CN110036454B - 用于真空接触器的改进电触点合金 - Google Patents
用于真空接触器的改进电触点合金 Download PDFInfo
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- CN110036454B CN110036454B CN201780074497.3A CN201780074497A CN110036454B CN 110036454 B CN110036454 B CN 110036454B CN 201780074497 A CN201780074497 A CN 201780074497A CN 110036454 B CN110036454 B CN 110036454B
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- carbide
- alloy
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- chromium
- copper
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 61
- 239000000956 alloy Substances 0.000 title claims abstract description 61
- 239000002245 particle Substances 0.000 claims abstract description 46
- 239000011651 chromium Substances 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 30
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 238000005245 sintering Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 20
- 239000007791 liquid phase Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical group [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 238000001513 hot isostatic pressing Methods 0.000 claims description 5
- 238000002490 spark plasma sintering Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 238000001778 solid-state sintering Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 claims description 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical group [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims description 2
- 229910039444 MoC Inorganic materials 0.000 claims description 2
- 230000004913 activation Effects 0.000 claims description 2
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical group [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 2
- WHJFNYXPKGDKBB-UHFFFAOYSA-N hafnium;methane Chemical group C.[Hf] WHJFNYXPKGDKBB-UHFFFAOYSA-N 0.000 claims description 2
