CN109790617A - 溅镀靶材 - Google Patents

溅镀靶材 Download PDF

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Publication number
CN109790617A
CN109790617A CN201780060621.0A CN201780060621A CN109790617A CN 109790617 A CN109790617 A CN 109790617A CN 201780060621 A CN201780060621 A CN 201780060621A CN 109790617 A CN109790617 A CN 109790617A
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CN
China
Prior art keywords
equal
niobium
average
sputtering target
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780060621.0A
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English (en)
Chinese (zh)
Inventor
迈克尔·艾登贝格-肖伯
乔格·温克勒
迈克尔·欧苏利文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plansee SE
Original Assignee
Plansee SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee SE filed Critical Plansee SE
Publication of CN109790617A publication Critical patent/CN109790617A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
    • B22F2003/185—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers by hot rolling, below sintering temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/248—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00—Treatment under specific atmosphere
    • B22F2201/01—Reducing atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/20—Refractory metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
CN201780060621.0A 2016-09-29 2017-09-08 溅镀靶材 Pending CN109790617A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM229/2016 2016-09-29
ATGM229/2016U AT15356U1 (de) 2016-09-29 2016-09-29 Sputtering Target
PCT/AT2017/000062 WO2018058158A1 (de) 2016-09-29 2017-09-08 Sputtering target

Publications (1)

Publication Number Publication Date
CN109790617A true CN109790617A (zh) 2019-05-21

Family

ID=59296190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780060621.0A Pending CN109790617A (zh) 2016-09-29 2017-09-08 溅镀靶材

Country Status (6)

Country Link
US (1) US11569075B2 (enExample)
JP (1) JP7108606B2 (enExample)
CN (1) CN109790617A (enExample)
AT (1) AT15356U1 (enExample)
TW (1) TWI791461B (enExample)
WO (1) WO2018058158A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT402178B (de) 1994-02-25 1997-02-25 Semperit Ag Laufstreifen für einen fahrzeugluftreifen
JP7110749B2 (ja) * 2017-07-05 2022-08-02 日立金属株式会社 ＭｏＮｂターゲット材
CN114990499B (zh) 2021-07-19 2023-06-20 江苏钢研昊普科技有限公司 一种钼合金靶材的制备方法
CN114150279A (zh) * 2021-12-09 2022-03-08 株洲硬质合金集团有限公司 一种钼铌合金轧制靶材的热处理方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1660526A (zh) * 2004-02-27 2005-08-31 日立金属株式会社 制备Mo合金制靶材料的方法
CN101008076A (zh) * 2006-01-23 2007-08-01 W.C.贺利氏有限公司 具有高熔相的溅射靶
CN101283113A (zh) * 2005-10-19 2008-10-08 W.C.贺利氏有限公司 多组分合金溅射靶及其制备方法
JP2008280570A (ja) * 2007-05-09 2008-11-20 Hitachi Metals Ltd ＭｏＮｂ系焼結スパッタリングターゲット材の製造方法
US20120003486A1 (en) * 2010-06-30 2012-01-05 H.C. Starck, Inc. Molybdenum containing targets
CN105683407A (zh) * 2013-10-29 2016-06-15 攀时奥地利公司 溅镀靶及其制造方法
CN105714253A (zh) * 2016-03-10 2016-06-29 洛阳爱科麦钨钼科技股份有限公司 大尺寸、细晶钼钽合金溅射靶材的制备方法

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JPS63241164A (ja) 1987-03-30 1988-10-06 Toshiba Corp スパッタリングターゲットおよび電気配線用合金膜
JP4432015B2 (ja) 2001-04-26 2010-03-17 日立金属株式会社 薄膜配線形成用スパッタリングターゲット
US7255757B2 (en) * 2003-12-22 2007-08-14 General Electric Company Nano particle-reinforced Mo alloys for x-ray targets and method to make
JP4356071B2 (ja) 2004-03-31 2009-11-04 日立金属株式会社 スパッタリングターゲット材およびその製造方法
JP4721090B2 (ja) 2004-04-16 2011-07-13 日立金属株式会社 Ｍｏ系ターゲット材の製造方法
US20050230244A1 (en) 2004-03-31 2005-10-20 Hitachi Metals, Ltd Sputter target material and method of producing the same
DE102005003445B4 (de) 2005-01-21 2009-06-04 H.C. Starck Hermsdorf Gmbh Metallsubstrat-Werkstoff für die Anodenteller von Drehanodenröntgenröhren, Verfahren zur Herstellung eines solchen Werkstoffes sowie Verfahren zur Herstellung eines Anodentellers unter Verwendung eines solchen Werkstoffes
JP2013083000A (ja) * 2011-09-28 2013-05-09 Hitachi Metals Ltd 焼結Ｍｏ合金スパッタリングターゲット材の製造方法
CN102337418B (zh) 2011-10-29 2013-05-22 西安瑞福莱钨钼有限公司 一种溅射靶材用钼铌合金板的制备方法
CN102560383B (zh) * 2012-01-12 2013-10-23 宝鸡市科迪普有色金属加工有限公司 钼铌合金板靶材加工工艺
CN103302295B (zh) 2013-06-20 2015-09-02 安泰科技股份有限公司 一种轧制加工高纯度、高致密度钼合金靶材的方法
CN103320756B (zh) 2013-06-20 2016-03-02 安泰科技股份有限公司 高纯度、高致密度、大尺寸钼合金靶材的制备方法
US9238852B2 (en) 2013-09-13 2016-01-19 Ametek, Inc. Process for making molybdenum or molybdenum-containing strip
CN104439247B (zh) 2014-12-30 2017-08-29 山东昊轩电子陶瓷材料有限公司 钼合金靶材的制备方法
CN104480437A (zh) 2014-12-30 2015-04-01 山东昊轩电子陶瓷材料有限公司 一体成型管靶的生产方法
WO2016115026A2 (en) * 2015-01-12 2016-07-21 H.C. Starck Inc. SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, AND Ta, AND METHODS
CN105063558B (zh) 2015-08-17 2017-09-12 金堆城钼业股份有限公司 一种Mo‑Ta合金靶材的制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1660526A (zh) * 2004-02-27 2005-08-31 日立金属株式会社 制备Mo合金制靶材料的方法
CN101283113A (zh) * 2005-10-19 2008-10-08 W.C.贺利氏有限公司 多组分合金溅射靶及其制备方法
CN101008076A (zh) * 2006-01-23 2007-08-01 W.C.贺利氏有限公司 具有高熔相的溅射靶
JP2008280570A (ja) * 2007-05-09 2008-11-20 Hitachi Metals Ltd ＭｏＮｂ系焼結スパッタリングターゲット材の製造方法
US20120003486A1 (en) * 2010-06-30 2012-01-05 H.C. Starck, Inc. Molybdenum containing targets
CN105683407A (zh) * 2013-10-29 2016-06-15 攀时奥地利公司 溅镀靶及其制造方法
CN105714253A (zh) * 2016-03-10 2016-06-29 洛阳爱科麦钨钼科技股份有限公司 大尺寸、细晶钼钽合金溅射靶材的制备方法

Also Published As

Publication number Publication date
WO2018058158A1 (de) 2018-04-05
TWI791461B (zh) 2023-02-11
JP2019536897A (ja) 2019-12-19
US20190221408A1 (en) 2019-07-18
AT15356U1 (de) 2017-07-15
JP7108606B2 (ja) 2022-07-28
US11569075B2 (en) 2023-01-31
TW201816159A (zh) 2018-05-01

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Application publication date: 20190521

RJ01 Rejection of invention patent application after publication