CN109664163A - 被加工物的磨削方法 - Google Patents

被加工物的磨削方法 Download PDF

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CN109664163A
CN109664163A CN201811171352.8A CN201811171352A CN109664163A CN 109664163 A CN109664163 A CN 109664163A CN 201811171352 A CN201811171352 A CN 201811171352A CN 109664163 A CN109664163 A CN 109664163A
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machined object
base station
grinding
bearing base
guard block
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CN109664163B (zh
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三原拓也
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Disco Corp
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    • B24—GRINDING; POLISHING
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    • B24—GRINDING; POLISHING
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    • B24—GRINDING; POLISHING
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Abstract

提供被加工物的磨削方法，抑制磨削中的被加工物的外周部发生剥离，并且容易将被加工物从支承基台剥离。被加工物的磨削方法包含如下步骤：第1正面保护步骤，利用被加工物用保护部件(1)将被加工物(W)的正面(Wa)覆盖；第2正面保护步骤，利用支承基台用保护部件(2)将支承基台(10)的正面(11)覆盖；被加工物单元形成步骤，使粘接剂(3)绕行到外周部侧面(Wc)并进行固定而形成被加工物单元(4)；磨削步骤；对被加工物(W)进行薄化；第1剥离步骤，将薄化后的被加工物(W)、被加工物用保护部件(1)、粘接剂(3)和支承基台用保护部件(2)按照一体地掀起的方式从支承基台(10)剥离；和第2剥离步骤，将被加工物用保护部件(1)、粘接剂(3)和支承基台用保护部件(2)一体地从被加工物(W)剥离。

Description

被加工物的磨削方法
技术领域
本发明涉及对被加工物进行磨削而薄化的被加工物的磨削方法。
背景技术
存在利用磨削磨具对半导体晶片或蓝宝石、SiC基板之类的光器件晶片等进行薄化的磨削技术，但由于光器件晶片是硬质的，所以很难磨削。也就是说，即使利用背面研磨用的粘合带来保护光器件晶片，也会因磨削加工的负荷所导致的光器件晶片的沉入而产生薄化磨削中的被加工物的破裂、缺损、碎裂等磨削不良。因此，存在如下的加工方法：利用蜡等硬化的粘接剂将被加工物固定于陶瓷或玻璃等的支承基台，即使施加磨削负荷，由于被较硬的支承基板固定，所以抑制了破损(例如，参照下述专利文献1)。
