CN109468077A - 半导体晶圆保护用粘合带 - Google Patents

半导体晶圆保护用粘合带 Download PDF

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Publication number
CN109468077A
CN109468077A CN201811045398.5A CN201811045398A CN109468077A CN 109468077 A CN109468077 A CN 109468077A CN 201811045398 A CN201811045398 A CN 201811045398A CN 109468077 A CN109468077 A CN 109468077A
Authority
CN
China
Prior art keywords
adhesive
adhesive tape
mentioned
adhesive phase
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811045398.5A
Other languages
English (en)
Chinese (zh)
Inventor
佐佐木贵俊
龟井胜利
秋山淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN109468077A publication Critical patent/CN109468077A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201811045398.5A 2017-09-07 2018-09-07 半导体晶圆保护用粘合带 Pending CN109468077A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017171814A JP6906402B2 (ja) 2017-09-07 2017-09-07 半導体ウエハ保護用粘着テープ
JP2017-171814 2017-09-07

Publications (1)

Publication Number Publication Date
CN109468077A true CN109468077A (zh) 2019-03-15

Family

ID=65663048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811045398.5A Pending CN109468077A (zh) 2017-09-07 2018-09-07 半导体晶圆保护用粘合带

Country Status (4)

Country Link
JP (1) JP6906402B2 (ja)
KR (1) KR102525373B1 (ja)
CN (1) CN109468077A (ja)
TW (1) TWI780212B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114829533A (zh) * 2019-12-18 2022-07-29 积水化学工业株式会社 粘接剂、胶带、电器产品、车载部件及固定方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421976B2 (ja) 2020-03-27 2024-01-25 三井化学株式会社 ペリクル、およびその製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1670942A (zh) * 2004-03-17 2005-09-21 日东电工株式会社 切割模片粘接膜
CN1690152A (zh) * 2004-04-22 2005-11-02 日东电工株式会社 粘合剂组合物和其制造方法及其用途
CN1927977A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN1927978A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN101186789A (zh) * 2006-09-01 2008-05-28 日东电工株式会社 切割用压敏粘着带或片和拾取被加工物的切断片的方法
CN101993667A (zh) * 2009-08-07 2011-03-30 日东电工株式会社 半导体晶圆保持保护用粘合片、半导体晶圆的背面磨削方法
CN107112228A (zh) * 2015-03-02 2017-08-29 古河电气工业株式会社 半导体晶片表面保护用胶带和半导体晶片的加工方法
CN109937245A (zh) * 2016-11-17 2019-06-25 琳得科株式会社 半导体加工用粘合片

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* Cited by examiner, † Cited by third party
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AU2003220925A1 (en) * 2003-03-28 2004-10-25 Denki Kagaku Kogyo Kabushiki Kaisha Adhesive tape for electronic member
JP2005019759A (ja) * 2003-06-27 2005-01-20 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
JP4574234B2 (ja) * 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法
JP5049620B2 (ja) * 2007-03-20 2012-10-17 リンテック株式会社 粘着シート
US8368218B2 (en) * 2009-01-14 2013-02-05 Dow Corning Corporation Adhesive flexible barrier film, method of forming same, and organic electronic device including same
JP2010209158A (ja) * 2009-03-06 2010-09-24 Nitto Denko Corp 粘着シート及びそれを用いた半導体ウェハの加工方法
JP5544766B2 (ja) * 2009-06-15 2014-07-09 日立化成株式会社 半導体加工用接着フィルム積層体
WO2013172328A1 (ja) * 2012-05-14 2013-11-21 リンテック株式会社 接着性樹脂層付シートおよび半導体装置の製造方法
JP2014210880A (ja) * 2013-04-19 2014-11-13 日東電工株式会社 熱硬化性樹脂組成物及び半導体装置の製造方法
JP2015017159A (ja) 2013-07-09 2015-01-29 スリーエム イノベイティブ プロパティズ カンパニー 半導体ウェハ加工用粘着フィルム、薄層化された半導体ウェハの製造方法及び半導体チップの製造方法
JP2015185691A (ja) 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
JP6553331B2 (ja) * 2014-05-21 2019-07-31 日東電工株式会社 粘着シート
JP6623210B2 (ja) 2015-03-02 2019-12-18 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
KR20180077185A (ko) * 2015-10-29 2018-07-06 도레이 카부시키가이샤 가부착용 적층체 필름, 가부착용 적층체 필름을 사용한 기판 가공체 및 적층 기판 가공체의 제조 방법, 및 이것들을 사용한 반도체 장치의 제조 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1670942A (zh) * 2004-03-17 2005-09-21 日东电工株式会社 切割模片粘接膜
CN1690152A (zh) * 2004-04-22 2005-11-02 日东电工株式会社 粘合剂组合物和其制造方法及其用途
CN1927977A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN1927978A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN101186789A (zh) * 2006-09-01 2008-05-28 日东电工株式会社 切割用压敏粘着带或片和拾取被加工物的切断片的方法
CN101993667A (zh) * 2009-08-07 2011-03-30 日东电工株式会社 半导体晶圆保持保护用粘合片、半导体晶圆的背面磨削方法
CN107112228A (zh) * 2015-03-02 2017-08-29 古河电气工业株式会社 半导体晶片表面保护用胶带和半导体晶片的加工方法
CN109937245A (zh) * 2016-11-17 2019-06-25 琳得科株式会社 半导体加工用粘合片

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114829533A (zh) * 2019-12-18 2022-07-29 积水化学工业株式会社 粘接剂、胶带、电器产品、车载部件及固定方法

Also Published As

Publication number Publication date
KR20190027731A (ko) 2019-03-15
TWI780212B (zh) 2022-10-11
JP2019047075A (ja) 2019-03-22
JP6906402B2 (ja) 2021-07-21
KR102525373B1 (ko) 2023-04-26
TW201912746A (zh) 2019-04-01

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190315

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