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical group [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 claims description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical group [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 2
- 229910003470 tongbaite Inorganic materials 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical group C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 22
- 239000000843 powder Substances 0.000 description 22
- 239000002184 metal Substances 0.000 description 21
- 150000001247 metal acetylides Chemical class 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 238000012360 testing method Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- 229910021326 iron aluminide Inorganic materials 0.000 description 5
- 229910052723 transition metal Inorganic materials 0.000 description 5
- UJXVAJQDLVNWPS-UHFFFAOYSA-N [Al].[Al].[Al].[Fe] Chemical compound [Al].[Al].[Al].[Fe] UJXVAJQDLVNWPS-UHFFFAOYSA-N 0.000 description 4
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- UYKQQBUWKSHMIM-UHFFFAOYSA-N silver tungsten Chemical compound [Ag][W][W] UYKQQBUWKSHMIM-UHFFFAOYSA-N 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 150000003624 transition metals Chemical class 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VJNXOPQSNAGSNW-UHFFFAOYSA-N [Cr].[Bi].[Cu] Chemical compound [Cr].[Bi].[Cu] VJNXOPQSNAGSNW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004663 powder metallurgy Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910026551 ZrC Inorganic materials 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000009704 powder extrusion Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- -1 transition metal carbides Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H01H1/0206—Contacts characterised by the material thereof specially adapted for vacuum switches containing as major components Cu and Cr
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- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- Composite Materials (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Powder Metallurgy (AREA)
