CN1096744C - 电子元件及其制作方法 - Google Patents
电子元件及其制作方法 Download PDFInfo
- Publication number
- CN1096744C CN1096744C CN95102061A CN95102061A CN1096744C CN 1096744 C CN1096744 C CN 1096744C CN 95102061 A CN95102061 A CN 95102061A CN 95102061 A CN95102061 A CN 95102061A CN 1096744 C CN1096744 C CN 1096744C
- Authority
- CN
- China
- Prior art keywords
- substrate
- resin molding
- material layer
- electronic component
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6040051 | 1994-03-10 | ||
JP040051/94 | 1994-03-10 | ||
JP6040051A JPH07249877A (ja) | 1994-03-10 | 1994-03-10 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1117666A CN1117666A (zh) | 1996-02-28 |
CN1096744C true CN1096744C (zh) | 2002-12-18 |
Family
ID=12570121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95102061A Expired - Lifetime CN1096744C (zh) | 1994-03-10 | 1995-03-06 | 电子元件及其制作方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH07249877A (ja) |
KR (1) | KR100294145B1 (ja) |
CN (1) | CN1096744C (ja) |
DE (1) | DE19507124A1 (ja) |
TW (1) | TW274162B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19548062A1 (de) * | 1995-12-21 | 1997-06-26 | Siemens Matsushita Components | Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung |
EP0800338B1 (de) * | 1996-04-04 | 2001-05-30 | Gunter Langer | Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen |
DE19613587C2 (de) * | 1996-04-04 | 2000-02-17 | Langer Guenter | Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen |
DE19818824B4 (de) * | 1998-04-27 | 2008-07-31 | Epcos Ag | Elektronisches Bauelement und Verfahren zu dessen Herstellung |
DE19820049C2 (de) * | 1998-05-05 | 2001-04-12 | Epcos Ag | Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente |
DE19854396C2 (de) * | 1998-11-25 | 2002-02-07 | Freudenberg Carl Kg | Sensormodul |
DE10049288B4 (de) * | 2000-10-04 | 2004-07-15 | Infineon Technologies Ag | Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren |
DE10125744A1 (de) * | 2001-05-21 | 2002-12-05 | Siemens Ag | Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung |
JP3770210B2 (ja) * | 2002-06-20 | 2006-04-26 | 株式会社村田製作所 | 圧電部品の製造方法 |
JP5086835B2 (ja) * | 2008-02-20 | 2012-11-28 | パナソニック株式会社 | 電動工具 |
-
1994
- 1994-03-10 JP JP6040051A patent/JPH07249877A/ja active Pending
-
1995
- 1995-02-09 TW TW084101091A patent/TW274162B/zh not_active IP Right Cessation
- 1995-03-01 DE DE19507124A patent/DE19507124A1/de not_active Ceased
- 1995-03-06 CN CN95102061A patent/CN1096744C/zh not_active Expired - Lifetime
- 1995-03-10 KR KR1019950004875A patent/KR100294145B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100294145B1 (ko) | 2001-09-17 |
CN1117666A (zh) | 1996-02-28 |
JPH07249877A (ja) | 1995-09-26 |
KR950035554A (ko) | 1995-12-30 |
TW274162B (ja) | 1996-04-11 |
DE19507124A1 (de) | 1995-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20150306 Granted publication date: 20021218 |