CN109952199A - 多层脱模膜，多层脱模膜的制造方法，柔性印刷基板的制造方法 - Google Patents

多层脱模膜，多层脱模膜的制造方法，柔性印刷基板的制造方法 Download PDF

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Publication number
CN109952199A
CN109952199A CN201880004372.8A CN201880004372A CN109952199A CN 109952199 A CN109952199 A CN 109952199A CN 201880004372 A CN201880004372 A CN 201880004372A CN 109952199 A CN109952199 A CN 109952199A
Authority
CN
China
Prior art keywords
release film
layer
multilayer
supporting course
middle layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880004372.8A
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English (en)
Chinese (zh)
Inventor
加藤高久
海老原智
大竹亮生
清水阳介
岛村浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Mektron Corp
Nippon Mektron KK
Original Assignee
Japan Mektron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Mektron Corp filed Critical Japan Mektron Corp
Publication of CN109952199A publication Critical patent/CN109952199A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201880004372.8A 2017-10-03 2018-09-13 多层脱模膜，多层脱模膜的制造方法，柔性印刷基板的制造方法 Pending CN109952199A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-193560 2017-10-03
JP2017193560A JP6917265B2 (ja) 2017-10-03 2017-10-03 多層離型フィルム及び多層離型フィルムの製造方法、並びに該多層離型フィルムを用いたフレキシブルプリント基板の製造方法
PCT/JP2018/034049 WO2019069656A1 (ja) 2017-10-03 2018-09-13 多層離型フィルム、多層離型フィルムの製造方法、並びにフレキシブルプリント基板の製造方法

Publications (1)

Publication Number Publication Date
CN109952199A true CN109952199A (zh) 2019-06-28

Family

ID=65995378

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880004372.8A Pending CN109952199A (zh) 2017-10-03 2018-09-13 多层脱模膜，多层脱模膜的制造方法，柔性印刷基板的制造方法

Country Status (4)

Country Link
JP (1) JP6917265B2 (ja)
CN (1) CN109952199A (ja)
TW (1) TW201922495A (ja)
WO (1) WO2019069656A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111065214A (zh) * 2019-12-17 2020-04-24 深圳市新宇腾跃电子有限公司 线路板覆盖膜贴合工艺
WO2022025419A1 (ko) * 2020-07-29 2022-02-03 이호돈 거푸집 박리필름

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6977848B1 (ja) * 2020-11-02 2021-12-08 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
CN114258207B (zh) * 2021-11-19 2023-10-13 深圳市景旺电子股份有限公司 覆盖膜制作方法、覆盖膜及其贴合方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273831A (ja) * 2001-03-21 2002-09-25 Toray Ind Inc 離型用積層フィルム及びそれを用いた離型フィルム
JP2004142305A (ja) * 2002-10-25 2004-05-20 Asahi Glass Co Ltd 積層フィルム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273731A (ja) * 2001-03-16 2002-09-25 Univ Fukuoka 使用済み紙おむつの再利用のための紙おむつ分断前処理方法
JP3797185B2 (ja) * 2001-10-11 2006-07-12 東レ株式会社 剥離性積層フィルムおよびそれを用いたセラミックグリーンシート用工程フィルム
JP2003276140A (ja) * 2002-03-25 2003-09-30 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
JP2004017610A (ja) * 2002-06-20 2004-01-22 Toray Ind Inc 離型フィルム
JP4022140B2 (ja) * 2002-12-25 2007-12-12 アイシン精機株式会社 リニアアクチュエータ
JP6466050B2 (ja) * 2012-12-21 2019-02-06 住友ベークライト株式会社 離型フィルム
JP5992876B2 (ja) * 2013-03-29 2016-09-14 日本メクトロン株式会社 離型フィルム及びその製造方法並びにフレキシブルプリント基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273831A (ja) * 2001-03-21 2002-09-25 Toray Ind Inc 離型用積層フィルム及びそれを用いた離型フィルム
JP2004142305A (ja) * 2002-10-25 2004-05-20 Asahi Glass Co Ltd 積層フィルム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111065214A (zh) * 2019-12-17 2020-04-24 深圳市新宇腾跃电子有限公司 线路板覆盖膜贴合工艺
CN111065214B (zh) * 2019-12-17 2023-02-07 深圳市新宇腾跃电子有限公司 线路板覆盖膜贴合工艺
WO2022025419A1 (ko) * 2020-07-29 2022-02-03 이호돈 거푸집 박리필름

Also Published As

Publication number Publication date
JP6917265B2 (ja) 2021-08-11
TW201922495A (zh) 2019-06-16
WO2019069656A1 (ja) 2019-04-11
JP2019064200A (ja) 2019-04-25

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Application publication date: 20190628

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