AT15356U1 - Sputtering Target - Google Patents

Sputtering Target Download PDF

Info

Publication number
AT15356U1
AT15356U1 ATGM229/2016U AT2292016U AT15356U1 AT 15356 U1 AT15356 U1 AT 15356U1 AT 2292016 U AT2292016 U AT 2292016U AT 15356 U1 AT15356 U1 AT 15356U1
Authority
AT
Austria
Prior art keywords
sputtering target
equal
particles
niobium
tantalum
Prior art date
Application number
ATGM229/2016U
Other languages
German (de)
English (en)
Inventor
Eidenberger-Schober Michael
Winkler Jörg
O'sullivan Michael
Original Assignee
Plansee Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee Se filed Critical Plansee Se
Priority to ATGM229/2016U priority Critical patent/AT15356U1/de
Publication of AT15356U1 publication Critical patent/AT15356U1/de
Priority to TW106130167A priority patent/TWI791461B/zh
Priority to PCT/AT2017/000062 priority patent/WO2018058158A1/de
Priority to US16/337,118 priority patent/US11569075B2/en
Priority to CN201780060621.0A priority patent/CN109790617A/zh
Priority to JP2019516711A priority patent/JP7108606B2/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
    • B22F2003/185—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers by hot rolling, below sintering temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/248—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00—Treatment under specific atmosphere
    • B22F2201/01—Reducing atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/20—Refractory metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
ATGM229/2016U 2016-09-29 2016-09-29 Sputtering Target AT15356U1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ATGM229/2016U AT15356U1 (de) 2016-09-29 2016-09-29 Sputtering Target
TW106130167A TWI791461B (zh) 2016-09-29 2017-09-04 濺鍍靶材
PCT/AT2017/000062 WO2018058158A1 (de) 2016-09-29 2017-09-08 Sputtering target
US16/337,118 US11569075B2 (en) 2016-09-29 2017-09-08 Sputtering target
CN201780060621.0A CN109790617A (zh) 2016-09-29 2017-09-08 溅镀靶材
JP2019516711A JP7108606B2 (ja) 2016-09-29 2017-09-08 スパッタリングターゲット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATGM229/2016U AT15356U1 (de) 2016-09-29 2016-09-29 Sputtering Target

Publications (1)

Publication Number Publication Date
AT15356U1 true AT15356U1 (de) 2017-07-15

Family

ID=59296190

Family Applications (1)

Application Number Title Priority Date Filing Date
ATGM229/2016U AT15356U1 (de) 2016-09-29 2016-09-29 Sputtering Target

Country Status (6)

