CN109417063A - 引线框 - Google Patents
引线框 Download PDFInfo
- Publication number
- CN109417063A CN109417063A CN201780039299.3A CN201780039299A CN109417063A CN 109417063 A CN109417063 A CN 109417063A CN 201780039299 A CN201780039299 A CN 201780039299A CN 109417063 A CN109417063 A CN 109417063A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- connecting rod
- short side
- side direction
- connecting rods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002401 inhibitory effect Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 41
- 229910052751 metal Inorganic materials 0.000 description 41
- 238000005530 etching Methods 0.000 description 34
- 239000004065 semiconductor Substances 0.000 description 29
- 238000005520 cutting process Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-125110 | 2016-06-24 | ||
| JP2016125110A JP6727950B2 (ja) | 2016-06-24 | 2016-06-24 | リードフレーム |
| PCT/JP2017/017960 WO2017221581A1 (ja) | 2016-06-24 | 2017-05-11 | リードフレーム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109417063A true CN109417063A (zh) | 2019-03-01 |
Family
ID=60784617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780039299.3A Pending CN109417063A (zh) | 2016-06-24 | 2017-05-11 | 引线框 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6727950B2 (ja) |
| CN (1) | CN109417063A (ja) |
| TW (1) | TWI664705B (ja) |
| WO (1) | WO2017221581A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI679740B (zh) * | 2018-09-28 | 2019-12-11 | 大陸商光寶光電（常州）有限公司 | 搭載晶片用的導線架陣列及多晶片發光二極體封裝結構 |
| CN110970384A (zh) * | 2018-09-28 | 2020-04-07 | 光宝光电(常州)有限公司 | 搭载芯片用的导线架阵列及多芯片发光二极管封装结构 |
| JP7450575B2 (ja) | 2021-03-18 | 2024-03-15 | 株式会社東芝 | 半導体装置及びその製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260580A (ja) * | 1993-03-09 | 1994-09-16 | Hitachi Ltd | リードフレームおよび前記リードフレームを使用した半導体装置 |
| JP2000026981A (ja) * | 1998-07-10 | 2000-01-25 | Mitsui High Tec Inc | 多面付けエッチング製品の分離装置 |
| JP2002343817A (ja) * | 2001-05-11 | 2002-11-29 | Tomoegawa Paper Co Ltd | 半導体装置ユニット |
| US20040238923A1 (en) * | 2003-03-11 | 2004-12-02 | Siliconware Precision Industries Co., Ltd. | Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same |
| JP2006237289A (ja) * | 2005-02-25 | 2006-09-07 | Toppan Printing Co Ltd | リードフレーム構造体及びその製造方法 |
| CN101563777A (zh) * | 2006-12-18 | 2009-10-21 | 矽马电子股份有限公司 | 引线框、其制造方法及装载有该引线框的半导体装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275764A (ja) * | 1993-03-19 | 1994-09-30 | Fujitsu Miyagi Electron:Kk | リードフレーム及びそのリードフレームを用いた半導体装置の製造方法 |
| US6028350A (en) * | 1998-02-09 | 2000-02-22 | Advanced Micro Devices, Inc. | Lead frame with strip-shaped die bonding pad |
| JP2002057264A (ja) * | 2000-08-11 | 2002-02-22 | Nec Kansai Ltd | リードフレーム |
| JP2004071801A (ja) * | 2002-08-06 | 2004-03-04 | Shinko Electric Ind Co Ltd | リードフレーム及びその製造方法 |
| KR101257581B1 (ko) * | 2008-11-07 | 2013-04-23 | 도판 인사츠 가부시키가이샤 | 리드 프레임 및 그 제조 방법 및 그것을 이용한 반도체 발광 장치 |
| JP6143468B2 (ja) * | 2013-01-11 | 2017-06-07 | 株式会社三井ハイテック | リードフレーム |
| KR101486790B1 (ko) * | 2013-05-02 | 2015-01-28 | 앰코 테크놀로지 코리아 주식회사 | 강성보강부를 갖는 마이크로 리드프레임 |
| JP6107995B2 (ja) * | 2016-03-10 | 2017-04-05 | 大日本印刷株式会社 | リードフレームおよびリードフレームの製造方法 |
-
2016
- 2016-06-24 JP JP2016125110A patent/JP6727950B2/ja active Active
-
2017
- 2017-05-11 CN CN201780039299.3A patent/CN109417063A/zh active Pending
- 2017-05-11 WO PCT/JP2017/017960 patent/WO2017221581A1/ja active Application Filing
- 2017-06-21 TW TW106120704A patent/TWI664705B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260580A (ja) * | 1993-03-09 | 1994-09-16 | Hitachi Ltd | リードフレームおよび前記リードフレームを使用した半導体装置 |
| JP2000026981A (ja) * | 1998-07-10 | 2000-01-25 | Mitsui High Tec Inc | 多面付けエッチング製品の分離装置 |
| JP2002343817A (ja) * | 2001-05-11 | 2002-11-29 | Tomoegawa Paper Co Ltd | 半導体装置ユニット |
| US20040238923A1 (en) * | 2003-03-11 | 2004-12-02 | Siliconware Precision Industries Co., Ltd. | Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same |
| JP2006237289A (ja) * | 2005-02-25 | 2006-09-07 | Toppan Printing Co Ltd | リードフレーム構造体及びその製造方法 |
| CN101563777A (zh) * | 2006-12-18 | 2009-10-21 | 矽马电子股份有限公司 | 引线框、其制造方法及装载有该引线框的半导体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6727950B2 (ja) | 2020-07-22 |
| WO2017221581A1 (ja) | 2017-12-28 |
| JP2017228706A (ja) | 2017-12-28 |
| TW201810586A (zh) | 2018-03-16 |
| TWI664705B (zh) | 2019-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190301 |