CN109417063A - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN109417063A CN109417063A CN201780039299.3A CN201780039299A CN109417063A CN 109417063 A CN109417063 A CN 109417063A CN 201780039299 A CN201780039299 A CN 201780039299A CN 109417063 A CN109417063 A CN 109417063A
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- CN
- China
- Prior art keywords
- lead frame
- connecting rod
- short side
- side direction
- connecting rods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000002401 inhibitory effect Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 41
- 229910052751 metal Inorganic materials 0.000 description 41
- 238000005530 etching Methods 0.000 description 34
- 239000004065 semiconductor Substances 0.000 description 29
- 238000005520 cutting process Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
A kind of lead frame inhibiting flexure is provided.Lead frame is rectangle, including multiple unit lead frames, multiple 1st connecting rods, multiple 2nd connecting rods.Unit lead frame has chip bonding pad and multiple pins.The unit lead frame that 1st connecting rod will abut against is connected to each other, and the longitudinal direction along lead frame extends.The unit lead frame that 2nd connecting rod will abut against is connected to each other, and the short side direction along lead frame extends.Moreover, at least part of multiple 2nd connecting rods has high position rigidly than the 1st connecting rod.
Description
Technical field
Disclosed embodiment is related to a kind of lead frame.
Background technique
As slim semiconductor device, such as (Quad Flat Non-leaded package, square are flat by known QFN
Flat leadless packages) semiconductor device of type, SON (Small Outline Non-leaded package, small outline no-lead
Encapsulation) type semiconductor device etc..In addition, the slim semiconductor device for example will equipped with multiple semiconductor elements,
The lead frame of closing line uses resin seal together, and after being integrally formed multiple semiconductor devices, by being cut into each semiconductor
The cutting of device and manufacture.Moreover, in the cutting, it is known that right in advance in order to inhibit to generate flash in section due to connecting rod
The technology of connecting rod progress half-etching processing (referring for example to patent document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2001-320007 bulletin
Summary of the invention
The problem of present invention is to be solved
However, intensity can be with lead as previous lead frame in the case where carrying out half-etching processing to connecting rod
Frame it is big normalization etc. and decline, lead frame is possible to bend.Moreover, because the flexure, the semiconductor being mounted on lead frame
Element, closing line are possible to be broken or fall off.
One form of embodiment is to complete in view of the foregoing, and its purpose is to provide a kind of inhibition short side sides
To flexure lead frame.
The solution to the problem
Lead frame involved in one form of embodiment is rectangle, including multiple unit lead frames, multiple 1st companies
Bar, multiple 2nd connecting rods.The unit lead frame has chip bonding pad (die pad) and multiple pins.1st connecting rod will be adjacent
The unit lead frame connect is connected to each other, and the longitudinal direction along the lead frame extends.2nd connecting rod will abut against described
Unit lead frame is connected to each other, and the short side direction along the lead frame extends.Moreover, at least one of multiple 2nd connecting rods
Point with high position rigidly than the 1st connecting rod.
The effect of invention
According to embodiment form, it is capable of providing a kind of lead frame for inhibiting flexure.
Detailed description of the invention
Fig. 1 is the schematic diagram of lead frame involved in the 1st embodiment.
Fig. 2 is the enlarged plan view of lead frame involved in the 1st embodiment.
Fig. 3 A is cross-sectional view of the line A-A shown in Fig. 2 to view.
Fig. 3 B is cross-sectional view of the line B-B shown in Fig. 2 to view.
Fig. 3 C is cross-sectional view of the line C-C shown in Fig. 2 to view.
Fig. 4 A is a manufacturing process for showing the semiconductor device for having used lead frame involved in the 1st embodiment
Schematic cross sectional view.
Fig. 4 B is the next manufacture work for showing the semiconductor device for having used lead frame involved in the 1st embodiment
The schematic cross sectional view of sequence.
Fig. 4 C is the manufacture next for showing the semiconductor device for having used lead frame involved in the 1st embodiment
The schematic cross sectional view of process.
Fig. 5 A is cross-sectional view of the line D-D shown in Fig. 2 to view.
Fig. 5 B is comparable to the line D-D of Fig. 2 involved in the variation of the 1st embodiment to the cross-sectional view of view.
Fig. 5 C is comparable to the line D-D of Fig. 2 involved in other variations of the 1st embodiment to the cross-sectional view of view.
Fig. 6 is the enlarged plan view of lead frame involved in the 2nd embodiment.
Fig. 7 is the enlarged plan view of lead frame involved in the variation of the 2nd embodiment.
Fig. 8 is the schematic top view of lead frame involved in the 3rd embodiment.
Fig. 9 is the schematic top view of lead frame involved in the 4th embodiment.
Figure 10 is the schematic top view of lead frame involved in the variation of the 4th embodiment.
Figure 11 is the schematic top view of lead frame involved in other variations of the 4th embodiment.
Figure 12 is the schematic top view of lead frame involved in other further variations of the 4th embodiment.
Figure 13 is the schematic top view for the lead frame for combining the 3rd embodiment with the 4th embodiment.
Figure 14 is the schematic top view of lead frame involved in the 5th embodiment.
Figure 15 is the schematic top view of lead frame involved in the 6th embodiment.
