CN108779419B - 电子材料用清洗剂组合物、清洗剂原液和电子材料的清洗方法 - Google Patents

电子材料用清洗剂组合物、清洗剂原液和电子材料的清洗方法 Download PDF

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Publication number
CN108779419B
CN108779419B CN201680070975.9A CN201680070975A CN108779419B CN 108779419 B CN108779419 B CN 108779419B CN 201680070975 A CN201680070975 A CN 201680070975A CN 108779419 B CN108779419 B CN 108779419B
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China
Prior art keywords
cleaning agent
water
tertiary amine
cleaning
agent composition
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CN201680070975.9A
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Chinese (zh)
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CN108779419A (zh
Inventor
井内洋介
田中俊
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Arakawa Chemical Industries Ltd
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Arakawa Chemical Industries Ltd
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN201680070975.9A 2015-12-25 2016-12-21 电子材料用清洗剂组合物、清洗剂原液和电子材料的清洗方法 Active CN108779419B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015254252 2015-12-25
JP2015-254252 2015-12-25
PCT/JP2016/088131 WO2017110885A1 (ja) 2015-12-25 2016-12-21 電子材料用の洗浄剤組成物、洗浄剤原液、及び電子材料の洗浄方法

Publications (2)

Publication Number Publication Date
CN108779419A CN108779419A (zh) 2018-11-09
CN108779419B true CN108779419B (zh) 2021-04-20

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ID=59089545

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CN201680070975.9A Active CN108779419B (zh) 2015-12-25 2016-12-21 电子材料用清洗剂组合物、清洗剂原液和电子材料的清洗方法

Country Status (4)

Country Link
JP (1) JP6593441B2 (ko)
KR (1) KR102635269B1 (ko)
CN (1) CN108779419B (ko)
WO (1) WO2017110885A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102131910A (zh) * 2008-08-27 2011-07-20 荒川化学工业株式会社 无铅助焊剂除去用清洁剂组合物和无铅助焊剂除去用体系
CN102482625A (zh) * 2009-09-03 2012-05-30 荒川化学工业株式会社 水溶性无铅助焊剂除去用清洁剂、除去方法和清洁方法
CN102906240A (zh) * 2010-07-09 2013-01-30 化研科技株式会社 洗涤剂组合物用原液、洗涤剂组合物以及洗涤方法
CN104877811A (zh) * 2014-02-27 2015-09-02 荒川化学工业株式会社 清洗剂组合物原液、清洗剂组合物、清洗方法以及用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG177915A1 (en) * 2006-12-21 2012-02-28 Advanced Tech Materials Liquid cleaner for the removal of post-etch residues
CN101412950A (zh) * 2007-10-19 2009-04-22 安集微电子（上海）有限公司 一种等离子刻蚀残留物清洗液
JP2012186470A (ja) * 2011-02-18 2012-09-27 Sanyo Chem Ind Ltd 銅配線半導体用洗浄剤
CN102827707A (zh) * 2011-06-16 2012-12-19 安集微电子科技(上海)有限公司 一种等离子刻蚀残留物清洗液
CN102827708A (zh) * 2011-06-16 2012-12-19 安集微电子（上海）有限公司 一种等离子刻蚀残留物清洗液
KR101880305B1 (ko) * 2011-12-16 2018-07-20 동우 화인켐 주식회사 전자재료용 세정액 조성물
JP2013157516A (ja) * 2012-01-31 2013-08-15 Advanced Technology Materials Inc 銅配線半導体用洗浄剤
JP2014049521A (ja) * 2012-08-30 2014-03-17 Advanced Technology Materials Inc 銅配線半導体用洗浄剤
CN105658780B (zh) * 2013-10-23 2019-04-05 荒川化学工业株式会社 工业用共沸清洗剂、物品的清洗方法、工业用共沸清洗剂的再生方法以及清洗再生装置
JP6487630B2 (ja) * 2014-05-20 2019-03-20 化研テック株式会社 洗浄剤組成物用原液、洗浄剤組成物および洗浄方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102131910A (zh) * 2008-08-27 2011-07-20 荒川化学工业株式会社 无铅助焊剂除去用清洁剂组合物和无铅助焊剂除去用体系
CN102482625A (zh) * 2009-09-03 2012-05-30 荒川化学工业株式会社 水溶性无铅助焊剂除去用清洁剂、除去方法和清洁方法
CN102906240A (zh) * 2010-07-09 2013-01-30 化研科技株式会社 洗涤剂组合物用原液、洗涤剂组合物以及洗涤方法
CN104877811A (zh) * 2014-02-27 2015-09-02 荒川化学工业株式会社 清洗剂组合物原液、清洗剂组合物、清洗方法以及用途

Also Published As

Publication number Publication date
KR20180098527A (ko) 2018-09-04
WO2017110885A1 (ja) 2017-06-29
JP6593441B2 (ja) 2019-10-30
JPWO2017110885A1 (ja) 2017-12-28
KR102635269B1 (ko) 2024-02-13
CN108779419A (zh) 2018-11-09

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