CN104575683B - 一种使用寿命长的导电银浆 - Google Patents
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 239000000843 powder Substances 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims abstract description 28
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims abstract description 21
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 14
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 13
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 7
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 7
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 7
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims abstract description 7
- 229910021538 borax Inorganic materials 0.000 claims abstract description 7
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 7
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims abstract description 7
- 235000019341 magnesium sulphate Nutrition 0.000 claims abstract description 7
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 7
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 7
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 7
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 7
- 235000010339 sodium tetraborate Nutrition 0.000 claims abstract description 7
- 239000004328 sodium tetraborate Substances 0.000 claims abstract description 7
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 7
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003921 oil Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 15
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000000498 ball milling Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000004115 Sodium Silicate Substances 0.000 claims description 6
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 claims description 6
- 229940077388 benzenesulfonate Drugs 0.000 claims description 6
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 6
- 239000000156 glass melt Substances 0.000 claims description 6
- 239000000787 lecithin Substances 0.000 claims description 6
- 229940067606 lecithin Drugs 0.000 claims description 6
- 235000010445 lecithin Nutrition 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011268 mixed slurry Substances 0.000 claims description 6
- 230000004048 modification Effects 0.000 claims description 6
- 238000012986 modification Methods 0.000 claims description 6
- UPWOEMHINGJHOB-UHFFFAOYSA-N oxo(oxocobaltiooxy)cobalt Chemical compound O=[Co]O[Co]=O UPWOEMHINGJHOB-UHFFFAOYSA-N 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- 235000013824 polyphenols Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- -1 sodium alkyl benzene Chemical class 0.000 claims description 6