The explanation of appended drawing reference
1,1A~1J: lead frame
2: semiconductor device
10: unit lead frame
10a: chip bonding pad
10b: pin
10c: support rod
11,11I, 11J: the 1st connecting rod
12,12A, 12B, 12I, 12J: the 2nd connecting rod
13: outline border
14: cross part
L: longitudinal direction
S: short side direction
Specific embodiment
In the following, illustrating the embodiment of lead frame disclosed in the present application referring to attached drawing.In addition, the present invention is not by following institute
Each embodiment shown limits.
The 1st embodiment > of <
Firstly, illustrating the summary of lead frame involved in the 1st embodiment referring to Fig.1.As shown in Figure 1, the 1st embodiment
It is rectangle that related lead frame 1, which is overlooked lower, including multiple unit lead frames 10, multiple 1st connecting rods 11, multiple 2nd connecting rods 12,
Outline border 13.Unit lead frame 10 is arranged in rectangular in lead frame 1.
1st connecting rod 11 will be connected to each other in the adjacent unit lead frame 10 of short side direction, along the longitudinal direction of lead frame 1
L extends.2nd connecting rod 12 will be connected to each other in the adjacent unit lead frame 10 of longitudinal direction, along the short side direction S of lead frame 1
Extend.The surrounding that outline border 13 is arranged to be arranged in rectangular unit lead frame 10 is surrounded.
Specifically, outline border 13 includes the 1st frame portion 13a of a pair extended in short side direction S；And prolong in longitudinal direction L
The 2nd frame portion 13b of a pair stretched, the 1st connecting rod 11 extend between the 1st frame portion 13a of a pair, and the 2nd connecting rod 12 is in a pair of 2nd frame portion
Extend between 13b.Moreover, having carried out half-etching processing to the 1st connecting rod 11 extended in longitudinal direction L in lead frame 1.
Lead frame is component thin, in longitudinal direction length.Therefore, lead frame is easy to bend in longitudinal direction.Previous
In lead frame, the carrier lead frame in such a way that lead frame will not be bent along the longitudinal direction for being easy flexure compared with short side direction
The both ends of short side direction, i.e. a pair of 2nd frame portion, to carry out various manufacturing processes.Therefore, the present inventors have noted that drawing
In the processing of wire frame, it is difficult to bend or be easy flexure in longitudinal direction all lead to the problem of in longitudinal direction.Instead, this hair
Bright people's discovery is in the processing of lead frame, in the situation for being easy flexure in short side direction.In particular, with the big rule of lead frame
It formats, if the mutual interval the 2nd frame portion 13b increases, is easy to bend in short side direction.
Therefore, in the lead frame 1 involved in the 1st embodiment, make in the rigid of short side direction S the 2nd connecting rod 12 extended
Property is higher than the rigidity of the 1st connecting rod 11.Specifically, processing to the 2nd connecting rod 12 without half-etching, connect the 2nd connecting rod 12 to the 1
At least part of bar 11 is thick.Thereby, it is possible to inhibit lead frame 1 along the flexure of short side direction S.
In addition, for easy understanding, the position that non-half-etching is processed is known as in the top view of present specification
" all-metal portion ", shown in the shade of diamond shape pattern.In addition, the position processed by half-etching is known as " half-etching portion ", with oblique
Shown in the shade that line is constituted.
In the following, illustrating the details of lead frame 1 involved in the 1st embodiment using Fig. 2 etc..Lead frame 1 is QFN type
Lead frame used in the manufacture of semiconductor device.Lead frame 1 is made of copper, copper alloy, iron-nickel alloy etc..Lead frame 1 is pair
Rectangular metal plate is implemented etching and processing etc. and is formed under vertical view.
As shown in Fig. 2, unit lead frame 10 is the position surrounded by the 1st connecting rod 11 and the 2nd connecting rod 12, there is chip bonding pad
(die pad) 10a, multiple pin 10b, support rod 10c.The lower chip bonding pad 10a setting for rectangle is overlooked in unit lead frame
10 center portion, face side being capable of semiconductor element mounted thereon 20 (referring to Fig. 4 A).
Four sides that multiple pin 10b face chip bonding pad 10a respectively separate space and are arranged, by the 1st connecting rod 11 or the 2nd
Connecting rod 12 supports.Moreover, pin 10b is electrically connected by closing line 21 is equal with the electrode of semiconductor element 20, thus as semiconductor
The external terminal of device 2 functions (referring to Fig. 4 A, Fig. 4 C).
Support rod 10c extends from each corner of chip bonding pad 10a outward respectively, connects with the 1st connecting rod 11 and the 2nd connecting rod 12
Meet simultaneously supports chip pad 10a.In this way, unit lead frame 10 and each semiconductor device 2 are corresponding (referring to Fig. 4 C).Moreover,
Around unit lead frame 10, the 1st connecting rod 11 and the 2nd connecting rod 12 are with grid-like configuration.
1st connecting rod 11 extends along the longitudinal direction L of lead frame 1, by the unit lead frame 10 adjacent along short side direction S
It is connected to each other.In addition, the 1st connecting rod 11 is connect at both ends with the 1st frame portion 13a (referring to Fig.1) of outline border 13.