- Contacts (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
Abstract
本发明提供了一种改进的电触点(20、22)合金,其例如可用于真空接触器(100)中使用的真空断流器(10)。根据所公开构思的所述触点合金包括铜颗粒和铬颗粒,铜与铬的存在比率为2:3至20:1。所述电触点(20、22)合金还包括碳化物颗粒,其降低所述电触点(20、22)合金的焊接断裂强度而不降低其中断性能。
Description
背景技术
技术领域
所公开的构思整体涉及合金,并且更具体地讲,涉及用于真空接触器的触点的合金。
发明背景
真空电路断流器(例如但不限于真空电路断路器、真空开关、负载断路开关)为电气系统提供保护,从而免受电气故障状况(诸如电流过载、短路和低电平电压状况)以及负载断路和其他切换工作的影响。通常,真空电路断流器包括弹簧动力或其他合适的操作机构,该操作机构响应于正常或异常状况而打开许多真空断流器内的电触点以中断流过电气系统中的导体的电流。真空接触器是一种主要为切换三相电动机而开发的真空断流器。在一些实施方案中,真空断流器用于中断中电压交流(AC)电流以及数千安培(A)或更高的高电压AC电流。在一个实施方案中,为多相电路中的每个相提供了一个真空断流器,并且通过共用操作机构同时地或通过单独操作机构分开地或独立地致动若干相的真空断流器。
真空断流器大体包括可分离电触点,其设置在限定真空室的绝缘且密封的壳体内。通常,触点中的一个相对于壳体和外部电导体两者固定,该外部电导体与和真空断流器相关联的电源电路电互连。另一个触点是可移动触点组件的一部分,其可以包括杆和在壳体的密封真空室内位于杆的一端上的触点。
当可分离触点在电流流过真空断流器的情况下打开时,金属蒸气电弧在触点表面之间撞击,这会持续直到电流中断,通常是在电流进入过零点时。
真空断流器通常用于其中它们的额定操作电压为500V至40,000V,开关电流高达4000A或更高,并且最大断开电流高达80,000A或更高的应用,并且它们被预计为具有10,000个至超过1,000,000个机械和/或电气循环的长使用寿命。真空接触器中使用的真空断流器的额定操作电压为480V-15,000V,开关电流为150A-1400A,并且最大断路电流为1500A-14000A。参见P.G.Slade,THE VACUUM INTERRUPTER,THEORY DESIGN ANDAPPLICATION,(pub.CRC Press)(2008)Sec.5.4at pp.348-357(P.G.Slade,真空断流器,理论设计和应用,CRC出版社,2008年,第5.4章,第348-357页)。用于真空接触器工作的真空断流器还被预计为表现出附加的电气特性,诸如低斩波电流、低焊接断裂力和低触点腐蚀率,以产生通常高达或超过1,000,000个操作循环的长电气开关寿命。
现有真空接触器触点合金(诸如银-碳化钨(AgWC))在较低电流下良好操作,但成本很高。铜-碳化钨(CuWC)是成本较低的替代品,但具有较高的斩波电流并且不常用。铜-碳化钨和银-碳化钨都需要昂贵的外部线圈或昂贵的电弧控制磁触点设计以便在更高的额定值下中断,诸如1000V 800A-1400A、7200V 400A-800A以及接触器真空断流器也用于电路断路器工作的特殊应用。铜-铬-铋(CuCrBi)已经用于这些额定值,其具有更好的中断、低斩波和低焊接,但缩短了电气寿命。挤出型铜-铬(CuCr)已成功在这些较高额定值下应用(参见,例如,欧洲专利公开EP 1130608),但与银-碳化钨或铜-铬-铋相比具有更高的斩波和更多的焊接。
发明内容
本发明提供了触点合金,其在400A或更高的真空接触器额定值下(特别是在较高的电压下)具有改进的中断,并且不会受到一些常规合金所经历的缩短的有用电气寿命的影响。
本文描述了用于电触点的改进触点合金的各种实施方案。改进触点合金可用于接触组件(诸如但不限于真空断流器)的要求。
作为所公开构思的一个方面,提供了用于真空断流器的电触点合金。在各种实施方案中,根据所公开构思的合金包括:铜颗粒和铬颗粒。铜与铬相对于彼此的重量比率的范围可以为2:3至20:1。电触点合金还包含碳化物颗粒。碳化物相对于合金的存在量的范围可以为0重量%至73重量%。