- 229910001388 sodium aluminate Inorganic materials 0.000 claims description 6
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 6
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 6
- 235000010265 sodium sulphite Nutrition 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 239000002699 waste material Substances 0.000 claims description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 4
- UGTHTQWIQKEDEH-BQBZGAKWSA-N L-alanyl-L-prolylglycine zwitterion Chemical compound C[C@H](N)C(=O)N1CCC[C@H]1C(=O)NCC(O)=O UGTHTQWIQKEDEH-BQBZGAKWSA-N 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 235000019198 oils Nutrition 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 238000010791 quenching Methods 0.000 claims 2
- 230000000171 quenching effect Effects 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 239000005007 epoxy-phenolic resin Substances 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000007578 melt-quenching technique Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 238000009955 starching Methods 0.000 description 1
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Abstract
本发明公开了一种使用寿命长的导电银浆,其是由下述重量份的原料制得:1‑15μm银粉50‑65、30‑60nm铜粉5‑10、改性玻璃粉15‑22、硫酸铜0.3‑0.5、四硼酸钠0.1‑0.2、烷基多糖苷0.2‑0.4、有机硅油1.2‑1.6,十二烷基磺酸钠0.2‑0.4、硫酸镁0.1‑0.2、环己酮0.2‑0.4、聚乙二醇1‑2、聚乙烯吡咯烷酮0.2‑0.4,热塑性丙烯酸树脂3‑5,环氧酚醛树脂7‑10,正丁醇15‑18,异丙醇15‑18。本发明通过在银浆中加入改性玻璃粉,使银浆的电阻降低,同时提高导电银浆的耐焊性,延长导电银浆的保存时间。
Description
技术领域
本发明属导电银浆领域,尤其涉及一种使用寿命长的导电银浆。
背景技术
烧结型银导电浆料需要烧结成膜,烧结温度>500℃,玻璃粉或氧化物作为粘接相。银粉按照粒径分类,平均粒径<0.1μm(100nm)为纳米银粉; 0.1μm< Dav(平均粒径)
<10.0μm为银微粉;Dav(平均粒径)> 10.0μm为粗银粉。粉末的制备方法有很多,就银而言,可一次采用物理法(等离子、雾化法),化学法(硝酸银热分解法、液相还原)。由于银是贵金属,易被还原而回到单质状态,因此液相还原法是目前制备银粉的最主要的方法。即将银盐(硝酸银等)溶于水中,加入化学还原剂(如水合肼等),沉积出银粉,经过洗涤、烘干而得到银还原粉,平均粒径在0.1-10.0μm之间,还原剂的选择、反应条件的控制、界面活性剂的使用,可以制备不同物理化学特性的银微粉(颗粒形态、分散程度、平均粒径以及粒径分布、比表面积、松装密度、振实密度、晶粒大小、结晶性等),对还原粉进行机械加工(球磨等)可得光亮银粉(polished silver powder),片状银粉(silver flake)。
发明内容
本发明的目的是提供一种使用寿命长的导电银浆。
为了实现上述目的本发明采用如下技术方案:
一种使用寿命长的导电银浆,其特征在于,其是由下述重量份的原料制得:
1-15μm银粉50-65、30-60nm铜粉 5-10、改性玻璃粉15-22、硫酸铜0.3-0.5、四硼酸钠0.1-0.2、烷基多糖苷0.2-0.4、有机硅油1.2-1.6,十二烷基磺酸钠0.2-0.4、硫酸镁0.1-0.2、环己酮0.2-0.4、聚乙二醇1-2、聚乙烯吡咯烷酮0.2-0.4,热塑性丙烯酸树脂3-5,环氧酚醛树脂7-10,正丁醇15-18,异丙醇15-18;
改性玻璃粉由下述重量份的原料制得:废玻璃粉20-30、Bi2O3
5-8,Al2O3 5-8,SiO2 8-10,Co2O3 5-8,V2O55-8,P2O58-10,SrO 5-8、铝酸钠1-2、聚乙烯蜡2-4、氯化石蜡1-2、烷基苯磺酸钠2-4、偏硅酸钠3-5、土耳其红油 0.1-0.2,亚硫酸氢钠1-2、卵磷脂1-2、去离子水100-150;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,300-400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至130-150℃,200-500rpm下搅拌均匀,得改性液;
