CN108431256A - 电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片 - Google Patents
电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片 Download PDFInfo
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- CN108431256A CN108431256A CN201780005496.3A CN201780005496A CN108431256A CN 108431256 A CN108431256 A CN 108431256A CN 201780005496 A CN201780005496 A CN 201780005496A CN 108431256 A CN108431256 A CN 108431256A
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- Prior art keywords
- copper alloy
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 103
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims description 29
- 238000005096 rolling process Methods 0.000 claims description 29
- 238000009864 tensile test Methods 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 17
- 229910052749 magnesium Inorganic materials 0.000 abstract description 21
- 239000011777 magnesium Substances 0.000 description 95
- 238000005452 bending Methods 0.000 description 30
- 239000000463 material Substances 0.000 description 26
- 238000010438 heat treatment Methods 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 238000011156 evaluation Methods 0.000 description 17
- 230000007547 defect Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 239000013078 crystal Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 229910052698 phosphorus Inorganic materials 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 238000005266 casting Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 238000005336 cracking Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- 238000005482 strain hardening Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- 238000001953 recrystallisation Methods 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000265 homogenisation Methods 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 150000003568 thioethers Chemical class 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/14—Terminal arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/54—Contact arrangements
- H01H50/56—Contact spring sets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016069079 | 2016-03-30 | ||
JP2016-069079 | 2016-03-30 | ||
JP2017-063258 | 2017-03-28 | ||
JP2017063258A JP6226097B2 (ja) | 2016-03-30 | 2017-03-28 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
PCT/JP2017/012993 WO2017170733A1 (ja) | 2016-03-30 | 2017-03-29 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108431256A true CN108431256A (zh) | 2018-08-21 |
Family
ID=60045499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780005496.3A Pending CN108431256A (zh) | 2016-03-30 | 2017-03-29 | 电子电气设备用铜合金、电子电气设备用铜合金板条材、电子电气设备用组件、端子、汇流条及继电器用可动片 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3438299B1 (ko) |
JP (1) | JP6226097B2 (ko) |
KR (1) | KR102327539B1 (ko) |
CN (1) | CN108431256A (ko) |
MX (1) | MX2018011711A (ko) |
TW (1) | TWI709651B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110172609A (zh) * | 2019-05-16 | 2019-08-27 | 红河学院 | 一种高强度高导电率铜镁系合金及其制备方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017043577A1 (ja) | 2015-09-09 | 2017-03-16 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
WO2017170699A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
WO2017170733A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
JP7180102B2 (ja) * | 2018-03-30 | 2022-11-30 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
MX2020009869A (es) | 2018-03-30 | 2020-10-12 | Mitsubishi Materials Corp | Aleacion de cobre para dispositivo electronico/electrico, material en lamina/tira de aleacion de cobre para dispositivo electronico/electrico, componente para dispositivo electronico/electrico, terminal, y barra colectora. |
JP6780187B2 (ja) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
JP7180101B2 (ja) * | 2018-03-30 | 2022-11-30 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
JP6863409B2 (ja) * | 2018-12-26 | 2021-04-21 | 三菱マテリアル株式会社 | 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法 |