在所公开构思的各种实施方案中,碳化物可选自过渡金属碳化物,并且更具体地讲,选自由以下各项组成的金属碳化物组:碳化钨、碳化钼、碳化钒、碳化铬、碳化铌和碳化钽、碳化钛、碳化锆和碳化铪。在所公开构思的各种实施方案中,碳化物可以是碳化硅。
所公开构思的合金可以通过任何合适的粉末金属技术来制造。在各种实施方案中,提供了制造用于真空断流器的电触点的方法。该方法可以包括:将碳化物颗粒研磨成期望尺寸;提供铜颗粒和铬颗粒;将碳化物颗粒与铜颗粒和铬颗粒混合,铜与铬的存在比率为2:3至20:1;将混合物压成压块;以及通过固态烧结、液相烧结、放电等离子体烧结、真空热压和热等静压中的一种来烧结压块。
附图说明
通过参考附图可以更好地理解本公开的特征和优点。
图1是用于真空接触器的真空断流器的方面的横截面,该真空接触器类似于图2的真空断流器。
图2是真空接触器以及其真空断流器的示意图。
图3是焊接力的间隔曲线图,示出了用以使焊接断裂的力的数据范围以及若干种测试材料的平均值。
优选实施方案描述
如本文所用,单数形式的“一个”、“一种”和“该”包括复数指称,除非上下文另外明确地说明。
本文使用的方向短语,诸如,例如但不限于顶部、底部、左、右、下、上、前、后和其变型,应当与附图所示的元件的定向相关并且除非另有明确说明,否则不限制权利要求书。
在本申请中,包括权利要求书,除了另有说明之外,表示数量、值或特征的所有数字应当理解为在所有情况下均由术语“约”修饰。因此,尽管术语“约”可能没有明确地与数字一起出现,但数字可以被解读为好像在前面有词语“约”。因此,除非有相反的说明,否则在以下描述中阐述的任何数值参数可以根据技术人员在根据本公开的组合物和方法中寻求获得的期望性质而变化。至少,并且不是试图将等同原则的应用限于权利要求书的范围,本说明书中描述的每个数值参数应当至少根据报告的有效数字的数量并且通过应用惯常的四舍五入法来解释。
本文引用的任何数值范围旨在包括其中包含的所有子范围。例如,“1到10”的范围旨在包括所引用最小值1与所引用最大值10之间的所有子范围(并且包括该最小值和最大值),即具有等于或大于1的最小值和等于或小于10的最大值。
在图2中示出了示例性真空断流器10,其作为在图1所示的三相真空接触器100中有用的断流器的示例。在所示的实施方案中,真空断流器包括绝缘管14(诸如陶瓷管),其与端构件40和42(例如但不限于密封杯)形成真空封壳44。固定触点20安装在固定电极30上,该固定电极延伸穿过端构件40。可移动触点22由可移动电极32承载并且延伸穿过另一个端构件42。固定触点20和可移动触点22形成可分离触点,该可分离触点在闭合时完成固定电极30与可移动电极32之间的电路,并且在通过可移动电极32的轴向移动而打开时中断流过真空断流器10的电流。通过连接到真空封壳44外部的可移动电极32的操作机构(未示出),可移动电极32轴向移动以打开和闭合可分离触点20/22。
触点20/22由本文公开构思的改进合金制成。改进触点合金是铜-铬-X碳化物(CuCrXC),其中X优选地是金属或半金属元素,更优选地是过渡金属,并且最优选地是选自元素周期表的第4、5和6族的金属。用于形成金属碳化物的示例性金属包括钛(Ti)、锆(Zr)、铪(Hf)、钨(W)、钼(Mo)、钒(V)、铬(Cr)、铌(Nb)和钽(TA)。
碳化物是其中碳与正电性元素(诸如金属或半金属元素)结合的一类化学化合物中的任何一种。根据碳化物的性质,有三种广泛的碳化物分类。最具电正性的金属形成离子或盐类碳化物,元素周期表中间的第4、5和6族过渡金属倾向于形成所谓的填隙碳化物,并且具有与碳的电负性相类似的电负性的非金属形成共价或分子碳化物。填隙碳化物与过渡金属结合,并且其特征在于极高的硬度和脆性以及高熔点(通常为约3,000℃-4,000℃[5,400℉-7,200℉])。它们保留了与金属本身相关联的许多特性,诸如高热导率和电导率。形成填隙碳化物的过渡金属包括钛(Ti)、锆(Zr)、铪(Hf)、钨(W)、钼(Mo)、钒(V)、铬(Cr)、铌(Nb)和钽(TA)。可也使用碳化硅。
所公开构思的示例性触点合金包括CuCrWC、或CuCrMoC、或CuCrVC、或CuCrCrC、或CuCrNbC、或CuCrTaC。
所公开构思的合金利用铜-铬的良好电流中断,并且至少在一个示例性实施方案中利用碳化钨的低焊接断裂力。可以调整所公开构思的合金以控制该合金的微结构以及用该合金制成的触点20/22的密度。
