚基板表面和金属孔的铜厚;
S5.利用菲林制作与线路对应的图形,并利用蚀刻液对非线路部分的铜进行蚀刻,以留下需要的线路;
S6.确认线路图形满足要求后将菲林褪去。
本发明的有益效果为:本发明的贴片式红外支架采用PCB基材板代替金属工艺边框,降低生产成本,而支架单元从工艺边框上分离产生的毛刺为非金属材料,可以采用腐蚀液进行处理,降低加工难度以及提高产品质量;与传统的支架相比,本发明的支架单元采用双面设计,减少了支架单元的平面面积,增加了支架单元的排版数量,提高生产效率以及降低生产成本;
本发明的红外接收头采用PCB基材板,可以减少支架单元边缘的毛刺,提高成品质量,而且与传统的产品相比,本发明的支架单元采用双面设计,支架单元的平面面积更小,从而减小红外接收头的平面面积,有利于提高红外接收头在电路板布线时的灵活性;
本发明的贴片式红外支架的生产工艺改变了传统的红外支架的生产工艺方法,从选材上降低了生产成本以及提高产品的质量。
附图说明
图1所示为现有的贴片式红外支架示意图;
图2所示为图1中A的局部放大图;
图3所示为本发明实施例贴片式红外支架的A面视图;
图4所示为本发明实施例贴片式红外支架的B面视图;
图5所示为图3中B的局部放大图;
图6所示为图4中C的局部放大图;
图7所示为本发明实施例的红外接收头内部结构示意图1;
图8所示为本发明实施例的红外接收头内部结构示意图2。
具体实施方式
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。
请参照图3-6,本实施例公开的一种贴片式红外支架,包括PCB基材板3以及设置在所述PCB基材板3上的若干个金属支架单元4,所述支架单元4包括单元本体41、导电孔42、A面引脚焊盘43和B面引脚焊盘44,所述单元本体41和所述A面引脚焊盘43均设置在所述PCB基材板3的一面,所述B面引脚焊盘44设置在所述PCB基材板3的另一面,所述A面引脚焊盘43和所述B面引脚焊盘44通过所述导电孔42电性连接。
所述PCB基材板3可采用常规的PCB板材,包括玻璃纤维基板。与传统的金属工艺边框相比,本实施例的生产成本更低,而且所述支架单元4从工艺边框上分离产生的毛刺为非金属材料,可以采用腐蚀液进行处理而不损伤所述支架单元4,降低加工难度以及提高产品质量。
请参照图3-6,所述A面引脚焊盘43和所述B面引脚焊盘44相匹配,所述A面引脚焊盘43包括电源焊盘VCC、输出焊盘OUT和至少一个接地焊盘GND,所述接地焊盘GND与所述单元本体41电性连接。请参照图7-8,图7所示为一个接地焊盘GND的示意图,图8所示为两个接地焊盘GND的示意图。请参照图5,在生产时需要为支架进行电镀处理,所以为了避免所述电源焊盘VCC和所述输出焊盘OUT孤立,其中一个接地焊盘GND通过第一直角折线45与所述电源焊盘VCC电性连接,另一个接地焊盘GND通过第而直角折线46与所述输出焊盘OUT电性连接,而直角折线的设计,可以在支架单元4分离时直接断开所述电源焊盘VCC或所述输出焊盘OUT与接地焊盘GND之间的连接,提高分板的便利性。
为了避免所述单元本体41、所述A面引脚焊盘43和所述B面引脚焊盘44氧化,所述单元本体41、所述A面引脚焊盘43和所述B面引脚焊盘44的表面设置有防氧化层,进一步的,所述防氧化层为镍金层或镍银层。
请参照图2、图5和图6,现有技术中一个边框只能容纳1X6X20,共120个支架单元,而本实施例的支架单元4采用双面设计,支架单元4的平面面积更小,一个边框可容纳2X6X20,共240个支架单元,有利于增加支架单元的排版数量,提高生产效率以及降低生产成本。而且与现有技术的工艺边框相比,本实施例的边框面积更小,但可容纳的支架单元更多。本实施例的支架单元4的平面面积小,可以减小采用该支架单元的红外接收头的平面面积,有利于提高红外接收头在电路板布线时的灵活性。
请参照图7-8,本实施例还公开了一种红外接收头,包括封装胶体以及均设置在所述封装胶体内的红外支架、光敏元件5和红外接收芯片6,所述光敏元件5和所红外接收芯片6电性连接,所述红外支架包括PCB基材板3以及均设置在所述PCB基材板3上的单元本体41、导电孔42、A面引脚焊盘43和B面引脚焊盘44,所述PCB基材板3可采用常规的PCB板材,包括玻璃纤维基板,便于处理所述支架单元4边缘的毛刺,可以减少毛刺,提高成品质量。
所述单元本体41和所述A面引脚焊盘43均设置在所述PCB基材板3的一面,所述B面引脚焊盘44设置在所述PCB基材板3的另一面,所述A面引脚焊盘43和所述B面引脚焊盘44通过所述导电孔42电性连接,所述红外接收芯片6与所述A面引脚焊盘43电性连接。而且与传统的产品相比,本实施例的支架单元4采用双面设计,支架单元4的平面面积更小,从而减小红外接收头的平面面积,有利于提高红外接收头在电路板布线时的灵活性。
