CN109060307B - 一种倒装led芯片检测装置 - Google Patents
一种倒装led芯片检测装置 Download PDFInfo
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- CN109060307B CN109060307B CN201811086308.7A CN201811086308A CN109060307B CN 109060307 B CN109060307 B CN 109060307B CN 201811086308 A CN201811086308 A CN 201811086308A CN 109060307 B CN109060307 B CN 109060307B
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- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
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CN201811086308.7A CN109060307B (zh) | 2018-09-18 | 2018-09-18 | 一种倒装led芯片检测装置 |
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Families Citing this family (2)
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CN111722143B (zh) * | 2020-06-24 | 2023-05-12 | 东莞市博发光电科技有限公司 | 一种灯泡合格检验装置 |
CN113188433B (zh) * | 2021-06-30 | 2021-09-28 | 江苏振宁半导体研究院有限公司 | 半导体材料器件直径测量装置 |
Citations (6)
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CN103149524A (zh) * | 2013-02-25 | 2013-06-12 | 东莞市福地电子材料有限公司 | 一种倒装led芯片测试机与测试方法 |
CN103878126A (zh) * | 2014-04-08 | 2014-06-25 | 苏州嘉大电子有限公司 | 一种led器件分选机 |
CN105080859A (zh) * | 2015-08-24 | 2015-11-25 | 佛山市国星半导体技术有限公司 | 倒装led芯片测试设备及其测试方法 |
CN106378314A (zh) * | 2016-08-28 | 2017-02-08 | 浙江春宝胶囊有限公司 | 一种全自动胶囊灯检输送装置 |
CN107505583A (zh) * | 2017-09-02 | 2017-12-22 | 深圳市良机自动化设备有限公司 | 倒装测试分选装置 |
CN108126924A (zh) * | 2017-12-21 | 2018-06-08 | 梁玉燕 | 一种自动清洁电子元件装置 |
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JP3400929B2 (ja) * | 1997-07-01 | 2003-04-28 | アルプス電気株式会社 | チップ部品装着装置 |
KR101258162B1 (ko) * | 2011-01-13 | 2013-04-25 | (주)에이피텍 | 엘이디 칩의 이송장치 및 방법 |
AT512859B1 (de) * | 2012-05-11 | 2018-06-15 | Hanmi Semiconductor Co Ltd | Halbleiterchip Wende- und Befestigungseinrichtung |
CN103116117B (zh) * | 2013-02-01 | 2015-05-13 | 东莞市万将机电设备有限公司 | 自动高电压测试机 |
JP2015106603A (ja) * | 2013-11-29 | 2015-06-08 | スタンレー電気株式会社 | 部品装着用光照射撮像装置 |
CN103736670B (zh) * | 2013-12-19 | 2016-01-13 | 深圳市海目星激光科技有限公司 | 一种振动分拣设备 |
CN103722376B (zh) * | 2014-01-07 | 2015-12-16 | 深圳雷柏科技股份有限公司 | 遥控器组装设备 |
TWI574022B (zh) * | 2016-01-21 | 2017-03-11 | 旺矽科技股份有限公司 | 晶粒檢測裝置及晶粒傳送方法 |
CN106895961B (zh) * | 2016-07-29 | 2019-07-23 | 深圳市德仓科技有限公司 | 一种背光模组的检测设备及其检测方法 |
CN108075027B (zh) * | 2017-12-12 | 2019-08-02 | 安徽三优光电科技有限公司 | 一种led封装的芯片角度校正装置 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103149524A (zh) * | 2013-02-25 | 2013-06-12 | 东莞市福地电子材料有限公司 | 一种倒装led芯片测试机与测试方法 |
CN103878126A (zh) * | 2014-04-08 | 2014-06-25 | 苏州嘉大电子有限公司 | 一种led器件分选机 |
CN105080859A (zh) * | 2015-08-24 | 2015-11-25 | 佛山市国星半导体技术有限公司 | 倒装led芯片测试设备及其测试方法 |
CN106378314A (zh) * | 2016-08-28 | 2017-02-08 | 浙江春宝胶囊有限公司 | 一种全自动胶囊灯检输送装置 |
CN107505583A (zh) * | 2017-09-02 | 2017-12-22 | 深圳市良机自动化设备有限公司 | 倒装测试分选装置 |
CN108126924A (zh) * | 2017-12-21 | 2018-06-08 | 梁玉燕 | 一种自动清洁电子元件装置 |
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