在各种实施方案中,铜颗粒的存在量的范围为40重量%至90重量%。在各种实施方案中,铬颗粒的存在量的范围为60重量%至10重量%。在各种实施方案中,金属碳化物颗粒的存在量的范围为0重量%至73重量%。相对于彼此,铜颗粒与铬颗粒的比率的范围为2:3至20:1,其中Cu:Cr的优选比率为55:45,以用于真空接触器应用。表1示出了没有添加碳化物的对照物的重量和体积百分比组成,以及用于形成所公开构思的合金的实施方案的所识别颗粒的混合物的三种样品,其中金属碳化物是碳化钨(WC)。
表1
合金 | A | B | C | D |
Cu重量% | 55 | 53.9 | 52.4 | 49.9 |
C重量% | 45 | 44.1 | 42.9 | 40.8 |
WC重量% | 0 | 1.9 | 4.8 | 9.3 |
Cu体积% | 49.4 | 48.9 | 48.2 | 46.9 |
Cr体积% | 50.6 | 50.1 | 49.3 | 48.1 |
WC体积% | 0 | 1 | 2.5 | 5 |
向铜和铬添加碳化物颗粒被认为会增加合金的脆性,这减小了使在相邻触点之间可能由在高电流流过触点时产生的热量而形成的焊接断裂所需的力。增加的脆性改变合金的强度以使得减小了分离相邻触点所需的力,从而使得触点可分离地接合,更像是通过拉链而不是不可分离接缝保持在一起的织物的相邻侧面。
不同于也很脆的现有合金(诸如铜-铬-铋(CuCrBi)),所公开构思的合金的实施方案在电弧放电期间不会发射大量金属,然后涂覆陶瓷壳体,从而将被设计为绝缘的结构转换成导体,由此减少了真空断流器的整体电气寿命。
通过调整铜-铬比、金属碳化物颗粒尺寸、金属碳化物的相对量、以及碳化物颗粒在铜铬基体中的分布和放置,所公开构思的合金可以针对给定的接触器额定值或期望的应用进行优化。
对于期望更高导电性的应用,可以增加铜的量。对于成品触点的强度必须更强或更弱的应用,将减少或增加碳化物的量。如果期望减少焊接强度,则可以在本文公开的范围内增加铬或碳化物中的任一者或两者的量。如果期望减小斩波电流,则可以在本文公开的范围内增加碳化物的量。
触点合金可以通过任何合适的已知粉末金属工艺制造,包括但不限于固态烧态、液相烧结、放电等离子体烧结、真空热压和热等静压。粉末冶金压制和烧结工艺通常由三个基本步骤组成:粉末混合、模压和烧结。压实通常在室温下执行,并且在高真空或大气压下以及在精心控制的气氛组成下进行高温烧结工艺。随后可以进行任选的二次加工(诸如压印或热处理)以获得特殊特性或增强的精度。
例如,使用液相压制和烧结工艺来制备表1中列出的合金。将表1中列出的组合物的元素粉末在带式混合器中混合,重力进料到模腔中,并且在液压粉末压制机上以44吨/平方英寸至48吨/平方英寸的压力来压实。将由此形成的压块在氧化铝粉末下方装入杯中,然后装载到真空烧结炉中。真空烧结炉在8E-5托或更低的真空水平下将它们加热至1185℃的温度,将部件真空冷却至500℃,并且然后使用分压氮气将部件强制冷却至室温。在卸载后,将烧结部件干燥机加工成最终的触点形状,然后钎焊到真空断流器中。
在示例性固态粉末冶金工艺中,将预混合金属粉末进料(通常通过重力进料)到模腔中,并且在大多数情况下压实成部件的最终净形状,并且然后从模具中排出。将部件压实到一定尺寸所需的力通常为约15吨/平方英寸-50吨/平方英寸。接下来,将部件装载到真空烧结炉中,该真空烧结炉在1E-4托或更低的真空水平下对部件进行加热,直到它达到颗粒的烧结和粘结所需的温度,在本文公开构思的合金的情况下,温度接近但不大于构成颗粒的元素的最低熔点,诸如在该示例性情况下为1050℃。然后在真空下将已粘结颗粒冷却至500℃的温度,然后在分压下用循环氮气来强制冷却直到部件达到室温,之后从炉中卸载。
在示例性液相烧结粉末冶金工艺中,将预混合金属粉末进料(通常通过重力进料)到模腔中,压实,然后从模具中排出。将部件压实到一定尺寸所需的力通常为约15吨/平方英寸-50吨/平方英寸。接下来,将部件装载到真空烧结炉中,该真空烧结炉在1E-4托或更低的真空水平下对部件进行加热,直到它达到颗粒的烧结和粘结所需的温度,在液相烧结本文公开构思的合金的情况下,温度高于构成颗粒的元素的最低熔点,诸如至少大于1074℃。然后在真空下将已粘结的颗粒冷却至500℃的温度,然后在分压下用循环氮气来强制冷却直到部件达到室温,之后从炉中卸载。
在示例性放电等离子体烧结工艺中,将本文公开构思的合金的混合金属粉末装载到模具中。然后在受控分压气氛下使直流(DC)以脉冲形式直接通过石墨模具和模具中的粉末压块。已经发现焦耳加热在粉末压块的致密化中起主导作用,与常规烧结技术相比,这导致在更低的烧结温度下实现接近理论密度。与其中热量由外部加热元件提供的常规热压相比,热量产生在内部。这有利于非常高的加热或冷却速率(高达1000K/min),因此烧结工艺通常非常快(在几分钟内)。该工艺的一般速度确保其具有使具有纳米尺寸或纳米结构的粉末致密化的潜力,同时避免可能伴随标准致密化路线的粗化。
