KR102132094B1 - 전자 부품 실장 장치 및 전자 부품 실장 방법 - Google Patents
전자 부품 실장 장치 및 전자 부품 실장 방법 Download PDFInfo
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- KR102132094B1 KR102132094B1 KR1020180156920A KR20180156920A KR102132094B1 KR 102132094 B1 KR102132094 B1 KR 102132094B1 KR 1020180156920 A KR1020180156920 A KR 1020180156920A KR 20180156920 A KR20180156920 A KR 20180156920A KR 102132094 B1 KR102132094 B1 KR 102132094B1
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- chip component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-235988 | 2017-12-08 | ||
JP2017235988A JP2019102771A (ja) | 2017-12-08 | 2017-12-08 | 電子部品実装装置及び電子部品実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190068467A KR20190068467A (ko) | 2019-06-18 |
KR102132094B1 true KR102132094B1 (ko) | 2020-07-08 |
Family
ID=66943307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180156920A KR102132094B1 (ko) | 2017-12-08 | 2018-12-07 | 전자 부품 실장 장치 및 전자 부품 실장 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2019102771A (ja) |
KR (1) | KR102132094B1 (ja) |
CN (1) | CN109906029B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110854045A (zh) * | 2019-11-20 | 2020-02-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 利用准直光路调整芯片吸盘与基板吸盘平行度的方法 |
JP7436251B2 (ja) * | 2020-03-16 | 2024-02-21 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP7451259B2 (ja) * | 2020-03-26 | 2024-03-18 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
JP7450429B2 (ja) * | 2020-03-26 | 2024-03-15 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
KR102590191B1 (ko) * | 2020-06-30 | 2023-10-16 | 시바우라 메카트로닉스 가부시끼가이샤 | 실장 장치 및 실장 방법 |
CN115836383A (zh) | 2020-07-13 | 2023-03-21 | 东丽工程株式会社 | 安装装置及安装方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077955A (ja) | 2001-09-05 | 2003-03-14 | Toshiba Corp | ボンディング方法及びボンディング装置 |
KR100540934B1 (ko) * | 2002-08-30 | 2006-01-11 | 가부시키가이샤 무라타 세이사쿠쇼 | 부품 장착 방법 및 부품 장착 장치 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3209623B2 (ja) * | 1993-08-31 | 2001-09-17 | エヌイーシーマシナリー株式会社 | マウンタ |
JP4065805B2 (ja) * | 2003-04-10 | 2008-03-26 | 富士機械製造株式会社 | 撮像装置 |
CN100533132C (zh) * | 2004-09-06 | 2009-08-26 | 欧姆龙株式会社 | 基板检查方法及基板检查装置 |
KR101245995B1 (ko) | 2005-05-31 | 2013-03-20 | 토레 엔지니어링 가부시키가이샤 | 본딩장치 |
JP4642565B2 (ja) * | 2005-06-29 | 2011-03-02 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
JP5008952B2 (ja) | 2006-11-15 | 2012-08-22 | キヤノンマシナリー株式会社 | ダイボンダおよびダイボンディング方法 |
JP2010283010A (ja) * | 2009-06-02 | 2010-12-16 | Adwelds:Kk | アライメント装置、この装置を備えた実装装置およびアライメント方法 |
JP6388338B2 (ja) * | 2014-11-11 | 2018-09-12 | ボンドテック株式会社 | 電子部品装着装置および電子部品装着方法 |
JP6681241B2 (ja) * | 2016-03-30 | 2020-04-15 | アスリートFa株式会社 | 電子部品実装装置および電子部品製造方法 |
CN107371360B (zh) * | 2016-05-11 | 2019-07-05 | 松下知识产权经营株式会社 | 部件安装装置 |
JP6390925B2 (ja) * | 2016-05-11 | 2018-09-19 | パナソニックIpマネジメント株式会社 | 部品実装装置 |
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2017
- 2017-12-08 JP JP2017235988A patent/JP2019102771A/ja active Pending
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2018
- 2018-11-14 CN CN201811354138.6A patent/CN109906029B/zh active Active
- 2018-12-07 KR KR1020180156920A patent/KR102132094B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077955A (ja) | 2001-09-05 | 2003-03-14 | Toshiba Corp | ボンディング方法及びボンディング装置 |
KR100540934B1 (ko) * | 2002-08-30 | 2006-01-11 | 가부시키가이샤 무라타 세이사쿠쇼 | 부품 장착 방법 및 부품 장착 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20190068467A (ko) | 2019-06-18 |
CN109906029A (zh) | 2019-06-18 |
CN109906029B (zh) | 2021-01-01 |
JP2019102771A (ja) | 2019-06-24 |
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