2nd connecting rod 12 extends along the short side direction S of lead frame 1, by the unit lead frame 10 adjacent along longitudinal direction L
It is connected to each other.In addition, the 2nd connecting rod 12 is connect at both ends with the 2nd frame portion 13b (referring to Fig.1) of outline border 13.
In addition, as shown in Fig. 2, the 1st connecting rod 11 is formed, width W1 is impartial, and it is equal that the 2nd connecting rod 12 is formed width W2
Deng.Herein, such as width W1 is equal with width W2.Moreover, the 1st connecting rod 11 and the 2nd connecting rod 12 are orthogonal in cross part 14.So
And in the 1st embodiment, width W1 and W2 can also be unequal, and the 1st connecting rod 11 and the 2nd connecting rod 12 can also be with out of plumb.
Next, illustrating the cross sectional shape in each portion of lead frame 1 referring to Fig. 3 A~Fig. 3 C.In addition, in Fig. 3 A~Fig. 3 C
In, for easy understanding, the boundary line of each component parts is shown in dotted line.
As shown in Figure 3A, chip bonding pad 10a and pin 10b do not carry out half-etching processing in addition to a part, with etching
The plate thickness of metal plate before processing is identical thickness.Added moreover, forming back side in the end of chip bonding pad 10a by half-etching
The etched part 15a of work forms the etched part 15b that back side is processed by half-etching in the end of pin 10b.
Moreover, back side is processed by half-etching in the 1st connecting rod 11 extended along longitudinal direction L, it is formed with etched part
15c.That is, the 1st connecting rod 11 is thinner than the metal plate before etching and processing, rigidity is low.
On the other hand, as shown in Figure 3B, processed in the 2nd connecting rod 12 extended along short side direction S without half-etching, with
The plate thickness of metal plate before etching and processing is identical thickness.That is, 12 to the 1 connecting rod 11 of the 2nd connecting rod is thick, rigidity is high.As a result, by
It is bigger than the 1st connecting rod 11 in the sectional area of the 2nd connecting rod 12, it is thus possible to improve the intensity of the short side direction S of lead frame 1.So
Lead frame 1 is able to suppress to bend in short side direction S.
In addition, as shown in Figure 3 C, the cross part 14 that the 1st connecting rod 11 (referring to Fig. 2) and the 2nd connecting rod 12 cross one another not into
Row half-etching processing, the plate thickness with the metal plate before etching and processing is identical thickness.That is, the extend along short side direction S the 2nd
Connecting rod 12 includes cross part 14, and what is passed through is made of all-metal portion all over.Thereby, it is possible to inhibit lead frame 1
It is bent in short side direction S.
Also, in lead frame 1, the 2nd connecting rod 12 is identical as the major part of chip bonding pad 10a, is made of all-metal portion.
As a result, in the case where forming lead frame 1 by the metal plate with predetermined plate thickness, the thickness of the 2nd connecting rod 12 can be made to maximize.
Thus it is possible to make the maximum intensity of the short side direction S of lead frame 1.
Next, illustrating to manufacture semiconductor using lead frame 1 involved in the 1st embodiment referring to Fig. 4 A~Fig. 4 C
The method of device 2.In addition, Fig. 4 A~Fig. 4 C is the schematic cross sectional view for showing the section in lead frame 1 along short side direction S,
The boundary line of each component parts is shown in dotted line.
Firstly, as shown in Figure 4 A, the semiconductor element mounted thereon 20 on the chip bonding pad 10a of lead frame 1, by semiconductor element
Closing line 21 is utilized respectively between 20 each electrode and pin 10b corresponding to each electrode to be electrically connected.Next, such as Fig. 4 B institute
Show, is sealed the face side of lead frame 1 together with sealing resin 22.Next, along 12 (ginseng of the 1st connecting rod 11 and the 2nd connecting rod
According to Fig. 2) cutting line DL, will be cut between constituent parts lead frame 10 (referring to Fig. 2) using rotating knife.As a result, as shown in Figure 4 C,
It is divided into individual each semiconductor device 2.
Herein, as shown in Figure 4 B, in lead frame 1, due to being provided with recess portion in the 1st connecting rod 11 using etched part 15c,
The sectional area of metal part when can reduce along longitudinal direction L (referring to Fig. 2) cutting.Even if as a result, along longitudinal direction L
In the case where the speed cut than short side direction S (referring to Fig. 2) in the case where it is fast, be also able to suppress in cutting because of the 1st connecting rod
11 and section generate flash.So being able to suppress and cutting compared with the case where two connecting rods are made of all-metal portion all over
Cut required time increase.
Also, in lead frame 1, the sectional area of metal part when due to cutting is small, when being able to suppress cutting
The abrasion of rotating knife.Thus it is possible to extend the service life of rotating knife.
On the other hand, in lead frame 1, the 2nd connecting rod 12 is made of all-metal portion (referring to Fig. 2).So whole with two connecting rods
A the case where being all made of half-etching portion, is compared, and the flexure of the short side direction of lead frame 1 is able to suppress.