示例性真空热压工艺包括将本文公开构思的合金的混合金属粉末装载到模具中,将模具装载到真空热压机中,该真空热压机可以在高真空和高温下对已装载模具施加单轴力。模具可以是多腔模具以提高生产率。然后在1E-4托或更低的真空水平下将已装载模具加热至1868℉(1020℃),并且将2.8吨/平方英寸压块的压力施加到该模具。这种状况持续10分钟。然后在真空下将模具和粉末压块冷却至500℃,然后在分压下用循环氮气来强制冷却,直到部件达到室温并且被卸载。
在示例性热等静压工艺中,通过施加约100MPa(1000bar,15,000psi)的外部气压持续10分钟-100分钟,并且施加范围通常从900℉(480℃)到2250℉(1230℃)的热量(但在所公开构思的合金的处理时,加热到范围从1652℉(900℃)至1965℉(1074℃)的温度)来同时压缩和烧结颗粒。用氩气或其他惰性气体填充炉以防止在操作过程中发生化学反应。
为了增加对合金坯料或由选定成形工艺形成的触点的密度的控制,可以将烧结活化元素添加到混合物中以进一步处理。与铜、铬和金属碳化物的主要组分相比,活化元素需要以相对小的量添加。据信小于0.5重量%并且在各种实施方案中,小于0.1重量%的活化元素需要被添加以获得所期望的密度水平。根据最终产品的期望密度,精确量将变化,这可以由本领域技术人员容易地确定。示例性活化元素包括铁-镍、铝化铁、镍、铁和钴,其通常以碳化物组分的0.1重量%至60重量%的量来添加。烧结活化元素通过与碳化物形成瞬时或持久的液相来增加密度,这允许它在更低的温度下烧结到更高的密度(与没有它的情况相比)。本领域技术人员将理解,可以在混合物中使用其他活化元素或合金。
触点可以由如本文所述的合金,通过压制、粉末挤出、金属注射或类似工艺由可机加工坯料或网状或近净成形部件制成。
用于制造触点(诸如用于真空断流器的触点)的方法包括:大体将碳化物颗粒研磨成期望尺寸;提供在尺寸上大于研磨碳化物颗粒的铜颗粒和铬颗粒;将研磨碳化物颗粒与铜颗粒和铬颗粒混合;将混合物压成压块;以及将压块加热到适合于选自由以下各项组成的组的烧结工艺的温度:固态烧结、液相烧结、放电等离子体烧结、真空热压和热等静压,使得该压块达到适合用作真空断流器触点的密度、强度、导电率和其他特性。
在上述方法中,铜颗粒和铬颗粒以铜与铬的2:3至9:1的比率,优选地11:9的比率存在。
在其中铜是混合物的具有最低熔点的元素的合金的实施方案中,加热步骤在大于1074℃的温度下进行,并且优选地在大于1074℃至高达1200℃之间的温度下进行,并且更优选地在1190℃的温度下进行。
为了增加最终部件密度,可以将烧结活化元素添加到混合物中以在加热时增加压块的密度。合适的烧结活化元素包括钴、镍、镍-铁、铝化铁以及其组合。
用于形成在真空断流器中使用的触点的示例性工艺如下进行。将碳化钨粉末与2.3重量%的铝化铁粉末混合,其中铝包括24.4重量%的铝化铁。对混合物进行棒磨以使碳化物解聚并且分散活化剂。将9.3重量%的棒磨碳化物/活化剂混合物与铜和铬粉末混合,其中铜:铬的重量比率为55:45,直至均匀。然后,所得粉末混合物中的每种组分的组成为49.8重量%的铜、40.7重量%的铬、9.3重量%的碳化钨和0.2重量%的铝化铁。将该混合粉末填充到模腔中,并且然后通过用压制机施加48吨/平方英寸的压力将混合粉末压缩成压块,从而形成压块。将压块装在氧化铝粉末下方,并且然后装载到真空烧结炉中。在8E-5托或更低的真空水平下、在1190℃的温度下将压块真空烧结5小时,将部件真空冷却至500℃,并且在分压氮气下将部件强制冷却至室温。卸载炉,并且将已烧结的坯料干燥机加工成触点最终形状。将机加工触点钎焊到真空断流器中。
进行测试以证明根据所公开构思的合金的改进特性。将所公开构思的合金的实施方案与迄今为止在电触点中使用的AgWC、CuWC和CuCr合金进行比较。
使用液相压制和烧结工艺来制备表1中列出的合金。将表1中列出的组合物的元素粉末在带式混合器中混合,重力进料到模腔中,并且在液压粉末压制机上以44吨/平方英寸至48吨/平方英寸的压力来压实。将由此形成的压块在氧化铝粉末下方装入杯中,然后装载到真空烧结炉中。真空烧结炉在8E-5托或更低的真空水平下将它们加热至1185℃的温度,将部件真空冷却至500℃,并且然后使用分压氮气将部件强制冷却至室温。在卸载后,将已烧结部件干燥机加工成最终触点形状,即直径为英寸且厚度为0.1英寸的简单圆盘几何形状。
