CN108364903A - 用于末端执行器的吸附装置、末端执行器及其制造方法 - Google Patents

用于末端执行器的吸附装置、末端执行器及其制造方法 Download PDF

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Publication number
CN108364903A
CN108364903A CN201810084258.2A CN201810084258A CN108364903A CN 108364903 A CN108364903 A CN 108364903A CN 201810084258 A CN201810084258 A CN 201810084258A CN 108364903 A CN108364903 A CN 108364903A
Authority
CN
China
Prior art keywords
end effector
fastening
contact surface
main body
adsorbent equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810084258.2A
Other languages
English (en)
Chinese (zh)
Inventor
伯恩哈德·博格纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suess Microtec Lithography GmbH
Original Assignee
Suess Microtec Lithography GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suess Microtec Lithography GmbH filed Critical Suess Microtec Lithography GmbH
Publication of CN108364903A publication Critical patent/CN108364903A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/007—Means or methods for designing or fabricating manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201810084258.2A 2017-01-27 2018-01-29 用于末端执行器的吸附装置、末端执行器及其制造方法 Pending CN108364903A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2018243 2017-01-27
NL2018243A NL2018243B1 (en) 2017-01-27 2017-01-27 Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector

Publications (1)

Publication Number Publication Date
CN108364903A true CN108364903A (zh) 2018-08-03

Family

ID=62843388

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810084258.2A Pending CN108364903A (zh) 2017-01-27 2018-01-29 用于末端执行器的吸附装置、末端执行器及其制造方法

Country Status (9)

Country Link
US (1) US10259124B2 (https=)
JP (1) JP2018157194A (https=)
KR (1) KR102344555B1 (https=)
CN (1) CN108364903A (https=)
AT (1) AT519587B1 (https=)
DE (1) DE102018100856A1 (https=)
NL (1) NL2018243B1 (https=)
SG (1) SG10201800716YA (https=)
TW (1) TWI710438B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113169115A (zh) * 2018-11-23 2021-07-23 德国艾托特克公司 用于板形衬底的末端执行器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
PT3772089T (pt) * 2019-07-30 2021-06-28 Semsysco Gmbh Dispositivo de manuseamento de substrato para uma pastilha
US20230321758A1 (en) 2022-03-25 2023-10-12 Ii-Vi Delaware, Inc. Laser-roughened reaction-bonded silicon carbide for wafer contact surface
EP4273911A1 (de) * 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
US12348002B2 (en) 2022-05-31 2025-07-01 Ii-Vi Delaware, Inc. Current load-controlled laser driver
US12337467B2 (en) * 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
EP4658455A4 (en) * 2023-03-13 2026-03-25 Shanghai Flexiv Robotics Tech Co Ltd ADHESION DEVICE AND ROBOT

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
US20040113444A1 (en) * 2002-12-17 2004-06-17 Blonigan Wendell T. End effector assembly
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US20110241367A1 (en) * 2010-02-26 2011-10-06 Brooks Automation, Inc. Robot edge contact gripper
US20120235335A1 (en) * 2011-03-18 2012-09-20 Tokyo Electron Limited Substrate holding device
US8556315B2 (en) * 2009-03-31 2013-10-15 Ats Automation Tooling Systems Inc. Vacuum gripper assembly
CN104275701A (zh) * 2013-07-08 2015-01-14 株式会社安川电机 吸附结构、机器人手及机器人
CN106057705A (zh) * 2015-04-13 2016-10-26 苏斯微技术光刻有限公司 晶片处理设备以及用于晶片处理设备的密封环
JP2016538711A (ja) * 2014-03-06 2016-12-08 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェーハ‐ハンドリング・エンドエフェクタ

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US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JP3200285B2 (ja) * 1994-06-29 2001-08-20 キヤノン株式会社 基板搬送装置
JP2002184835A (ja) 2000-12-13 2002-06-28 Ando Electric Co Ltd 吸着パッド
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
JP4468893B2 (ja) 2003-01-29 2010-05-26 三星ダイヤモンド工業株式会社 真空吸着ヘッド
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
JP2014176914A (ja) 2013-03-14 2014-09-25 Nippon Electric Glass Co Ltd 吸着パッド及び吸着装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
JPH0653309A (ja) * 1992-06-10 1994-02-25 Internatl Business Mach Corp <Ibm> 基板用保持固定具
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US20040113444A1 (en) * 2002-12-17 2004-06-17 Blonigan Wendell T. End effector assembly
US8556315B2 (en) * 2009-03-31 2013-10-15 Ats Automation Tooling Systems Inc. Vacuum gripper assembly
US20110241367A1 (en) * 2010-02-26 2011-10-06 Brooks Automation, Inc. Robot edge contact gripper
US20120235335A1 (en) * 2011-03-18 2012-09-20 Tokyo Electron Limited Substrate holding device
JP2012199282A (ja) * 2011-03-18 2012-10-18 Tokyo Electron Ltd 基板保持装置
CN104275701A (zh) * 2013-07-08 2015-01-14 株式会社安川电机 吸附结构、机器人手及机器人
JP2016538711A (ja) * 2014-03-06 2016-12-08 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェーハ‐ハンドリング・エンドエフェクタ
CN106057705A (zh) * 2015-04-13 2016-10-26 苏斯微技术光刻有限公司 晶片处理设备以及用于晶片处理设备的密封环

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113169115A (zh) * 2018-11-23 2021-07-23 德国艾托特克公司 用于板形衬底的末端执行器
CN113169115B (zh) * 2018-11-23 2023-08-08 德国艾托特克公司 用于板形衬底的末端执行器

Also Published As

Publication number Publication date
AT519587B1 (de) 2021-10-15
NL2018243B1 (en) 2018-08-07
KR20180088598A (ko) 2018-08-06
AT519587A2 (de) 2018-08-15
SG10201800716YA (en) 2018-08-30
TW201831290A (zh) 2018-09-01
KR102344555B1 (ko) 2021-12-28
US10259124B2 (en) 2019-04-16
AT519587A3 (de) 2020-02-15
DE102018100856A1 (de) 2018-08-02
US20180215049A1 (en) 2018-08-02
TWI710438B (zh) 2020-11-21
JP2018157194A (ja) 2018-10-04

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Application publication date: 20180803

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