CN109524358B - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
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- CN109524358B CN109524358B CN201810051242.1A CN201810051242A CN109524358B CN 109524358 B CN109524358 B CN 109524358B CN 201810051242 A CN201810051242 A CN 201810051242A CN 109524358 B CN109524358 B CN 109524358B
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- modified layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-180403 | 2017-09-20 | ||
JP2017180403A JP6903532B2 (ja) | 2017-09-20 | 2017-09-20 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109524358A CN109524358A (zh) | 2019-03-26 |
CN109524358B true CN109524358B (zh) | 2022-10-28 |
Family
ID=65721013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810051242.1A Active CN109524358B (zh) | 2017-09-20 | 2018-01-18 | 半导体装置及其制造方法 |
Country Status (4)
Country | Link |
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US (1) | US10350711B2 (zh) |
JP (1) | JP6903532B2 (zh) |
CN (1) | CN109524358B (zh) |
TW (1) | TWI675412B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017167614A1 (de) | 2016-03-22 | 2017-10-05 | Siltectra Gmbh | Kombinierte laserbehandlung eines zu splittenden festkörpers |
EP3551373A1 (de) * | 2016-12-12 | 2019-10-16 | Siltectra GmbH | Verfahren zum dünnen von mit bauteilen versehenen festkörperschichten |
JP2024018453A (ja) | 2022-07-29 | 2024-02-08 | 株式会社デンソー | 半導体装置及びその製造方法 |
Citations (5)
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