In addition, in semiconductor device 2, in respectively arranged etched parts 15a, 15b of chip bonding pad 10a and pin 10b institute, with
The mode of landfill sealing resin 22 carries out resin seal.Using the construction, in semiconductor device 2, chip bonding pad can be prevented
10a, pin 10b are detached from from the back side of sealing resin 22.
Next, illustrating the 2nd connecting rod 12 and its variation involved in the 1st embodiment referring to Fig. 5 A~Fig. 5 C.This
Outside, in Fig. 5 B and Fig. 5 C, for easy understanding, it is shown in broken lines part corresponding with the profile in section shown in Fig. 5 A.
It as shown in Figure 5A, is rectangle under 12 cross-section observation of the 2nd connecting rod, in other words by being made of all over all-metal portion.Benefit
It can be made with the construction in the case where making width W2 predetermined value from the metal plate formation lead frame 1 with predetermined plate thickness
The sectional area of 2nd connecting rod 12 maximizes.Thus it is possible to make the maximum intensity of the short side direction S of lead frame 1.
On the other hand, the composition of the 2nd connecting rod 12 is not limited to composition shown in Fig. 5 A.For example, the 2nd connecting rod as shown in Figure 5 B
It shown in 12A, can also be formed: the etched part 15d that the back side in side is processed by half-etching.In addition, the as shown in Figure 5 C the 2nd
It shown in connecting rod 12B, can also be formed: the etched part to be etched processing in a manner of shape that end broadens upward with side
15e.In addition, etched part 15d, 15e can be formed with above-mentioned etched part 15a~15c (referring to Fig. 3 A) same etching work procedure.
Moreover, section is inverted trapezoidal no matter in which variation, center portion is made of all-metal portion, can be utilized
The all-metal portion ensures the intensity of short side direction S (referring to Fig. 2).Also, no matter in which variation, since side is eclipsed
It carves, therefore, the sectional area of metal part when cutting along short side direction S can be reduced.So in the 2nd connecting rod 12A, 12B
In, the intensity of short side direction S can be taken into account and shortened along the time needed for short side direction S cutting.
The 2nd embodiment > of <
Next, illustrating lead frame 1A involved in the 2nd embodiment referring to Fig. 6.In addition, Fig. 6 is and the 1st embodiment party
The corresponding figure of Fig. 2 of formula.
Lead frame 1A involved in 2nd embodiment is lead frame used in the manufacture of the semiconductor device of SON type.Its
He is o'clock same as lead frame 1 involved in the 1st embodiment, marks identical appended drawing reference for common composition, omits detailed
Thin explanation.
In lead frame 1A, unit lead frame 10 has vertical view lower for the chip bonding pad 10a of rectangle, multiple pin 10b, branch
Hold bar 10c.Pin 10b faces to separate space setting along 2 sides of the chip bonding pad 10a of longitudinal direction L, only by the 1st connecting rod 11
Bearing.In addition, support rod 10c extends from each corner of chip bonding pad 10a respectively along longitudinal direction L, only connect with the 2nd connecting rod 12
It connects, carrys out supports chip pad 10a.
Moreover, in a same manner as in the first embodiment, being made of along the 1st connecting rod 11 that longitudinal direction L extends half-etching portion, edge
Short side direction S extend the 2nd connecting rod 12 include cross part 14 be made of all over all-metal portion.
Also, in lead frame 1A, it is not connected with having pin 10b in the 2nd connecting rod 12 being made of all-metal portion, is only connected with
Support rod 10c.As a result, in the cutting along short side direction S, though because the 2nd connecting rod 12 due to section generate flash, also due to
Adjacent support rod 10c has been electrically connected via chip bonding pad 10a each other, therefore, even if short circuit there will not be barrier due to flash
Hinder.
So due to that the speed of cutting can be made to accelerate under the degree other than not leading to the problem of flash and generating,
It can shorten along the time needed for short side direction S cutting.That is, the lead used in the manufacture of the semiconductor device of SON type
In frame 1A, the time needed for cutting can be greatly shortened.
Next, illustrating lead frame 1B involved in the variation of the 2nd embodiment referring to Fig. 7.In lead frame 1B, branch
It holds bar 10c to extend from chip bonding pad 10a to pin 10b, via pin 10b supports chip pad 10a.Herein, with support rod 10c
The pin 10b of connection becomes earthy terminal in semiconductor device 2 (referring to Fig. 4 C).
That is, in lead frame 1B, the component parts of unit lead frame 10 all with the 1st connecting rod 11 that extends along longitudinal direction L
Connection, does not connect with the 2nd connecting rod 12.As a result, since there is no the component sheet of the unit lead frame 10 supported by the 2nd connecting rod 12
Therefore body in the cutting along short side direction S, will not generate flash in section.So compared with lead frame 1A, it can
Further shorten the time cut along short side direction S.
The 3rd embodiment > of <
Next, illustrating lead frame 1C involved in the 3rd embodiment referring to Fig. 8.In addition, Fig. 8~Figure 13 is and the 1st
The corresponding figure of the following figure of Fig. 1 of embodiment, also can be suitable for the manufacture of QFN type, the various semiconductor devices of SON type.
