CN109585352A - 保持构件、保持构件的制造方法、检查装置及切断装置 - Google Patents

保持构件、保持构件的制造方法、检查装置及切断装置 Download PDF

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Publication number
CN109585352A
CN109585352A CN201810939377.1A CN201810939377A CN109585352A CN 109585352 A CN109585352 A CN 109585352A CN 201810939377 A CN201810939377 A CN 201810939377A CN 109585352 A CN109585352 A CN 109585352A
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CN
China
Prior art keywords
holding member
slot
reflecting layer
holding
clathrate
Prior art date
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Pending
Application number
CN201810939377.1A
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English (en)
Chinese (zh)
Inventor
原田昭如
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN109585352A publication Critical patent/CN109585352A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Dicing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201810939377.1A 2017-09-28 2018-08-17 保持构件、保持构件的制造方法、检查装置及切断装置 Pending CN109585352A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017188231A JP6886379B2 (ja) 2017-09-28 2017-09-28 保持部材、保持部材の製造方法、検査装置及び切断装置
JP2017-188231 2017-09-28

Publications (1)

Publication Number Publication Date
CN109585352A true CN109585352A (zh) 2019-04-05

Family

ID=65919678

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810939377.1A Pending CN109585352A (zh) 2017-09-28 2018-08-17 保持构件、保持构件的制造方法、检查装置及切断装置

Country Status (4)

Country Link
JP (1) JP6886379B2 (ja)
KR (1) KR20190037104A (ja)
CN (1) CN109585352A (ja)
TW (1) TWI683096B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111981976A (zh) * 2019-05-24 2020-11-24 东和株式会社 保持构件及制法、检查机构、切断装置、保持对象物制法
CN112284285A (zh) * 2019-07-25 2021-01-29 东和株式会社 检查系统、检查方法、切断装置以及树脂成形装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6968949B2 (ja) * 2019-05-24 2021-11-24 Ｔｏｗａ株式会社 保持部材の製造方法
JP6823111B2 (ja) * 2019-06-07 2021-01-27 大成ラミック株式会社 断層観察キット
JP2021019082A (ja) * 2019-07-19 2021-02-15 株式会社ジャパンディスプレイ 転写用基板

Citations (6)

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KR20090041236A (ko) * 2007-10-23 2009-04-28 한미반도체 주식회사 반도체 패키지 이송장치의 흡착패드
CN103403854A (zh) * 2011-02-25 2013-11-20 株式会社尼康 观测装置、检查装置、半导体装置的制造方法及基板支承构件
CN104952767A (zh) * 2014-03-27 2015-09-30 东和株式会社 检查用夹具、切断装置以及切断方法
CN105364972A (zh) * 2014-08-12 2016-03-02 东和株式会社 切割装置、吸附机构及使用其的吸附装置、切割系统
CN105405805A (zh) * 2014-09-04 2016-03-16 东和株式会社 切断装置、吸附机构及具备吸附机构的装置
CN106920762A (zh) * 2015-12-24 2017-07-04 捷进科技有限公司 半导体制造装置、半导体器件的制造方法及芯片贴装机

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JP3033350B2 (ja) * 1992-07-23 2000-04-17 松下電器産業株式会社 チップの観察装置
JPH06237094A (ja) * 1993-02-08 1994-08-23 Tdk Corp 吸着部品の照明方法及び装置
JP3321503B2 (ja) 1994-12-28 2002-09-03 太陽誘電株式会社 電子部品の外観検査装置
KR100331165B1 (ko) * 1999-08-05 2002-04-01 김도열 소자 일괄 제조용 지그 및 이를 이용한 소자 일괄 제조방법
JP4137471B2 (ja) * 2002-03-04 2008-08-20 東京エレクトロン株式会社 ダイシング方法、集積回路チップの検査方法及び基板保持装置
JP5627618B2 (ja) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
JP5918003B2 (ja) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 個片化装置用真空吸着シート及びそれを用いた固定治具の製造方法
US10317460B2 (en) * 2013-06-07 2019-06-11 Maxim Integrated Products, Inc. Precision alignment unit for semiconductor trays
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090041236A (ko) * 2007-10-23 2009-04-28 한미반도체 주식회사 반도체 패키지 이송장치의 흡착패드
CN103403854A (zh) * 2011-02-25 2013-11-20 株式会社尼康 观测装置、检查装置、半导体装置的制造方法及基板支承构件
CN104952767A (zh) * 2014-03-27 2015-09-30 东和株式会社 检查用夹具、切断装置以及切断方法
CN105364972A (zh) * 2014-08-12 2016-03-02 东和株式会社 切割装置、吸附机构及使用其的吸附装置、切割系统
CN105405805A (zh) * 2014-09-04 2016-03-16 东和株式会社 切断装置、吸附机构及具备吸附机构的装置
CN106920762A (zh) * 2015-12-24 2017-07-04 捷进科技有限公司 半导体制造装置、半导体器件的制造方法及芯片贴装机

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111981976A (zh) * 2019-05-24 2020-11-24 东和株式会社 保持构件及制法、检查机构、切断装置、保持对象物制法
CN112284285A (zh) * 2019-07-25 2021-01-29 东和株式会社 检查系统、检查方法、切断装置以及树脂成形装置

Also Published As

Publication number Publication date
JP2019066188A (ja) 2019-04-25
KR20190037104A (ko) 2019-04-05
TWI683096B (zh) 2020-01-21
JP6886379B2 (ja) 2021-06-16
TW201915462A (zh) 2019-04-16

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Application publication date: 20190405