将如此制造的触点钎焊到真空断流器中,该真空断流器的产品类型为WL-36327,具有2"的封壳直径,如图2中示意性示出。该产品通常适用于根据IEC 60470和62271-1以及UL 347的真空接触器应用,其中在60Hz和52磅的外加力下,最大线电压为1.5kVrms,额定连续电流为400Arms,最大短路断开电流为4kArms,峰值耐受电流为15.6kApeak。测试已组装的真空断流器的焊接强度和短路中断,以及由组成为58.5重量%的碳化钨、40重量%的银和1.5重量%的钴的银碳化钨触点制成的相同“对照”真空断流器。
在伊顿公司(Eaton Corporation)的位于纽约州霍斯黑兹的制造厂的高功率实验室处评估了真空断流器的中断性能和焊接断裂强度。比较性中断测试由50个单相试验组成以便以1.5kVrms 4kArms的额定值进行中断:该测试应用于每种触点合金的至少两个真空断流器。焊接断裂强度测试包括通过向试验真空断流器施加1个完整的60Hz周期的15.6kA峰值AC电流来产生焊接,其中触点力为14.9磅,包括大气波纹管力。然后将已经形成的焊接送到配备有力传感器的拉动装置,并且记录打开触点所需的力。图3显示了每种测试材料的数据点。表2中给出了平均焊接断裂强度和中断电流结果。
表2
测试结果
从表2中的结果中可以看出,向CuCr45合金添加碳化物显著减少焊接断裂力而不减小中断性能,从而提供用于旨在进行真空接触器工作的真空断流器的改进电触点。
已经参考各种示例性和说明性实施方案描述了本发明。本文描述的实施方案被理解为提供所公开发明的各种实施方案的不同细节的说明性特征;并且因此,除非另有说明,否则应当理解,在可能的范围内,所公开的实施方案的一个或多个特征、元件、部件、组成、成分、结构、模块和/或方面可以在不脱离所公开发明的范围的情况下与或相对于所公开实施方案的一个或多个其他特征、元件、部件、组成、成分、结构、模块和/或方面进行组合、分离、相互交换和/或重新布置。因此,本领域普通技术人员将认识到,在不脱离本发明的范围的情况下,可以进行示例性实施方案中的任一个的各种替换、修改或组合。此外,在阅读本说明书后,本领域技术人员将认识到或者能够使用不超过常规的实验确定本文所述的本发明的各种实施方案的许多等同物。因此,本发明不受各种实施方案的描述的限制,而是受权利要求书的限制。
Claims (14)
1.一种电触点(20、22)合金,包括:
铜颗粒;
铬颗粒;
铜与铬相对于彼此的重量比率,所述比率的范围为2:3至20:1;以及
碳化物颗粒,所述碳化物颗粒相对于所述合金的存在量的范围为0重量%至73重量%;以及
烧结活化元素,所述烧结活化元素的存在量小于0.5重量%以增加密度。
2.根据权利要求1所述的合金,其中铜与铬的所述比率为55:45。
3.根据权利要求1所述的合金,其中所述碳化物是碳化钨。
4.根据权利要求1所述的合金,其中所述碳化物是碳化钼。
5.根据权利要求1所述的合金,其中所述碳化物是碳化钒。
6.根据权利要求1所述的合金,其中所述碳化物是碳化铌。
7.根据权利要求1所述的合金,其中所述碳化物是碳化钽。
8.根据权利要求1所述的合金,其中所述碳化物是碳化铬。
9.根据权利要求1所述的合金,其中所述碳化物是碳化钛。
10.根据权利要求1所述的合金,其中所述碳化物是碳化铪。
11.根据权利要求1所述的合金,其中所述铬相对于铜的存在量的范围为5重量%至60重量%,剩余部分为铜。
12.一种用于真空断流器(10)的电触点(20、22),包括:
根据权利要求1至11中任一项所述的电触点合金。
13.一种制造用于真空断流器(10)的电触点(20、22)的方法,包括:
将碳化物颗粒研磨成期望尺寸;
提供在尺寸上大于所述研磨碳化物颗粒的铜颗粒和铬颗粒;
将所述研磨碳化物颗粒与所述铜颗粒和所述铬颗粒混合,铜与铬的存在比率为2:3至20:1;
将所述混合物压成压块;以及
将所述压块加热到适合于选自由固态烧结、液相烧结、放电等离子体烧结、真空热压和热等静压组成的组的烧结工艺的温度,使得所述压块达到适合用作真空断流器触点的特性;
其中,工艺是烧结工艺,并且所述方法还包括向所述混合物添加存在量小于0.5重量%的烧结活化元素以在烧结时增加所述压块的密度。
14.根据权利要求13所述的方法,还包括通过对致密坯料进行机械成形来形成具有期望配置的电触点(20、22)。
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