(2)废玻璃粉、Bi2O3、Al2O3 、SiO2 混匀烧结,烧结温度为1300-1600℃,时间为1.5-3小时,得玻璃熔融体淬火、球磨、干燥,所得粉体再与其余原料混匀后,升温到1200-1500℃,烧结3-5小时,得玻璃熔融体淬火、球磨、干燥,过筛得10-50nm玻璃粉;
(3)将玻璃粉与改性液混匀,于30-50℃下搅拌1-2小时,静置5-8小时,抽滤干燥,即得。
所述的一种使用寿命长的导电银浆,其特征在于:制备方法包括以下步骤:
(1)硫酸铜、四硼酸钠、烷基多糖苷、有机硅油、十二烷基磺酸钠、硫酸镁、环己酮、聚乙二醇、聚乙烯吡咯烷酮、热塑性丙烯酸树脂、环氧酚醛树脂、正丁醇、异丙醇混匀后,得有机载体;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入其余原料,搅拌均匀,得到混合浆料;
(3)将混合浆料球磨至浆料细度小于5μm,即得。
本发明的有益效果:
本发明通过在银浆中加入改性玻璃粉,使银浆的电阻降低,同时提高导电银浆的耐焊性,延长导电银浆的保存时间。
具体实施方式
一种使用寿命长的导电银浆,其是由下述重量(kg)的原料制得:
1-15μm银粉65、30-60nm铜粉10、改性玻璃粉22、硫酸铜0.3、四硼酸钠0.1、烷基多糖苷0.2、有机硅油1.2,十二烷基磺酸钠0.2、硫酸镁0.2、环己酮0.2、聚乙二醇1、聚乙烯吡咯烷酮0.2,热塑性丙烯酸树脂3,环氧酚醛树脂10,正丁醇15,异丙醇15;
改性玻璃粉由下述重量(kg)的原料制得:废玻璃粉30、Bi2O3
8,Al2O3 5,SiO2 10,Co2O3 5,V2O55,P2O58,SrO 5、铝酸钠1、聚乙烯蜡2、氯化石蜡2、烷基苯磺酸钠2、偏硅酸钠5、土耳其红油 0.2,亚硫酸氢钠1、卵磷脂1、去离子水130;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至150℃,400rpm下搅拌均匀,得改性液;
(2)废玻璃粉、Bi2O3、Al2O3 、SiO2 混匀烧结,烧结温度为1600℃,时间为3小时,得玻璃熔融体淬火、球磨、干燥,所得粉体再与其余原料混匀后,升温到1200-1500℃,烧结3-5小时,得玻璃熔融体淬火、球磨、干燥,过筛得10-50nm玻璃粉;
(3)将玻璃粉与改性液混匀,于50℃下搅拌2小时,静置8小时,抽滤干燥,即得。
所述的一种使用寿命长的导电银浆,制备方法包括以下步骤:
(1)硫酸铜、四硼酸钠、烷基多糖苷、有机硅油、十二烷基磺酸钠、硫酸镁、环己酮、聚乙二醇、聚乙烯吡咯烷酮、热塑性丙烯酸树脂、环氧酚醛树脂、正丁醇、异丙醇混匀后,得有机载体;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入其余原料,搅拌均匀,得到混合浆料;
(3)将混合浆料球磨至浆料细度小于5μm,即得。
采用丝网印刷机将银浆印刷于125mm×125mm Si基板上,然后在180℃干燥,再在880℃进行快速烧制电极引线,高温烧结后制成的电极引线表面银白,光滑无缺陷,剥离强度12 N/cm,锡焊性能良好,方阻<10 Siements/sq,制备的太阳能电池光电转化效率为19.7%,拉力测试结果为附着力>13N/mm2。
Claims (2)
1.一种使用寿命长的导电银浆,其特征在于,其是由下述重量份的原料制得: 1-15μm银粉50-65、30-60nm铜粉 5-10、改性玻璃粉15-22、硫酸铜0.3-0.5、四硼酸钠0.1-0.2、烷基多糖苷0.2-0.4、有机硅油1.2-1.6、十二烷基磺酸钠0.2-0.4、硫酸镁0.1-0.2、环己酮0.2-0.4、聚乙二醇1-2、聚乙烯吡咯烷酮0.2-0.4、热塑性丙烯酸树脂3-5、环氧酚醛树脂7-10、正丁醇15-18、异丙醇15-18; 改性玻璃粉由下述重量份的原料制得:废玻璃粉20-30、Bi2O3 5-8,Al2O3 5-8,SiO2 8-10,Co2O3 5-8,V2O5
5-8,P2O5 8-10,SrO 5-8、铝酸钠1-2、聚乙烯蜡2-4、氯化石蜡1-2、烷基苯磺酸钠2-4、偏硅酸钠3-5、土耳其红油 0.1-0.2、亚硫酸氢钠1-2、卵磷脂1-2、去离子水100-150; 所述的改性玻璃粉的制备方法为: (1)将铝酸钠、聚乙烯蜡、氯化石蜡以及去离子水加入反应釜中,300-400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂,升温至130-150℃,200-500rpm下搅拌均匀,得改性液; (2)废玻璃粉、Bi2O3、Al2O3 、SiO2 混匀烧结,烧结温度为1300-1600℃,时间为1.5-3小时,得烧结后玻璃熔融体,淬火、球磨、干燥,所得粉体再与其余原料混匀后,升温到1200-1500℃,烧结3-5小时,得玻璃熔融体,淬火、球磨、干燥,过筛得10-50nm玻璃粉; (3)将玻璃粉与改性液混匀,于30-50℃下搅拌1-2小时,静置5-8小时,抽滤干燥,即得。
2.根据权利要求1所述的一种使用寿命长的导电银浆,其特征在于:制备方法包括以下步骤:
(1)硫酸铜、四硼酸钠、烷基多糖苷、有机硅油、十二烷基磺酸钠、硫酸镁、环己酮、聚乙二醇、聚乙烯吡咯烷酮、热塑性丙烯酸树脂、环氧酚醛树脂、正丁醇、异丙醇混匀后,得有机载体;
(2)将改性玻璃粉加入到有机载体中,搅拌混合,再加入其余原料,搅拌均匀,得到混合浆料;
(3)将混合浆料球磨至浆料细度小于5μm,即得。
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