CN109906029B - 电子部件安装装置以及电子部件安装方法 - Google Patents

电子部件安装装置以及电子部件安装方法 Download PDF

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Publication number
CN109906029B
CN109906029B CN201811354138.6A CN201811354138A CN109906029B CN 109906029 B CN109906029 B CN 109906029B CN 201811354138 A CN201811354138 A CN 201811354138A CN 109906029 B CN109906029 B CN 109906029B
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China
Prior art keywords
substrate
chip component
chip
camera
recognition
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CN201811354138.6A
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English (en)
Chinese (zh)
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CN109906029A (zh
Inventor
山岸昭隆
宫坂研吾
上岛直人
本藤弘敏
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Ericsson Inc
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Ericsson Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN201811354138.6A 2017-12-08 2018-11-14 电子部件安装装置以及电子部件安装方法 Active CN109906029B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017235988A JP2019102771A (ja) 2017-12-08 2017-12-08 電子部品実装装置及び電子部品実装方法
JP2017-235988 2017-12-08

Publications (2)

Publication Number Publication Date
CN109906029A CN109906029A (zh) 2019-06-18
CN109906029B true CN109906029B (zh) 2021-01-01

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ID=66943307

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CN201811354138.6A Active CN109906029B (zh) 2017-12-08 2018-11-14 电子部件安装装置以及电子部件安装方法

Country Status (3)

Country Link
JP (1) JP2019102771A (ja)
KR (1) KR102132094B1 (ja)
CN (1) CN109906029B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110854045A (zh) * 2019-11-20 2020-02-28 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 利用准直光路调整芯片吸盘与基板吸盘平行度的方法
JP7436251B2 (ja) * 2020-03-16 2024-02-21 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7451259B2 (ja) * 2020-03-26 2024-03-18 芝浦メカトロニクス株式会社 電子部品の実装装置
JP7450429B2 (ja) * 2020-03-26 2024-03-15 芝浦メカトロニクス株式会社 電子部品の実装装置
KR102590191B1 (ko) * 2020-06-30 2023-10-16 시바우라 메카트로닉스 가부시끼가이샤 실장 장치 및 실장 방법
CN115836383A (zh) 2020-07-13 2023-03-21 东丽工程株式会社 安装装置及安装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774191A (ja) * 1993-08-31 1995-03-17 Nichiden Mach Ltd マウンタ
CN1489433A (zh) * 2002-08-30 2004-04-14 ������������ʽ���� 元件安装方法及其元件安装装置
CN1746667A (zh) * 2004-09-06 2006-03-15 欧姆龙株式会社 基板检查方法及基板检查装置
JP2007012802A (ja) * 2005-06-29 2007-01-18 Toray Eng Co Ltd 実装方法および実装装置
JP2016092350A (ja) * 2014-11-11 2016-05-23 ボンドテック株式会社 電子部品装着装置および電子部品装着方法
CN107371360A (zh) * 2016-05-11 2017-11-21 松下知识产权经营株式会社 部件安装装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4761672B2 (ja) 2001-09-05 2011-08-31 株式会社東芝 ボンディング方法及びボンディング装置
JP4065805B2 (ja) * 2003-04-10 2008-03-26 富士機械製造株式会社 撮像装置
KR101245995B1 (ko) 2005-05-31 2013-03-20 토레 엔지니어링 가부시키가이샤 본딩장치
JP5008952B2 (ja) 2006-11-15 2012-08-22 キヤノンマシナリー株式会社 ダイボンダおよびダイボンディング方法
JP2010283010A (ja) * 2009-06-02 2010-12-16 Adwelds:Kk アライメント装置、この装置を備えた実装装置およびアライメント方法
JP6681241B2 (ja) * 2016-03-30 2020-04-15 アスリートＦａ株式会社 電子部品実装装置および電子部品製造方法
JP6390925B2 (ja) * 2016-05-11 2018-09-19 パナソニックＩｐマネジメント株式会社 部品実装装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774191A (ja) * 1993-08-31 1995-03-17 Nichiden Mach Ltd マウンタ
CN1489433A (zh) * 2002-08-30 2004-04-14 ������������ʽ���� 元件安装方法及其元件安装装置
CN1746667A (zh) * 2004-09-06 2006-03-15 欧姆龙株式会社 基板检查方法及基板检查装置
JP2007012802A (ja) * 2005-06-29 2007-01-18 Toray Eng Co Ltd 実装方法および実装装置
JP2016092350A (ja) * 2014-11-11 2016-05-23 ボンドテック株式会社 電子部品装着装置および電子部品装着方法
CN107371360A (zh) * 2016-05-11 2017-11-21 松下知识产权经营株式会社 部件安装装置

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Publication number Publication date
KR20190068467A (ko) 2019-06-18
CN109906029A (zh) 2019-06-18
JP2019102771A (ja) 2019-06-24
KR102132094B1 (ko) 2020-07-08

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