专利文献1：日本特开2013-187281号公报
然而，当薄化后的被加工物的厚度为100μm以下时，由于被加工物的翘曲更强烈地产生，所以磨削中的被加工物的外周部会从支承基台剥离，会产生被加工物的破裂、缺损、碎裂等磨削不良。并且，当使用了在磨削中被加工物的外周部不会发生剥离的程度的硬度并且粘合力较高的粘接剂的情况下，在将薄化磨削后的被加工物从支承基台剥离的剥离步骤中会产生被加工物的破裂等不良情况。
发明内容
因此，本发明的目的在于，提供如下的被加工物的磨削方法：能够抑制在磨削中产生被加工物的外周部剥离，并且在将薄化后的被加工物从支承基台剥离时，能够容易地将被加工物从支承基台剥离。
根据本发明，提供被加工物的磨削方法，利用磨削磨具对被加工物的背面进行磨削，该被加工物具有在由形成为格子状的多条分割预定线划分的各区域内形成有器件的正面，其中，该被加工物的磨削方法具有如下的步骤：第1正面保护步骤，利用被加工物用保护部件将该被加工物的该正面的形成有该器件的区域覆盖；第2正面保护步骤，利用支承基台用保护部件将支承基台的正面覆盖；被加工物单元形成步骤，利用粘接剂对覆盖了该被加工物的该正面的形成有该器件的区域的该被加工物用保护部件侧与覆盖了该支承基台的该正面的该支承基台保护部件侧进行粘贴，并将该被加工物向该支承基台按压，由此，使该粘接剂绕行到该被加工物的外周部侧面并将该外周部侧面固定，从而形成被加工物单元；磨削步骤，利用卡盘工作台的保持面对该被加工物单元的该支承基台进行保持，并利用借助与该保持面垂直的旋转轴而旋转的磨削磨具来磨削该被加工物的该背面，将该被加工物薄化至能够弯曲的厚度；第1剥离步骤，将实施了该磨削步骤之后的该被加工物、该被加工物用保护部件、该粘接剂以及该支承基台用保护部件按照一体地掀起的方式从该支承基台剥离；以及第2剥离步骤，在实施了该第1剥离步骤之后，将该被加工物用保护部件、该粘接剂以及该支承基台用保护部件一体地从该被加工物剥离，利用该粘接剂对该被加工物的该外周部侧面进行支承，抑制了因该被加工物的翘曲而导致该被加工物的外周部从该支承基台剥离。
优选上述被加工物用保护部件和上述支承基台用保护部件是粘合带。优选上述粘接剂是通过加热或紫外线照射的处理而硬化的液态树脂。
优选上述被加工物是蓝宝石晶片。并且，优选实施了上述磨削步骤之后的上述被加工物的厚度为100μm以下。
根据本发明的被加工物的磨削方法，在被加工物的磨削中，被加工物的外周部侧面被粘接剂牢固地固定，能够抑制被加工物的外周部从支承基台剥离，能够防止被加工物出现破裂、缺陷、碎裂等磨削不良。
并且，根据本发明，由于粘接剂仅将被加工物的外周部侧面固定，支承基台的正面和被加工物的正面不与粘接剂接触，所以能够在第1剥离步骤中容易地将支承基台用保护部件从支承基台剥离，能够在第2剥离步骤中容易地将被加工物用保护部件从被加工物的正面剥离。
在上述被加工物用保护部件和上述支承基台用保护部件由粘合带构成的情况下，能够容易地实施上述第1剥离步骤和上述第2剥离步骤。并且，在上述粘接剂由通过加热或紫外线照射的处理而硬化的液态树脂构成的情况下，在实施被加工物单元形成步骤时能够使粘接剂高效地绕行到被加工物的外周部侧面。
在上述被加工物是蓝宝石晶片的情况下，薄化后的外周部的翘曲容易变大，但根据本发明，由于被加工物的外周部侧面被粘接剂牢固地固定，所以即使是硬质材料的被加工物也能够进行良好的磨削。并且，在实施了上述磨削步骤之后的上述被加工物的厚度被设定为100μm以下的情况下，薄化后的外周部容易产生翘曲，但根据本发明，能够在抑制薄化后的外周部的翘曲的同时磨削至希望的厚度。
附图说明
图1是示出第1正面保护步骤的立体图。