US11781234B2 (en) | 2018-12-26 | 2023-10-10 | Mitsubishi Materials Corporation | Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products |
KR20220107184A (ko) * | 2019-11-29 | 2022-08-02 | 미쓰비시 마테리알 가부시키가이샤 | 구리 합금, 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 버스 바, 방열 기판 |
EP4067518A4 (en) * | 2019-11-29 | 2023-11-29 | Mitsubishi Materials Corporation | COPPER ALLOY, COPPER ALLOY PLASTIC MATERIAL, ELECTRONIC/ELECTRICAL DEVICE COMPONENT, CLAMP, BUS BAR, HEAT DISSIPATION PLATE |
JP7443737B2 (ja) * | 2019-12-10 | 2024-03-06 | 三菱マテリアル株式会社 | 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311283A (ja) * | 1992-05-01 | 1993-11-22 | Mitsubishi Shindoh Co Ltd | 伸線加工性および繰り返し曲げ性にすぐれたCu合金極細線 |
US5667752A (en) * | 1995-12-01 | 1997-09-16 | Mitsubishi Shindoh Co., Ltd. | Copper alloy sheet for connectors and connectors formed of same |
CN1924048A (zh) * | 2005-08-31 | 2007-03-07 | 上海科泰铜业有限公司 | 汽车电器用高导电率铜镁合金 |
JP2007056297A (ja) * | 2005-08-23 | 2007-03-08 | Dowa Holdings Co Ltd | Cu−Mg−P系銅合金およびその製造法 |
CN102753712A (zh) * | 2010-02-24 | 2012-10-24 | 三菱伸铜株式会社 | Cu-Mg-P系铜合金条材及其制造方法 |
CN103502486A (zh) * | 2012-04-04 | 2014-01-08 | 三菱伸铜株式会社 | 具有优异的耐疲劳特性的Cu-Mg-P系铜合金板及其制造方法 |
CN105369050A (zh) * | 2009-12-23 | 2016-03-02 | 三菱伸铜株式会社 | Cu-Mg-P系铜合金条材及其制造方法 |
CN105392908A (zh) * | 2013-07-31 | 2016-03-09 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用元件及端子 |
CN107208189A (zh) * | 2015-09-09 | 2017-09-26 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778318A (en) | 1969-02-24 | 1973-12-11 | Cooper Range Co | Copper base composition |
JP5311283B2 (ja) | 2009-03-11 | 2013-10-09 | 住友電気工業株式会社 | 非水電解質電池、およびその製造方法 |
JP5848169B2 (ja) | 2012-03-14 | 2016-01-27 | Dowaメタルテック株式会社 | 銀めっき材 |
JP6054085B2 (ja) * | 2012-07-24 | 2016-12-27 | 三菱伸銅株式会社 | 曲げ加工後のばね限界値特性及び耐疲労特性に優れたCu−Mg−P系銅合金板及びその製造方法 |
JP6055242B2 (ja) * | 2012-08-30 | 2016-12-27 | 三菱伸銅株式会社 | Cu−Mg−P系銅合金Snめっき板及びその製造方法 |
JP6076724B2 (ja) | 2012-12-06 | 2017-02-08 | 古河電気工業株式会社 | 銅合金材料およびその製造方法 |
JP6140032B2 (ja) * | 2013-08-30 | 2017-05-31 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法並びに通電部品 |
JP5847787B2 (ja) * | 2013-11-26 | 2016-01-27 | Jx日鉱日石金属株式会社 | 導電性及び応力緩和特性に優れる銅合金板 |
JP6156600B1 (ja) * | 2015-09-09 | 2017-07-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
-
2017
- 2017-03-28 JP JP2017063258A patent/JP6226097B2/ja active Active
- 2017-03-29 CN CN201780005496.3A patent/CN108431256A/zh active Pending
- 2017-03-29 EP EP17775267.2A patent/EP3438299B1/en active Active
- 2017-03-29 KR KR1020187020683A patent/KR102327539B1/ko active IP Right Grant
- 2017-03-29 MX MX2018011711A patent/MX2018011711A/es unknown
- 2017-03-30 TW TW106110852A patent/TWI709651B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311283A (ja) * | 1992-05-01 | 1993-11-22 | Mitsubishi Shindoh Co Ltd | 伸線加工性および繰り返し曲げ性にすぐれたCu合金極細線 |
US5667752A (en) * | 1995-12-01 | 1997-09-16 | Mitsubishi Shindoh Co., Ltd. | Copper alloy sheet for connectors and connectors formed of same |
JP2007056297A (ja) * | 2005-08-23 | 2007-03-08 | Dowa Holdings Co Ltd | Cu−Mg−P系銅合金およびその製造法 |
CN1924048A (zh) * | 2005-08-31 | 2007-03-07 | 上海科泰铜业有限公司 | 汽车电器用高导电率铜镁合金 |
CN105369050A (zh) * | 2009-12-23 | 2016-03-02 | 三菱伸铜株式会社 | Cu-Mg-P系铜合金条材及其制造方法 |
CN102753712A (zh) * | 2010-02-24 | 2012-10-24 | 三菱伸铜株式会社 | Cu-Mg-P系铜合金条材及其制造方法 |
CN103502486A (zh) * | 2012-04-04 | 2014-01-08 | 三菱伸铜株式会社 | 具有优异的耐疲劳特性的Cu-Mg-P系铜合金板及其制造方法 |
CN105392908A (zh) * | 2013-07-31 | 2016-03-09 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用元件及端子 |
CN107208189A (zh) * | 2015-09-09 | 2017-09-26 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110172609A (zh) * | 2019-05-16 | 2019-08-27 | 红河学院 | 一种高强度高导电率铜镁系合金及其制备方法 |
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KR20180125446A (ko) | 2018-11-23 |
KR102327539B1 (ko) | 2021-11-16 |
MX2018011711A (es) | 2018-12-19 |
TWI709651B (zh) | 2020-11-11 |
JP2017186662A (ja) | 2017-10-12 |
EP3438299A4 (en) | 2019-12-18 |
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JP6226097B2 (ja) | 2017-11-08 |
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