CN109570391B - 一种绝缘栅双极晶体管加工装置和方法 - Google Patents
一种绝缘栅双极晶体管加工装置和方法 Download PDFInfo
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- CN109570391B CN109570391B CN201811414915.1A CN201811414915A CN109570391B CN 109570391 B CN109570391 B CN 109570391B CN 201811414915 A CN201811414915 A CN 201811414915A CN 109570391 B CN109570391 B CN 109570391B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Press Drives And Press Lines (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811414915.1A CN109570391B (zh) | 2018-11-26 | 2018-11-26 | 一种绝缘栅双极晶体管加工装置和方法 |
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CN201811414915.1A CN109570391B (zh) | 2018-11-26 | 2018-11-26 | 一种绝缘栅双极晶体管加工装置和方法 |
Publications (2)
Publication Number | Publication Date |
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CN109570391A CN109570391A (zh) | 2019-04-05 |
CN109570391B true CN109570391B (zh) | 2020-07-28 |
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CN201811414915.1A Active CN109570391B (zh) | 2018-11-26 | 2018-11-26 | 一种绝缘栅双极晶体管加工装置和方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112974664A (zh) * | 2021-03-04 | 2021-06-18 | 浙江柳晶整流器有限公司 | 一种可控硅剪脚压弯机 |
CN113130353B (zh) * | 2021-03-17 | 2024-02-13 | 杭州沃镭智能科技股份有限公司 | 新能源汽车igbt芯片自动塑形机构 |
CN113458281B (zh) * | 2021-07-06 | 2023-01-13 | 深圳市豪锐科技有限公司 | 一种半导体集成加工用成型机 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3102261A (en) * | 1958-01-27 | 1963-08-27 | Bendix Corp | Sonic altimeter |
US3915203A (en) * | 1970-11-23 | 1975-10-28 | Solo Products Corp | Plastic-jacketed article and method of making the same |
CN201289980Y (zh) * | 2008-09-24 | 2009-08-12 | 陈建强 | 高效三工位母线机 |
CN202585317U (zh) * | 2012-04-27 | 2012-12-05 | 温岭市华泽机械设备有限公司 | 一种节能灯弯脚机压脚定型装置 |
CN106826245B (zh) * | 2017-02-24 | 2019-01-11 | 徐州世锦机电科技有限公司 | 芯片引脚的全自动加工装备 |
CN206550258U (zh) * | 2017-03-09 | 2017-10-13 | 长兴华超电子科技有限公司 | 一种半导体三极管引脚折弯剪裁装置 |
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Effective date of registration: 20201229 Address after: Room 206 (CNx), xifuhe digital intelligent innovation community Exhibition Center building, 49 Wengang South Road, Yannan high tech Zone, Yancheng City, Jiangsu Province Patentee after: Yancheng Yannan high tech Zone xifuhe digital intelligent industry development Co.,Ltd. Address before: Room 502-2, building 5, No. 49, Wengang South Road, Yannan high tech Zone, Yancheng City, Jiangsu Province 224000 (CNx) Patentee before: YANCHENG YIDONG TECHNOLOGY SERVICE Co.,Ltd. Effective date of registration: 20201229 Address after: Room 502-2, building 5, No. 49, Wengang South Road, Yannan high tech Zone, Yancheng City, Jiangsu Province 224000 (CNx) Patentee after: YANCHENG YIDONG TECHNOLOGY SERVICE Co.,Ltd. Address before: 212003, No. 2, Mengxi Road, Zhenjiang, Jiangsu Patentee before: JIANGSU University OF SCIENCE AND TECHNOLOGY |
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Effective date of registration: 20221212 Address after: Room 201, Building 2 #, Big Data Industrial Park, Yannan High tech Zone, Yancheng City, Jiangsu Province, 224000 (CNK) Patentee after: Yancheng Tas Technology Co.,Ltd. Address before: Room 206 (CNx), xifuhe digital intelligent innovation community Exhibition Center building, 49 Wengang South Road, Yannan high tech Zone, Yancheng City, Jiangsu Province Patentee before: Yancheng Yannan high tech Zone xifuhe digital intelligent industry development Co.,Ltd. |
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