图2是示出第2正面保护步骤的立体图。
图3的(a)是示出被加工物单元形成步骤的立体图，图3的(b)是示出被加工物单元的结构的立体图。
图4是示出被加工物单元的结构的剖视图。
图5是示出磨削步骤的剖视图。
图6是磨削后的已进行了薄化的状态下的被加工物单元的局部放大剖视图。
图7是示出第1剥离步骤的剖视图。
图8是示出第2剥离步骤的立体图。
标号说明
1：被加工物用保护部件；2：支承基台用保护部件；3：粘接剂；4：被加工物单元；10：支承基台；11：正面；20：卡盘工作台；21：保持面；30：磨削构件；31：旋转轴；32：安装座；33：磨削磨轮；34：磨削磨具。
具体实施方式
图1所示的被加工物W具有圆形板状的基板，并且具有在由形成为格子状的多条分割预定线S划分的各区域中分别形成有器件D的正面Wa。被加工物W的与正面Wa相反的一侧的背面Wb例如是实施基于磨削磨具的磨削加工的被加工面。本实施方式所示的被加工物W例如由蓝宝石晶片构成。磨削前的被加工物W的厚度没有特别地限定，但例如为700μm。以下，对磨削被加工物W的背面Wb的被加工物的磨削方法进行说明。
(1)第1正面保护步骤
如图1所示，利用被加工物用保护部件1将被加工物W的正面Wa的形成有器件D的区域覆盖。本实施方式所示的被加工物用保护部件1具有粘合性，并且具有与被加工物W的直径大致相同的大小。并且，被加工物用保护部件1例如是在由聚烯烃或聚氯乙烯等构成的基材上层叠糊层(粘合层)而得的粘合带。通过将被加工物用保护部件1粘贴在被加工物W的正面Wa上而将其正面Wa的整个面覆盖，从而保护各器件D。
(2)第2正面保护步骤
如图2所示，利用支承基台用保护部件2将支承基台10的正面11覆盖。支承基台10是在磨削加工中用于对被加工物W进行支承而加强的支承部件，例如，由玻璃或陶瓷构成。支承基台用保护部件2也没有特别地限定，由与被加工物用保护部件1同样的粘合带构成。通过将支承基台用保护部件2粘贴在支承基台10的正面11上而将其正面11的整个面覆盖，从而保护正面11。另外，支承基台10和支承基台用保护部件2具有比被加工物W的外径大的直径。
在本实施方式中，在实施了第1正面保护步骤之后实施第2正面保护步骤，但并不限于该情况，可以同时实施第1正面保护步骤和第2正面保护步骤，也可以在实施了第2正面保护步骤之后实施第1正面保护步骤。
(3)被加工物单元形成步骤
如图3所示，通过粘接剂3将被加工物W和支承基台10粘接固定。优选粘接剂3由通过加热或照射紫外线的处理而硬化的液态树脂构成。如图3的(a)所示，在图示的例子中，可以预先将硬化之前的粘接剂3涂布在粘贴于支承基台10的正面11的支承基台用保护部件2上。
并且，关于粘接剂3，为了防止在后述的被加工物W的磨削中被加工物W与支承基台10剥离，优选选定硬度更高、粘度更高的类型的树脂来使用。本实施方式所示的粘接剂3例如由株式会社TESK公司制造的产品【编号：B-1014B】构成。该粘接剂3是具有通过100℃以上的加热处理而硬化的热硬化性的环氧树脂。
如图3的(a)所示，使被加工物W的正面和背面反转，使覆盖了被加工物W的正面Wa的形成有器件D的区域的被加工物用保护部件1侧与覆盖了支承基台10的正面11的支承基台用保护部件2侧对置，然后，使被加工物W在与涂布于支承基台10的粘接剂3接近的方向上移动。接着，如图3的(b)所示，从被加工物W的被加工物用保护部件1侧向粘接剂3按压而利用粘接剂3将被加工物用保护部件1侧和支承基台用保护部件2侧粘贴在一起。