In lead frame 1C, the 2nd connecting rod 12 of a part in multiple 2nd connecting rods 12 is from one end of short side direction S to another
One end is made of all-metal portion all over.In addition, remaining the 2nd connecting rod 12 from one end of short side direction S to the other end all over
It is made of half-etching portion.Moreover, the 2nd connecting rod 12 being made of all over all-metal portion that passes through, from one end to another
The 2nd connecting rod 12 that one end is made of half-etching portion all over alternately configures.
Herein, in lead frame 1C, a part being made of all over all-metal portion that passes through can be utilized
2nd connecting rod 12 ensures the intensity of short side direction S.Further, it is possible to utilize remaining the 2nd company being made of all over half-etching portion
Bar 12 extends service life of rotating knife.So the intensity of short side direction S and the length of rotating knife can be taken into account in lead frame 1C
Service life.
In addition, in fig. 8 it is shown that by the 2nd connecting rod 12 being made of all over all-metal portion, all over by half-etching portion
The example of each alternately 1 article of arrangement of the 2nd connecting rod 12 constituted, but not limited to this.For example, can will be made of all over all-metal portion
Position, the position that is made of all over half-etching portion respectively replace a plurality of arrangement (example: by 2 all-metal portions and 2 half-etching portions
It is alternately arranged).Furthermore it is possible to keep a position more than the item number at another position, and it is alternately arranged (example: by 3 all-metals
Portion and 2 half-etching portions are alternately arranged).
In addition, due to left from the 1st frame portion 13a (referring to Fig.1) and the center portion of the relatively low lead frame 1C of intensity
The position being made of all over all-metal portion can more be configured.Also, it can also be in the close and intensity phase with the 1st frame portion 13a
The position being made of all over half-etching portion is more configured to the peripheral part of high lead frame 1C.Also, by all-metal portion
It is not to pass through that be made of all over all-metal portion can also be in the 2nd connecting rod 12 constituted.
The 4th embodiment > of <
Next, illustrating lead frame 1D involved in the 4th embodiment referring to Fig. 9.
In lead frame 1D, the 2nd connecting rod 12 is in one end from short side direction S to the other end, being contaminated with by all-metal portion
The position of composition and the position being made of half-etching portion.For example, as shown in figure 9, between passing through, unit lead
The all-metal portion of 3 width extents of frame 10, the half-etching portion of 1 width extent of unit lead frame 10 are alternately arranged.In this way, passing through
A part of 2nd connecting rod 12 is provided with half-etching portion, so as to extend the service life of rotating knife.
In addition, being configured in lead frame 1D: with the 2nd all connecting rod 12 of whole observation, from short side
The all sites of one end of direction S to the other end are configured with all-metal portion.For example, as shown in figure 9, being configured as: adjacent the 2nd
Connecting rod 12 coincides with one another, and may be not present in short side direction S integrally without the position in all-metal portion.
It, can be from lead frame with the 2nd all connecting rod 12 of whole observation using the configuration in the all-metal portion
1D eliminates the thin position for being easy flexure.Thus it is possible to which lead frame 1D is inhibited to bend in short side direction S.That is, in lead frame 1D
In, the intensity of short side direction S and the long lifetime of rotating knife can be taken into account.
Next, referring to Fig.1 0 explanation the 4th embodiment variation involved in lead frame 1E.Lead frame 1E is each
In 2 connecting rods 12, all-metal portion is made to concentrate on inside and the configuration of scheduled region 16a.In addition, in lead frame 1E, under vertical view,
Tilt band-like region 16a from any one direction of longitudinal direction L and short side direction S, and multiple regions 16a is parallel
Configuration.
In addition, in region 16a shown in Fig. 10, it is adjacent in the all-metal portion of 2 width extents of unit lead frame 10 respectively
Between the lead frame 1E connect, all-metal portion is deviateed with 1 width extent of unit lead frame 10 in each short side direction S and is configured.However,
It is without being limited thereto in the width that the long side in the all-metal portion of configuration, short side direction S deviate.In addition, adjacent region 16a mutual
It is also arbitrary every, tilt angle of region 16a etc..
Next, referring to Fig.1 1 explanation the 4th embodiment other variations involved in lead frame 1F.Lead frame 1F is
In the 2nd connecting rod 12, make mutually to intersect from the band-like region 16b of the inclined a pair of any direction of longitudinal direction L and short side direction S
The example of fork.In addition, Figure 11 shows the example for intersecting a pair of of region 16b, but multipair region 16b can also be made to intersect.
Next, referring to Fig.1 2 explanation the 4th embodiments another other variation involved in lead frame 1G.Lead
Frame 1G is the example for being distributed the region 16c of diamond shape in lead frame 1G with identical apperance.Although in addition,
Figure 12 shows the example for being distributed the region 16c of diamond shape with identical apperance, but can be not necessarily with the distribution of identical apperance.Separately
Outside, the region 16c of the shape other than diamond shape can also be made to be distributed.For example, it is also possible to make the regions 16c such as triangle, rectangular shape
Distribution.In addition, the size of region 16c is arbitrary.
