CN110088847B - 导电颗粒、制品和方法 - Google Patents

导电颗粒、制品和方法 Download PDF

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Publication number
CN110088847B
CN110088847B CN201780078744.7A CN201780078744A CN110088847B CN 110088847 B CN110088847 B CN 110088847B CN 201780078744 A CN201780078744 A CN 201780078744A CN 110088847 B CN110088847 B CN 110088847B
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China
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particles
particle
core
conductive
glass
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Chinese (zh)
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CN110088847A (zh
Inventor
C·W·林赛
K·D·巴德
D·格霍施
N·O·珊蒂
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
CN201780078744.7A 2016-12-21 2017-12-19 导电颗粒、制品和方法 Active CN110088847B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662437236P 2016-12-21 2016-12-21
US62/437,236 2016-12-21
PCT/US2017/067247 WO2018118880A1 (en) 2016-12-21 2017-12-19 Conductive particles, articles, and methods

Publications (2)

Publication Number Publication Date
CN110088847A CN110088847A (zh) 2019-08-02
CN110088847B true CN110088847B (zh) 2021-07-06

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Family Applications (1)

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CN201780078744.7A Active CN110088847B (zh) 2016-12-21 2017-12-19 导电颗粒、制品和方法

Country Status (6)

Country Link
US (1) US10964441B2 (https=)
EP (1) EP3559958B1 (https=)
JP (1) JP2020514964A (https=)
KR (1) KR102458776B1 (https=)
CN (1) CN110088847B (https=)
WO (1) WO2018118880A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110041849A (zh) * 2019-04-25 2019-07-23 永道无线射频标签(扬州)有限公司 一种z向导电性能强化的导电胶
CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
US20230287248A1 (en) * 2020-07-29 2023-09-14 3M Innovative Properties Company Electrically Conductive Adhesive Film
KR102460883B1 (ko) * 2020-12-07 2022-11-02 덕산하이메탈(주) 전도성 입자
JP2024043509A (ja) * 2022-09-16 2024-03-29 サトーホールディングス株式会社 導電性基材の製造方法、電子デバイスの製造方法、電磁波シールドフィルムの製造方法、面状発熱体の製造方法および導電性組成物

Citations (3)

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CN101937734A (zh) * 2009-06-29 2011-01-05 三井金属矿业株式会社 复合铜粒子
JP2016076338A (ja) * 2014-10-03 2016-05-12 日立化成株式会社 導電粒子

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US4125665A (en) 1977-08-29 1978-11-14 Johnson & Johnson Container sealing tape
US4152231A (en) 1978-10-26 1979-05-01 Shell Oil Company Radiation cured polydiene based polymer composition
JPS608214A (ja) 1983-06-27 1985-01-17 Mitsubishi Rayon Co Ltd 歯科用材料
US4656213A (en) 1984-10-26 1987-04-07 Atlantic Richfield Company Acrylic hot melt pressure sensitive adhesive compounds
US4612242A (en) 1985-06-03 1986-09-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tape containing coated glass microbubbles
JP3083535B2 (ja) * 1990-06-01 2000-09-04 積水化学工業株式会社 導電性微粒子及び導電性接着剤
JP3608214B2 (ja) * 1994-01-27 2005-01-05 日立化成工業株式会社 異方導電性シートの製造方法
US5804610A (en) 1994-09-09 1998-09-08 Minnesota Mining And Manufacturing Company Methods of making packaged viscoelastic compositions
CA2243999C (en) 1996-02-05 2006-08-01 Minnesota Mining And Manufacturing Company Durable retroreflective elements
US6734256B1 (en) 1998-12-29 2004-05-11 3M Innovative Properties Company Block copolymer hot-melt processable adhesives, methods of their preparation, and articles therefrom
JP3083535U (ja) 2001-07-19 2002-02-08 東洋石材株式会社 透水性天然石敷石と透水性舗装構造
JP4050086B2 (ja) 2002-04-24 2008-02-20 ナトコ株式会社 導電性粒子、導電性材料および異方性導電膜
JP4387175B2 (ja) 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
EP2316567B1 (en) 2003-09-26 2018-01-24 3M Innovative Properties Co. Nanoscale gold catalysts, activating agents, support media, and related methodologies useful for making such catalyst systems especially when the gold is deposited onto the support media using physical vapor deposition
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KR101151366B1 (ko) * 2011-11-24 2012-06-08 한화케미칼 주식회사 도전성 입자 및 이의 제조방법
JP2015509915A (ja) 2011-12-22 2015-04-02 スリーエム イノベイティブ プロパティズ カンパニー エチレン除去剤
JP5620608B1 (ja) * 2012-12-28 2014-11-05 積水化学工業株式会社 有機無機ハイブリッド粒子、導電性粒子、導電材料及び接続構造体
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CN101937734A (zh) * 2009-06-29 2011-01-05 三井金属矿业株式会社 复合铜粒子
JP2016076338A (ja) * 2014-10-03 2016-05-12 日立化成株式会社 導電粒子

Also Published As

Publication number Publication date
KR102458776B1 (ko) 2022-10-25
KR20190097069A (ko) 2019-08-20
US10964441B2 (en) 2021-03-30
US20190326031A1 (en) 2019-10-24
JP2020514964A (ja) 2020-05-21
WO2018118880A1 (en) 2018-06-28
EP3559958B1 (en) 2026-01-21
CN110088847A (zh) 2019-08-02
EP3559958A1 (en) 2019-10-30

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