CN109095434A - 传感器结构件及其制造方法 - Google Patents
传感器结构件及其制造方法 Download PDFInfo
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- CN109095434A CN109095434A CN201810746872.0A CN201810746872A CN109095434A CN 109095434 A CN109095434 A CN 109095434A CN 201810746872 A CN201810746872 A CN 201810746872A CN 109095434 A CN109095434 A CN 109095434A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109704268A (zh) * | 2019-02-21 | 2019-05-03 | 厦门大学 | 一种可拉伸电子干扰变形免疫基材 |
CN109704270A (zh) * | 2018-12-29 | 2019-05-03 | 武汉耐普登科技有限公司 | 五金件、微机电传感器封装结构及制造方法 |
CN110040683A (zh) * | 2019-04-12 | 2019-07-23 | 武汉耐普登科技有限公司 | 五金件、封装结构及其制造方法 |
CN111551775A (zh) * | 2020-06-16 | 2020-08-18 | 新纳传感系统有限公司 | 一种电流传感器的制造方法 |
CN112768561A (zh) * | 2021-01-11 | 2021-05-07 | 杭州士兰微电子股份有限公司 | 光传感器封装结构及制作方法 |
CN114193001A (zh) * | 2021-12-19 | 2022-03-18 | 强一半导体(上海)有限公司 | 一种3dmems探针硅片及其定位、切割装置和方法 |
CN115392181A (zh) * | 2022-10-28 | 2022-11-25 | 成都复锦功率半导体技术发展有限公司 | 基于外界边框设计的拼版设计方法、芯片及终端 |
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WO2007126179A1 (en) * | 2006-05-03 | 2007-11-08 | Bse Co., Ltd. | Silicon condenser microphone having additional back chamber |
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CN201700090U (zh) * | 2010-06-25 | 2011-01-05 | 上海晨兴希姆通电子科技有限公司 | 用于承载pcb拼板的托盘 |
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CN206821069U (zh) * | 2017-06-22 | 2017-12-29 | 广东美的制冷设备有限公司 | 拼接式印制电路板 |
CN107623992A (zh) * | 2017-09-22 | 2018-01-23 | 广州兴森快捷电路科技有限公司 | Pcb内层图形的优化方法及pcb、拼板结构和层压结构 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109704270A (zh) * | 2018-12-29 | 2019-05-03 | 武汉耐普登科技有限公司 | 五金件、微机电传感器封装结构及制造方法 |
CN109704268A (zh) * | 2019-02-21 | 2019-05-03 | 厦门大学 | 一种可拉伸电子干扰变形免疫基材 |
CN110040683A (zh) * | 2019-04-12 | 2019-07-23 | 武汉耐普登科技有限公司 | 五金件、封装结构及其制造方法 |
CN111551775A (zh) * | 2020-06-16 | 2020-08-18 | 新纳传感系统有限公司 | 一种电流传感器的制造方法 |
CN112768561A (zh) * | 2021-01-11 | 2021-05-07 | 杭州士兰微电子股份有限公司 | 光传感器封装结构及制作方法 |
CN114193001A (zh) * | 2021-12-19 | 2022-03-18 | 强一半导体(上海)有限公司 | 一种3dmems探针硅片及其定位、切割装置和方法 |
CN114193001B (zh) * | 2021-12-19 | 2024-02-06 | 强一半导体(上海)有限公司 | 一种3dmems探针硅片及其定位、切割装置和方法 |
CN115392181A (zh) * | 2022-10-28 | 2022-11-25 | 成都复锦功率半导体技术发展有限公司 | 基于外界边框设计的拼版设计方法、芯片及终端 |
CN115392181B (zh) * | 2022-10-28 | 2023-02-07 | 成都复锦功率半导体技术发展有限公司 | 基于外界边框设计的拼版设计方法、芯片及终端 |
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Address after: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Weigan Semiconductor Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weil Semiconductor Co.,Ltd. |
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Effective date of registration: 20221010 Address after: Room 501, 5th Floor, Building C, Cygnus Building, Wuxi Software Park, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Senxin Technology Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weigan Semiconductor Co.,Ltd. |
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