Next, 3 illustrating that combination has the lead frame 1H of the 3rd embodiment and the 4th embodiment referring to Fig.1.Lead frame 1H
In a same manner as in the third embodiment, the 2nd connecting rod 12 of a part in multiple 2nd connecting rods 12 is from one end of short side direction S to the other end
It is made of all over all-metal portion.Also, lead frame 1H is in a same manner as in the fourth embodiment, in remaining the 2nd connecting rod 12, has
All-metal portion is set to concentrate on internal region 16d.Figure 13, which shows configured in parallel, the case where multiple regions 16d, but region 16d
It constitutes without being limited thereto.
It this concludes the description of the embodiments of the present invention, but the present invention is not limited to the respective embodiments described above, without departing from
Its content, it will be able to make various changes.For example, in the respective embodiments described above, illustrating the semiconductor dress of QFN type, SON type
Lead frame used in the manufacture set, but can be used for the manufacture of other kinds of semiconductor device.
As described above, lead frame 1 (1A~1H) involved in embodiment is the lead frame of rectangle, comprising: be arranged in square
Multiple unit lead frames 10 of battle array shape；The unit lead frame 10 that will abut against is connected to each other, in the long side side of lead frame 1 (1A~1H)
Multiple 1st connecting rods 11 extended to L；And the unit lead frame 10 that will abut against is connected to each other, in the short of lead frame 1 (1A~1H)
Multiple 2nd connecting rods 12 (12A, 12B) that edge direction S extends.Moreover, at least part of multiple 2nd connecting rods 12 (12A, 12B) has
There is the position thicker than the 1st connecting rod 11.Thereby, it is possible to inhibit lead frame 1 (1A~1H) along the flexure of short side direction S.
In addition, the ratio the 1st of the 2nd connecting rod 12 (12A, 12B) connects in the lead frame 1 (1A~1H) involved in embodiment
The thick position of bar 11 and the most thick position of lead frame 1 (1A~1H) are identical thickness.Thereby, it is possible to make lead frame 1 (1A~
The maximum intensity of short side direction S 1H).
In addition, pin 10b is only by than the 2nd connecting rod 12 (12A, 12B) in the lead frame 1A (1B) involved in embodiment
Thin the 1st connecting rod 11 bearing.Thereby, it is possible to shorten along the time needed for longitudinal direction L cutting.
In addition, chip bonding pad 10a is using support rod 10c and only by than the 1st in the lead frame 1A involved in embodiment
Thick the 2nd connecting rod 12 bearing of connecting rod 11.Thereby, it is possible to shorten along the time needed for short side direction S cutting.
In addition, the 2nd section connecting rod 12A (12B) is inverted trapezoidal in the lead frame 1 (1A~1H) involved in embodiment,
Most thick part and the most thick position of lead frame 1 (1A~1H) are identical thickness.Thereby, it is possible to take into account short side direction S's
Intensity and the shortening that the required time is cut along short side direction S.
In addition, in the lead frame 1 (1A, 1B) involved in embodiment, the 1st connecting rod 11 and the 2nd connecting rod 12 (12A, 12B)
The identical thickness in position that the cross part 14 of intersection is and the 1st connecting rod 11 of ratio of the 2nd connecting rod 12 (12A, 12B) is thick.Thereby, it is possible to
Inhibit lead frame 1 (1A, 1B) along the flexure of short side direction S.
In addition, in the lead frame 1C involved in embodiment, a part of 2nd in multiple 2nd connecting rods 12 (12A, 12B)
Connecting rod 12 (12A, 12B) is thicker than the 1st connecting rod 11 all over from one end of short side direction S to the other end.In addition, remaining the 2nd company
Bar 12 (12A, 12B) is all over identical thickness with the 1st connecting rod 11 from one end of short side direction S to the other end.Thereby, it is possible to
Take into account the intensity of short side direction S and the long lifetime of rotating knife.
In addition, in the lead frame 1D (1E~1H) involved in embodiment, the 2nd connecting rod 12 (12A, 12B) is from short side
One end of direction S to the position that the position thicker than the 1st connecting rod 11 and 11 same thickness of the 1st connecting rod are contaminated between the other end,
In the case where with the 2nd all connecting rod 12 (12A, 12B) of whole observation, in all of one end from short side direction S to the other end
Position, configured with the position thicker than the 1st connecting rod 11.Thereby, it is possible to take into account the long-life of the intensity of short side direction S and rotating knife
Change.
In the 1st~the 4th above-mentioned embodiment, at least part of the 2nd connecting rod 12 has the portion thicker than the 1st connecting rod 11
Position, so that at least part of the 2nd connecting rod 12 is higher than the rigidity of the 1st connecting rod 11.But the method for keeping rigidity different is not limited to
This, is configured to the 5th embodiment and the 6th embodiment.
Figure 14 is the top view for showing the lead frame 1I of the 5th embodiment.In the lead frame 1I shown in Figure 14, the 1st connects
The thickness of bar 11I and the 2nd connecting rod 12I are equal.As shown in figure 14, at least part of multiple 2nd connecting rod 12I has connects than the 1st
The position of bar 11I wide.In the example in the figures, width WS wide of the width WL than the 1st connecting rod 11I of the 2nd all connecting rod 12I.
In addition, showing the lead frame 1I fewer than the number of actual unit lead frame for ease of explanation, in Figure 14.
