CN108431256A - 电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片 - Google Patents

电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片 Download PDF

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Publication number
CN108431256A
CN108431256A CN201780005496.3A CN201780005496A CN108431256A CN 108431256 A CN108431256 A CN 108431256A CN 201780005496 A CN201780005496 A CN 201780005496A CN 108431256 A CN108431256 A CN 108431256A
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CN
China
Prior art keywords
copper alloy
electronic
content
mass
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780005496.3A
Other languages
English (en)
Chinese (zh)
Inventor
松永裕隆
牧诚
牧一诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority claimed from PCT/JP2017/012993 external-priority patent/WO2017170733A1/ja
Publication of CN108431256A publication Critical patent/CN108431256A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02Single bars, rods, wires, or strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/14Terminal arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/54Contact arrangements
    • H01H50/56Contact spring sets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN201780005496.3A 2016-03-30 2017-03-29 电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片 Pending CN108431256A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016069079 2016-03-30
JP2016-069079 2016-03-30
JP2017-063258 2017-03-28
JP2017063258A JP6226097B2 (ja) 2016-03-30 2017-03-28 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
PCT/JP2017/012993 WO2017170733A1 (ja) 2016-03-30 2017-03-29 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片

Publications (1)

Publication Number Publication Date
CN108431256A true CN108431256A (zh) 2018-08-21

Family

ID=60045499

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780005496.3A Pending CN108431256A (zh) 2016-03-30 2017-03-29 电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片

Country Status (6)

Country Link
EP (1) EP3438299B1 (ko)
JP (1) JP6226097B2 (ko)
KR (1) KR102327539B1 (ko)
CN (1) CN108431256A (ko)
MX (1) MX2018011711A (ko)
TW (1) TWI709651B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110172609A (zh) * 2019-05-16 2019-08-27 红河学院 一种高强度高导电率铜镁系合金及其制备方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017043577A1 (ja) 2015-09-09 2017-03-16 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
WO2017170699A1 (ja) 2016-03-30 2017-10-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
WO2017170733A1 (ja) 2016-03-30 2017-10-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
JP7180102B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
MX2020009869A (es) 2018-03-30 2020-10-12 Mitsubishi Materials Corp Aleacion de cobre para dispositivo electronico/electrico, material en lamina/tira de aleacion de cobre para dispositivo electronico/electrico, componente para dispositivo electronico/electrico, terminal, y barra colectora.
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7180101B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP6863409B2 (ja) * 2018-12-26 2021-04-21 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
US11781234B2 (en) 2018-12-26 2023-10-10 Mitsubishi Materials Corporation Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products
KR20220107184A (ko) * 2019-11-29 2022-08-02 미쓰비시 마테리알 가부시키가이샤 구리 합금, 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 버스 바, 방열 기판
EP4067518A4 (en) * 2019-11-29 2023-11-29 Mitsubishi Materials Corporation COPPER ALLOY, COPPER ALLOY PLASTIC MATERIAL, ELECTRONIC/ELECTRICAL DEVICE COMPONENT, CLAMP, BUS BAR, HEAT DISSIPATION PLATE
JP7443737B2 (ja) * 2019-12-10 2024-03-06 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法

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US5667752A (en) * 1995-12-01 1997-09-16 Mitsubishi Shindoh Co., Ltd. Copper alloy sheet for connectors and connectors formed of same
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CN103502486A (zh) * 2012-04-04 2014-01-08 三菱伸铜株式会社 具有优异的耐疲劳特性的Cu-Mg-P系铜合金板及其制造方法
CN105369050A (zh) * 2009-12-23 2016-03-02 三菱伸铜株式会社 Cu-Mg-P系铜合金条材及其制造方法
CN105392908A (zh) * 2013-07-31 2016-03-09 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用元件及端子
CN107208189A (zh) * 2015-09-09 2017-09-26 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条

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JP6055242B2 (ja) * 2012-08-30 2016-12-27 三菱伸銅株式会社 Cu−Mg−P系銅合金Snめっき板及びその製造方法
JP6076724B2 (ja) 2012-12-06 2017-02-08 古河電気工業株式会社 銅合金材料およびその製造方法
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JPH05311283A (ja) * 1992-05-01 1993-11-22 Mitsubishi Shindoh Co Ltd 伸線加工性および繰り返し曲げ性にすぐれたCu合金極細線
US5667752A (en) * 1995-12-01 1997-09-16 Mitsubishi Shindoh Co., Ltd. Copper alloy sheet for connectors and connectors formed of same
JP2007056297A (ja) * 2005-08-23 2007-03-08 Dowa Holdings Co Ltd Cu−Mg−P系銅合金およびその製造法
CN1924048A (zh) * 2005-08-31 2007-03-07 上海科泰铜业有限公司 汽车电器用高导电率铜镁合金
CN105369050A (zh) * 2009-12-23 2016-03-02 三菱伸铜株式会社 Cu-Mg-P系铜合金条材及其制造方法
CN102753712A (zh) * 2010-02-24 2012-10-24 三菱伸铜株式会社 Cu-Mg-P系铜合金条材及其制造方法
CN103502486A (zh) * 2012-04-04 2014-01-08 三菱伸铜株式会社 具有优异的耐疲劳特性的Cu-Mg-P系铜合金板及其制造方法
CN105392908A (zh) * 2013-07-31 2016-03-09 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用元件及端子
CN107208189A (zh) * 2015-09-09 2017-09-26 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110172609A (zh) * 2019-05-16 2019-08-27 红河学院 一种高强度高导电率铜镁系合金及其制备方法

Also Published As

Publication number Publication date
TW201807204A (zh) 2018-03-01
KR20180125446A (ko) 2018-11-23
KR102327539B1 (ko) 2021-11-16
MX2018011711A (es) 2018-12-19
TWI709651B (zh) 2020-11-11
JP2017186662A (ja) 2017-10-12
EP3438299A4 (en) 2019-12-18
EP3438299B1 (en) 2023-05-03
EP3438299A1 (en) 2019-02-06
JP6226097B2 (ja) 2017-11-08

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