这里，通过将被加工物W向下方按压，使粘接剂3向径向外侧展开，如图4所示，使粘接剂3从被加工物用保护部件1的外周部1a与支承基台用保护部件2的外周侧之间向外侧溢出而绕行到被加工物W的外周部侧面Wc来进行包覆。由于硬化前的粘接剂3是液状的，所以能够通过按压被加工物W而使粘接剂3高效地绕行到外周部侧面Wc。在该状态下，例如，使用加热器等加热构件例如按照100℃以上的温度对粘接剂3进行加热处理，从而使粘接剂3硬化。通过使粘接剂3硬化，将被加工物W和支承基台10固定而形成被加工物单元4。被加工物单元4中，被加工物W的外周部侧面Wc被硬化的粘接剂3牢固地固定在支承基台10上，成为被加工物W的外周部C不容易从支承基台10剥离的状态。在粘接剂3由紫外线硬化树脂构成的情况下，例如，可以使用UV灯朝向粘接剂3实施基于紫外线照射的外部刺激处理，从而使粘接剂3硬化。
(4)磨削步骤
在实施了被加工物单元形成步骤之后，如图5所示，利用卡盘工作台20的保持面21对被加工物单元4进行保持，通过配设在卡盘工作台20的上方侧的磨削构件30对被加工物W的背面Wb进行磨削。磨削构件30具有：旋转轴31，其具有与保持面21垂直的竖直方向的轴心；磨削磨轮33，其借助安装座32而安装在旋转轴31的下端；以及磨削磨具34，其呈环状地固定在磨削磨轮33的下部。磨削构件30与未图示的升降构件连接，能够一边通过升降构件使磨削磨轮33旋转，一边使整个磨削构件30进行升降。
在对被加工物W进行磨削的情况下，利用卡盘工作台20的保持面21对被加工物单元4的支承基台10侧进行保持，使被加工物W的背面Wb朝上露出，使卡盘工作台20例如按照箭头R方向进行旋转。接着，磨削构件30使磨削磨轮33例如按照箭头R方向进行旋转，并且按照规定的磨削进给速度下降，一边利用旋转的磨削磨具34对被加工物W的背面Wb进行按压，一边进行磨削薄化直到达到图6所示的能够弯曲的厚度T。本实施方式所示的能够弯曲的厚度T是指能够在被加工物W的外周部C产生翘曲的厚度，并且是指规定的完工厚度。作为能够弯曲的厚度T，例如优选被设定为100μm以下，在本实施方式中，例如被设定为50μm。
在被加工物W的磨削中，当被加工物W的厚度被薄化至100μm以下时，被加工物W的外周部C容易向从支承基台10剥离的方向(上方向)弯曲而产生翘曲，但由于被加工物W的外周部侧面Wc被粘接剂3牢固地固定于支承基台10，所以能够抑制外周部C产生翘曲，能够抑制在磨削中外周部C从支承基台10剥离。并且，在通过磨削动作将被加工物W薄化至能够弯曲的厚度T的时间点，磨削步骤结束。
(5)第1剥离步骤
在实施了磨削步骤之后，如图7所示，将例如粘合力比支承基台用保护部件2高的剥离带粘贴在粘接于支承基台10并且从被加工物W的外周部侧面Wc向外侧突出的支承基台用保护部件2的外周缘部2a上从而将该支承基台用保护部件2的外周缘部2a提起，从而将被加工物W、被加工物用保护部件1、粘接剂3以及支承基台用保护部件2按照一体地掀起的方式从支承基台10剥离。由此，容易将支承基台用保护部件2从支承基台10的正面11剥去，能够将被加工物W的外周部C侧抬起。然后，将支承基台用保护部件2从支承基台10的正面11的整个面剥去，从而将被加工物W从支承基台10完全剥离。
(6)第2剥离步骤
在实施了第1剥离步骤之后，如图8所示，使被加工物W的正面和背面反转，使被加工物W的正面Wa朝上。第2剥离步骤的剥离动作可以通过与第1剥离步骤同样的动作来进行。即，将例如粘合力比被加工物用保护部件1高的剥离带粘贴在支承基台用保护部件2的外周缘部2a上从而将支承基台用保护部件2的外周缘部2a提起，由此将被加工物用保护部件1、粘接剂3以及支承基台用保护部件2按照一体地掀起的方式从被加工物W的正面Wa剥离。此时，由于在被加工物W的正面Wa上只粘贴有被加工物用保护部件1，所以能够容易地通过剥离带将被加工物用保护部件1从被加工物W的正面Wa剥去。然后，通过将被加工物用保护部件1从被加工物W的正面Wa的整个面剥去，能够使被加工物W的正面Wa的整个面露出。这样，能够得到加工精度良好的被加工物W。