The sectional area of 2nd connecting rod 12I is greater than the sectional area of the 1st connecting rod 11I, and the rigidity of the 2nd connecting rod 12I is greater than the 1st connecting rod
The rigidity of 11I.According to such composition, it is capable of providing a kind of lead frame 1I for being difficult to bend in short side direction.In addition it is also possible to
The narrow position that the 1st connecting rod 11I is arranged in is arranged in the region that half-etching portion is provided with shown in Fig. 8~Figure 13.
Figure 15 is the top view for showing the lead frame 1J of the 6th embodiment.In lead frame 1J shown in figure 15, the 2nd connects
The thickness and width of bar 12J is equal with the thickness and width of the 1st connecting rod 11J difference.As shown in figure 15, the number of the 2nd connecting rod 12J
The ratio between longitudinal direction size LJ relative to lead frame 1J A2, short side of the number relative to lead frame 1J greater than the 1st connecting rod 11J
The ratio between direction size SJ A1.In addition, being shown for ease of explanation, fewer than the number of actual unit lead frame in Figure 15
Lead frame 1I.
The sectional area of 2nd connecting rod 12J is equal with the sectional area of the 1st connecting rod 11J, and the 1st connecting rod 11J and the 2nd connecting rod 12J's is rigid
Property is equal.But the 1st connecting rod 11J due to the number [a/m] of the 2nd connecting rod 12J of per unit length than per unit length
Number [a/m] is more, and therefore, lead frame 1J is difficult to bend compared with longitudinal direction in short side direction.
In Figure 15, the longitudinal direction size LJ of lead frame 1J is two times of the short side direction size SJ of lead frame 1J.1st
Connecting rod 11J is 2, and the 2nd connecting rod 12J is 7.That is, longitudinal direction size of the number of the 2nd connecting rod 12J relative to lead frame 1J
The ratio between LJ A2 is 7/LJ=7/ (2SJ), the ratio between the short side direction size SJ of the number of the 1st connecting rod 11J relative to lead frame 1J A1
It is 2/SJ.That is, the short side direction of lead frame 1J is difficult to bend compared with longitudinal direction with 1.75 times (7/4 times).Therefore, lead frame
The treatability of 1J is high.
Those skilled in the art can be easy export further effect, variation.Therefore, wider array of form of the invention
The specific detail and representative embodiment for being not limited to the described above expression and recording.So not from appended claims
The concept spirit or scope of the invention for the summing-up that book and its equivalents define is detached from, and is able to carry out various changes.
Claims (11)
1. a kind of lead frame is the lead frame of rectangle, which is characterized in that
Include:
Multiple unit lead frames with chip bonding pad and multiple pins, and are arranged in rectangular；
Multiple 1st connecting rods, the unit lead frame that will abut against is connected to each other, extends in the longitudinal direction of the lead frame；
And
Multiple 2nd connecting rods, the unit lead frame that will abut against is connected to each other, extends in the short side direction of the lead frame,
At least part of multiple 2nd connecting rods has high position rigidly than the 1st connecting rod.
2. lead frame as described in claim 1, which is characterized in that
The pin is only by the 1st link supporting.
3. lead frame as claimed in claim 1 or 2, which is characterized in that
At least part of multiple 2nd connecting rods has the position thicker than the 1st connecting rod.
4. lead frame as claimed in claim 3, which is characterized in that
The thick position of 1st connecting rod described in the ratio of 2nd connecting rod and the most thick position of the lead frame are identical thickness.
5. lead frame as claimed in claim 4, which is characterized in that
The chip bonding pad is only by the 2nd link supporting.
6. the lead frame as described in any one of claim 3~5, which is characterized in that
The section of 2nd connecting rod is inverted trapezoidal, and the most thick position of most thick part and the lead frame is identical thickness.
7. the lead frame as described in any one of claim 3~6, which is characterized in that
The thick position of 1st connecting rod described in the ratio of cross part and the 2nd connecting rod that 1st connecting rod intersects with the 2nd connecting rod
It is identical thickness.
8. the lead frame as described in any one of claim 3~7, which is characterized in that
In multiple 2nd connecting rods a part of the 2nd connecting rod from one end of the short side direction to the other end all over
It is thicker than the 1st connecting rod,
Entire and 1st connecting rod of remaining described 2nd connecting rod from one end of the short side direction to the other end is identical
Thickness.
9. the lead frame as described in any one of claim 3~8, which is characterized in that
2nd connecting rod is in one end from the short side direction to being contaminated with the position thicker than the 1st connecting rod the other end
With the position with the 1st connecting rod same thickness,
Institute with all 2 connecting rods of whole observation, in one end from the short side direction to the other end
There is position to be equipped with the position thicker than the 1st connecting rod.
10. lead frame as claimed in claim 1 or 2, which is characterized in that
At least part of multiple 2nd connecting rods has the position wider than the 1st connecting rod.
