CN110047989B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN110047989B
CN110047989B CN201910034676.5A CN201910034676A CN110047989B CN 110047989 B CN110047989 B CN 110047989B CN 201910034676 A CN201910034676 A CN 201910034676A CN 110047989 B CN110047989 B CN 110047989B
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CN
China
Prior art keywords
light
wavelength conversion
side surfaces
emitting device
transmitting
Prior art date
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Active
Application number
CN201910034676.5A
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English (en)
Chinese (zh)
Other versions
CN110047989A (zh
Inventor
原田光范
立花佳织
安藤宪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of CN110047989A publication Critical patent/CN110047989A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

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  • Led Device Packages (AREA)
CN201910034676.5A 2018-01-16 2019-01-15 发光装置 Active CN110047989B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-005085 2018-01-16
JP2018005085A JP7083647B2 (ja) 2018-01-16 2018-01-16 発光装置

Publications (2)

Publication Number Publication Date
CN110047989A CN110047989A (zh) 2019-07-23
CN110047989B true CN110047989B (zh) 2024-05-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910034676.5A Active CN110047989B (zh) 2018-01-16 2019-01-15 发光装置

Country Status (4)

Country Link
US (1) US10937770B2 (https=)
EP (1) EP3511981B1 (https=)
JP (1) JP7083647B2 (https=)
CN (1) CN110047989B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019104978B4 (de) * 2019-02-27 2024-03-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauteil mit homogenisierter leuchtfläche
US12199218B2 (en) 2019-03-14 2025-01-14 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
JP6793899B1 (ja) 2019-11-14 2020-12-02 ヌヴォトンテクノロジージャパン株式会社 発光装置
EP3905316B1 (en) * 2019-11-14 2023-08-30 Nuvoton Technology Corporation Japan Light-emitting device
JP7108196B2 (ja) * 2019-12-26 2022-07-28 日亜化学工業株式会社 発光装置、波長変換部材の製造方法及び発光装置の製造方法
KR102919988B1 (ko) * 2020-03-17 2026-01-29 엘지이노텍 주식회사 조명 모듈 및 이를 구비한 조명 장치
JP7328568B2 (ja) 2021-06-30 2023-08-17 日亜化学工業株式会社 光源、光源装置及び光源の製造方法
EP4270483A1 (en) * 2022-04-28 2023-11-01 Nichia Corporation Light-emitting device and manufacturing method thereof
CN117438518A (zh) * 2022-07-21 2024-01-23 光宝科技股份有限公司 显示装置、其制造方法及形成其的制造设备
JP7575704B2 (ja) * 2022-07-21 2024-10-30 日亜化学工業株式会社 発光装置
EP4310912A1 (en) * 2022-07-21 2024-01-24 Nichia Corporation Light-emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102637802A (zh) * 2011-02-14 2012-08-15 斯坦雷电气株式会社 发光装置及其制造方法
CN103378269A (zh) * 2012-04-23 2013-10-30 日亚化学工业株式会社 发光装置
JP2015026753A (ja) * 2013-07-29 2015-02-05 スタンレー電気株式会社 半導体発光装置及びその製造方法
JP2017228600A (ja) * 2016-06-21 2017-12-28 スタンレー電気株式会社 半導体発光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009005907A1 (de) * 2009-01-23 2010-07-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
JP5736203B2 (ja) * 2011-03-22 2015-06-17 スタンレー電気株式会社 発光装置
JP6164038B2 (ja) * 2013-10-16 2017-07-19 豊田合成株式会社 発光装置
JP6187277B2 (ja) 2014-01-21 2017-08-30 豊田合成株式会社 発光装置及びその製造方法
JP6477001B2 (ja) * 2014-03-14 2019-03-06 日亜化学工業株式会社 発光装置及び発光装置の製造方法
TWI722925B (zh) 2014-12-08 2021-03-21 荷蘭商露明控股公司 波長轉換半導體發光裝置
JP2017059756A (ja) 2015-09-18 2017-03-23 シチズン時計株式会社 発光装置
EP3174110B1 (en) * 2015-11-30 2020-12-23 Nichia Corporation Light emitting device
JP6399017B2 (ja) * 2016-02-29 2018-10-03 日亜化学工業株式会社 発光装置
JP6638578B2 (ja) 2016-06-30 2020-01-29 日亜化学工業株式会社 シート成形体の製造方法、及びそれを用いた発光装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102637802A (zh) * 2011-02-14 2012-08-15 斯坦雷电气株式会社 发光装置及其制造方法
CN103378269A (zh) * 2012-04-23 2013-10-30 日亚化学工业株式会社 发光装置
JP2015026753A (ja) * 2013-07-29 2015-02-05 スタンレー電気株式会社 半導体発光装置及びその製造方法
JP2017228600A (ja) * 2016-06-21 2017-12-28 スタンレー電気株式会社 半導体発光装置

Also Published As

Publication number Publication date
US20190221550A1 (en) 2019-07-18
US10937770B2 (en) 2021-03-02
EP3511981A1 (en) 2019-07-17
EP3511981B1 (en) 2020-08-19
JP7083647B2 (ja) 2022-06-13
JP2019125690A (ja) 2019-07-25
CN110047989A (zh) 2019-07-23

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