Country Link
US (1) US11569075B2 (enExample)
JP (1) JP7108606B2 (enExample)
CN (1) CN109790617A (enExample)
AT (1) AT15356U1 (enExample)
TW (1) TWI791461B (enExample)
WO (1) WO2018058158A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT402178B (de) 1994-02-25 1997-02-25 Semperit Ag Laufstreifen für einen fahrzeugluftreifen
JP7110749B2 (ja) * 2017-07-05 2022-08-02 日立金属株式会社 ＭｏＮｂターゲット材
CN114990499B (zh) * 2021-07-19 2023-06-20 江苏钢研昊普科技有限公司 一种钼合金靶材的制备方法
CN114150279A (zh) * 2021-12-09 2022-03-08 株洲硬质合金集团有限公司 一种钼铌合金轧制靶材的热处理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120003486A1 (en) * 2010-06-30 2012-01-05 H.C. Starck, Inc. Molybdenum containing targets
JP2013083000A (ja) * 2011-09-28 2013-05-09 Hitachi Metals Ltd 焼結Ｍｏ合金スパッタリングターゲット材の製造方法
AT13602U2 (de) * 2013-10-29 2014-04-15 Plansee Se Sputtering Target und Verfahren zur Herstellung
US20160203960A1 (en) * 2015-01-12 2016-07-14 H.C. Starck Inc. SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241164A (ja) 1987-03-30 1988-10-06 Toshiba Corp スパッタリングターゲットおよび電気配線用合金膜
JP4432015B2 (ja) 2001-04-26 2010-03-17 日立金属株式会社 薄膜配線形成用スパッタリングターゲット
US7255757B2 (en) * 2003-12-22 2007-08-14 General Electric Company Nano particle-reinforced Mo alloys for x-ray targets and method to make
JP4110533B2 (ja) 2004-02-27 2008-07-02 日立金属株式会社 Ｍｏ系ターゲット材の製造方法
JP4721090B2 (ja) 2004-04-16 2011-07-13 日立金属株式会社 Ｍｏ系ターゲット材の製造方法
JP4356071B2 (ja) 2004-03-31 2009-11-04 日立金属株式会社 スパッタリングターゲット材およびその製造方法
US20050230244A1 (en) 2004-03-31 2005-10-20 Hitachi Metals, Ltd Sputter target material and method of producing the same
DE102005003445B4 (de) 2005-01-21 2009-06-04 H.C. Starck Hermsdorf Gmbh Metallsubstrat-Werkstoff für die Anodenteller von Drehanodenröntgenröhren, Verfahren zur Herstellung eines solchen Werkstoffes sowie Verfahren zur Herstellung eines Anodentellers unter Verwendung eines solchen Werkstoffes
DE102005050424B4 (de) * 2005-10-19 2009-10-22 W.C. Heraeus Gmbh Sputtertarget aus mehrkomponentigen Legierungen
DE102006003279B4 (de) * 2006-01-23 2010-03-25 W.C. Heraeus Gmbh Sputtertarget mit hochschmelzender Phase
JP4894008B2 (ja) * 2007-05-09 2012-03-07 日立金属株式会社 ＭｏＮｂ系焼結スパッタリングターゲット材の製造方法
CN102337418B (zh) 2011-10-29 2013-05-22 西安瑞福莱钨钼有限公司 一种溅射靶材用钼铌合金板的制备方法
CN102560383B (zh) 2012-01-12 2013-10-23 宝鸡市科迪普有色金属加工有限公司 钼铌合金板靶材加工工艺
CN103302295B (zh) 2013-06-20 2015-09-02 安泰科技股份有限公司 一种轧制加工高纯度、高致密度钼合金靶材的方法
CN103320756B (zh) 2013-06-20 2016-03-02 安泰科技股份有限公司 高纯度、高致密度、大尺寸钼合金靶材的制备方法
US9238852B2 (en) 2013-09-13 2016-01-19 Ametek, Inc. Process for making molybdenum or molybdenum-containing strip
CN104480437A (zh) 2014-12-30 2015-04-01 山东昊轩电子陶瓷材料有限公司 一体成型管靶的生产方法
CN104439247B (zh) 2014-12-30 2017-08-29 山东昊轩电子陶瓷材料有限公司 钼合金靶材的制备方法
CN105063558B (zh) 2015-08-17 2017-09-12 金堆城钼业股份有限公司 一种Mo‑Ta合金靶材的制备方法
CN105714253B (zh) * 2016-03-10 2017-11-24 洛阳爱科麦钨钼科技股份有限公司 大尺寸、细晶钼钽合金溅射靶材的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120003486A1 (en) * 2010-06-30 2012-01-05 H.C. Starck, Inc. Molybdenum containing targets
JP2013083000A (ja) * 2011-09-28 2013-05-09 Hitachi Metals Ltd 焼結Ｍｏ合金スパッタリングターゲット材の製造方法
AT13602U2 (de) * 2013-10-29 2014-04-15 Plansee Se Sputtering Target und Verfahren zur Herstellung
US20160203960A1 (en) * 2015-01-12 2016-07-14 H.C. Starck Inc. SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS

Also Published As

Publication number Publication date
US11569075B2 (en) 2023-01-31
US20190221408A1 (en) 2019-07-18
CN109790617A (zh) 2019-05-21
JP7108606B2 (ja) 2022-07-28
TWI791461B (zh) 2023-02-11
JP2019536897A (ja) 2019-12-19
TW201816159A (zh) 2018-05-01
WO2018058158A1 (de) 2018-04-05

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