11. a kind of lead frame is the lead frame of rectangle characterized by comprising
Multiple unit lead frames have chip bonding pad and multiple pins, and are arranged in rectangular；
Multiple 1st connecting rods, the unit lead frame that will abut against is connected to each other, extends in the longitudinal direction of the lead frame；With
And
Multiple 2nd connecting rods, the unit lead frame that will abut against is connected to each other, extends in the short side direction of the lead frame,
The thickness and width of 2nd connecting rod is equal with the thickness and width difference of the 1st connecting rod,
Longitudinal direction size the ratio between of the number of 2nd connecting rod relative to the lead frame, greater than the number of the 1st connecting rod
The ratio between short side direction size relative to the lead frame.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-125110 | 2016-06-24 | ||
| JP2016125110A JP6727950B2 (en) | 2016-06-24 | 2016-06-24 | Lead frame |
| PCT/JP2017/017960 WO2017221581A1 (en) | 2016-06-24 | 2017-05-11 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109417063A true CN109417063A (en) | 2019-03-01 |
Family
ID=60784617
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780039299.3A Pending CN109417063A (en) | 2016-06-24 | 2017-05-11 | Lead frame |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6727950B2 (en) |
| CN (1) | CN109417063A (en) |
| TW (1) | TWI664705B (en) |
| WO (1) | WO2017221581A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI679740B (en) * | 2018-09-28 | 2019-12-11 | 大陸商光寶光電（常州）有限公司 | Lead frame array for carrying chips and led package structure with multiple chips |
| JP7450575B2 (en) | 2021-03-18 | 2024-03-15 | 株式会社東芝 | Semiconductor device and its manufacturing method |
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| JPH06260580A (en) * | 1993-03-09 | 1994-09-16 | Hitachi Ltd | Lead frame and semiconductor device using the same |
| JP2000026981A (en) * | 1998-07-10 | 2000-01-25 | Mitsui High Tec Inc | Separator of multiple layout etching product |
| JP2002343817A (en) * | 2001-05-11 | 2002-11-29 | Tomoegawa Paper Co Ltd | Semiconductor device unit |
| US20040238923A1 (en) * | 2003-03-11 | 2004-12-02 | Siliconware Precision Industries Co., Ltd. | Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same |
| JP2006237289A (en) * | 2005-02-25 | 2006-09-07 | Toppan Printing Co Ltd | Lead frame structure and its manufacturing method |
| CN101563777A (en) * | 2006-12-18 | 2009-10-21 | 矽马电子股份有限公司 | Lead frame, method for manufacturing the lead frame, and semiconductor device having the lead frame mounted thereon |
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|---|---|---|---|---|
| JPH06275764A (en) * | 1993-03-19 | 1994-09-30 | Fujitsu Miyagi Electron:Kk | Lead frame and manufacture of semiconductor device using same |
| US6028350A (en) * | 1998-02-09 | 2000-02-22 | Advanced Micro Devices, Inc. | Lead frame with strip-shaped die bonding pad |
| JP2002057264A (en) * | 2000-08-11 | 2002-02-22 | Nec Kansai Ltd | Lead frame |
| JP2004071801A (en) * | 2002-08-06 | 2004-03-04 | Shinko Electric Ind Co Ltd | Lead frame and its fabricating method |
| CN102077371B (en) * | 2008-11-07 | 2012-10-31 | 凸版印刷株式会社 | Leadframe, method for manufacturing the leadframe, and semiconductor light emitting device using the leadframe |
| JP6143468B2 (en) * | 2013-01-11 | 2017-06-07 | 株式会社三井ハイテック | Lead frame |
| KR101486790B1 (en) * | 2013-05-02 | 2015-01-28 | 앰코 테크놀로지 코리아 주식회사 | Micro Lead Frame for semiconductor package |
| JP6107995B2 (en) * | 2016-03-10 | 2017-04-05 | 大日本印刷株式会社 | Leadframe and leadframe manufacturing method |
-
2016
- 2016-06-24 JP JP2016125110A patent/JP6727950B2/en active Active
-
2017
- 2017-05-11 WO PCT/JP2017/017960 patent/WO2017221581A1/en active Application Filing
- 2017-05-11 CN CN201780039299.3A patent/CN109417063A/en active Pending
- 2017-06-21 TW TW106120704A patent/TWI664705B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260580A (en) * | 1993-03-09 | 1994-09-16 | Hitachi Ltd | Lead frame and semiconductor device using the same |
| JP2000026981A (en) * | 1998-07-10 | 2000-01-25 | Mitsui High Tec Inc | Separator of multiple layout etching product |
| JP2002343817A (en) * | 2001-05-11 | 2002-11-29 | Tomoegawa Paper Co Ltd | Semiconductor device unit |
| US20040238923A1 (en) * | 2003-03-11 | 2004-12-02 | Siliconware Precision Industries Co., Ltd. | Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same |
| JP2006237289A (en) * | 2005-02-25 | 2006-09-07 | Toppan Printing Co Ltd | Lead frame structure and its manufacturing method |
| CN101563777A (en) * | 2006-12-18 | 2009-10-21 | 矽马电子股份有限公司 | Lead frame, method for manufacturing the lead frame, and semiconductor device having the lead frame mounted thereon |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI664705B (en) | 2019-07-01 |
| JP6727950B2 (en) | 2020-07-22 |
| TW201810586A (en) | 2018-03-16 |
| JP2017228706A (en) | 2017-12-28 |
| WO2017221581A1 (en) | 2017-12-28 |
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Application publication date: 20190301 |