如以上那样，本发明的被加工物的磨削方法具有如下的步骤：第1正面保护步骤，利用被加工物用保护部件1将被加工物W的正面Wa的形成有器件D的区域覆盖；第2正面保护步骤，利用支承基台用保护部件2将支承基台10的正面11覆盖；被加工物单元形成步骤，利用粘接剂3对覆盖了被加工物W的正面Wa的形成有器件D的区域的被加工物用保护部件1侧和覆盖了支承基台10的正面11的支承基台用保护部件2侧进行粘贴，并将被加工物W对支承基台10按压，由此，使粘接剂3绕行到被加工物W的外周部侧面Wc并将被加工物W的外周部侧面Wc固定，从而形成被加工物单元4；磨削步骤，将被加工物W薄化至能够弯曲的厚度T；第1剥离步骤，将薄化后的被加工物W、被加工物用保护部件1、粘接剂3以及支承基台用保护部件2按照一体地掀起的方式从支承基台10剥离；以及第2剥离步骤，将被加工物用保护部件1、粘接剂3以及支承基台用保护部件2一体地从被加工物W剥离，因此在被加工物W的磨削中，被加工物W的外周部侧面Wc被粘接剂3牢固地固定，能够抑制被加工物W的外周部C从支承基台10剥离，能够防止被加工物W出现破裂、缺损、碎裂等磨削不良。
并且，在本发明中，由于仅通过粘接剂3将被加工物W的外周部侧面Wc固定，支承基台10的正面11和被加工物W的正面Wa不与粘接剂3接触，所以能够在第1剥离步骤中容易地将支承基台用保护部件2从支承基台10剥离，能够在第2剥离步骤中容易地将被加工物用保护部件1从被加工物W的正面Wa剥离。

Claims (5)

1.一种被加工物的磨削方法，利用磨削磨具对被加工物的背面进行磨削，该被加工物具有在由形成为格子状的多条分割预定线划分的各区域内形成有器件的正面，其中，
该被加工物的磨削方法具有如下的步骤：
第1正面保护步骤，利用被加工物用保护部件将该被加工物的该正面的形成有该器件的区域覆盖；
第2正面保护步骤，利用支承基台用保护部件将支承基台的正面覆盖；
被加工物单元形成步骤，利用粘接剂对覆盖了该被加工物的该正面的形成有该器件的区域的该被加工物用保护部件侧与覆盖了该支承基台的该正面的该支承基台保护部件侧进行粘贴，并将该被加工物向该支承基台按压，由此，使该粘接剂绕行到该被加工物的外周部侧面并将该外周部侧面固定，从而形成被加工物单元；
磨削步骤，利用卡盘工作台的保持面对该被加工物单元的该支承基台进行保持，并利用借助与该保持面垂直的旋转轴而旋转的磨削磨具来磨削该被加工物的该背面，将该被加工物薄化至能够弯曲的厚度；
第1剥离步骤，将实施了该磨削步骤之后的该被加工物、该被加工物用保护部件、该粘接剂以及该支承基台用保护部件按照一体地掀起的方式从该支承基台剥离；以及
第2剥离步骤，在实施了该第1剥离步骤之后，将该被加工物用保护部件、该粘接剂以及该支承基台用保护部件一体地从该被加工物剥离，
利用该粘接剂对该被加工物的该外周部侧面进行支承，抑制了因该被加工物的翘曲而导致该被加工物的外周部从该支承基台剥离。
2.根据权利要求1所述的被加工物的磨削方法，其特征在于，
所述被加工物用保护部件和所述支承基台用保护部件是粘合带。
3.根据权利要求1所述的被加工物的磨削方法，其特征在于，
所述粘接剂是通过加热或紫外线照射的处理而硬化的液态树脂。
4.根据权利要求1所述的被加工物的磨削方法，其中，
所述被加工物是蓝宝石晶片。
5.根据权利要求4所述的被加工物的磨削方法，其中，
实施了所述磨削步骤之后的所述被加工物的厚度为100μm以下。
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