所述A面引脚焊盘43和所述B面引脚焊盘44相匹配,所述A面引脚焊盘43包括电源焊盘VCC、输出焊盘OUT和至少一个接地焊盘GND,图7所示的所述光敏元件5和所述接地焊盘GND的数量均为一个,图8所示的所述光敏元件5和所述接地焊盘GND的数量均为两个。所述接地焊盘GND与所述单元本体41电性连接,所述红外接收芯片6分别与所述电源焊盘VCC、所述输出焊盘OUT和所述接地焊盘GND电性连接。
本实施例还公开了一种贴片式红外支架的生产工艺,包括以下步骤:
S1.选择覆铜板作为基板并对基板进行剪裁,本实施例的覆铜板包括玻璃纤维基板以及设置在玻璃纤维基板两面的铜箔;
S2.在裁剪后的基板上按照预设的孔径在预设的位置进行钻孔;
S3.通过化学沉积的方式在基板的孔内沉上一层铜(厚度为30~50微英尺),使不导电的孔成为导电的金属孔;
S4.对基板表面和金属孔进行电镀处理,加厚基板表面和金属孔的铜厚,基板表面最小铜厚108微米,最小孔铜厚度28微米;
S5.利用菲林制作与线路对应的图形,并利用蚀刻液对非线路部分的铜进行蚀刻,以留下需要的线路;
S6.确认线路图形满足要求后将菲林褪去。
为了更好的保护线路,还可以包括以下步骤:
S7.在线路的表面电镀上一层防氧化层,具体可以为镍金层或镍银层,其中防氧化层的厚度可根据实际生产需要确定,本实施例采用镍金层作为防氧化层,镍厚为120微英尺,金厚3微英尺。
本实施例的生产工艺改变了传统的红外支架的生产工艺方法,从选材上降低了生产成本以及提高产品的质量。
以上所述,只是本发明的较佳实施例而已,本发明并不局限于上述实施方式,只要其以相同的手段达到本发明的技术效果,都应属于本发明的保护范围。在本发明的保护范围内其技术方案和/或实施方式可以有各种不同的修改和变化。
Claims (9)
1.一种贴片式红外支架,其特征在于:包括PCB基材板(3)以及设置在所述PCB基材板(3)上的若干个金属支架单元(4),所述支架单元(4)包括单元本体(41)、导电孔(42)、A面引脚焊盘(43)和B面引脚焊盘(44),所述单元本体(41)和所述A面引脚焊盘(43)均设置在所述PCB基材板(3)的一面,所述B面引脚焊盘(44)设置在所述PCB基材板(3)的另一面,所述A面引脚焊盘(43)和所述B面引脚焊盘(44)通过所述导电孔(42)电性连接。
2.如权利要求1所述的贴片式红外支架,其特征在于:所述PCB基材板(3)包括玻璃纤维基板。
3.如权利要求1所述的贴片式红外支架,其特征在于:所述A面引脚焊盘(43)和所述B面引脚焊盘(44)相匹配,所述A面引脚焊盘(43)包括电源焊盘VCC、输出焊盘OUT和至少一个接地焊盘GND,所述接地焊盘GND与所述单元本体(41)电性连接。
4.如权利要求3所述的贴片式红外支架,其特征在于:所述接地焊盘GND的数量为两个,其中一个接地焊盘GND通过第一直角折线(45)与所述电源焊盘VCC电性连接,另一个接地焊盘GND通过第二直角折线(46)与所述输出焊盘OUT电性连接。
5.如权利要求1所述的贴片式红外支架,其特征在于:所述单元本体(41)、所述A面引脚焊盘(43)和所述B面引脚焊盘(44)的表面设置有防氧化层。
6.如权利要求5所述的贴片式红外支架,其特征在于:所述防氧化层为镍金层或镍银层。
7.一种红外接收头,包括封装胶体以及均设置在所述封装胶体内的红外支架、光敏元件(5)和红外接收芯片(6),所述光敏元件(5)和所红外接收芯片(6)电性连接,其特征在于:所述红外支架包括PCB基材板(3)以及均设置在所述PCB基材板(3)上的单元本体(41)、导电孔(42)、A面引脚焊盘(43)和B面引脚焊盘(44),所述单元本体(41)和所述A面引脚焊盘(43)均设置在所述PCB基材板(3)的一面,所述B面引脚焊盘(44)设置在所述PCB基材板(3)的另一面,所述A面引脚焊盘(43)和所述B面引脚焊盘(44)通过所述导电孔(42)电性连接,所述红外接收芯片(6)与所述A面引脚焊盘(43)电性连接。
8.如权利要求7所述的红外接收头,其特征在于:所述A面引脚焊盘(43)和所述B面引脚焊盘(44)相匹配,所述A面引脚焊盘(43)包括电源焊盘VCC、输出焊盘OUT和至少一个接地焊盘GND,所述接地焊盘GND与所述单元本体(41)电性连接,所述红外接收芯片(6)分别与所述电源焊盘VCC、所述输出焊盘OUT和所述接地焊盘GND电性连接。
9.如权利要求8所述的红外接收头,其特征在于:所述光敏元件(5)的数量为两个,所述接地焊盘GND的数量为两个。
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