JP2018157194A - エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 - Google Patents

エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 Download PDF

Info

Publication number
JP2018157194A
JP2018157194A JP2018011618A JP2018011618A JP2018157194A JP 2018157194 A JP2018157194 A JP 2018157194A JP 2018011618 A JP2018011618 A JP 2018011618A JP 2018011618 A JP2018011618 A JP 2018011618A JP 2018157194 A JP2018157194 A JP 2018157194A
Authority
JP
Japan
Prior art keywords
end effector
suction device
contact surface
channel
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018011618A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018157194A5 (https=
Inventor
ベルンハルト・ボグナー
bogner Bernhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suess Microtec Lithography GmbH
Original Assignee
Suess Microtec Lithography GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suess Microtec Lithography GmbH filed Critical Suess Microtec Lithography GmbH
Publication of JP2018157194A publication Critical patent/JP2018157194A/ja
Publication of JP2018157194A5 publication Critical patent/JP2018157194A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/007—Means or methods for designing or fabricating manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2018011618A 2017-01-27 2018-01-26 エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 Pending JP2018157194A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2018243 2017-01-27
NL2018243A NL2018243B1 (en) 2017-01-27 2017-01-27 Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector

Publications (2)

Publication Number Publication Date
JP2018157194A true JP2018157194A (ja) 2018-10-04
JP2018157194A5 JP2018157194A5 (https=) 2020-03-19

Family

ID=62843388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018011618A Pending JP2018157194A (ja) 2017-01-27 2018-01-26 エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法

Country Status (9)

Country Link
US (1) US10259124B2 (https=)
JP (1) JP2018157194A (https=)
KR (1) KR102344555B1 (https=)
CN (1) CN108364903A (https=)
AT (1) AT519587B1 (https=)
DE (1) DE102018100856A1 (https=)
NL (1) NL2018243B1 (https=)
SG (1) SG10201800716YA (https=)
TW (1) TWI710438B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3657537A1 (en) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH End effector for slab formed substrates
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
PT3772089T (pt) * 2019-07-30 2021-06-28 Semsysco Gmbh Dispositivo de manuseamento de substrato para uma pastilha
US20230321758A1 (en) 2022-03-25 2023-10-12 Ii-Vi Delaware, Inc. Laser-roughened reaction-bonded silicon carbide for wafer contact surface
EP4273911A1 (de) * 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
US12348002B2 (en) 2022-05-31 2025-07-01 Ii-Vi Delaware, Inc. Current load-controlled laser driver
US12337467B2 (en) * 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
EP4658455A4 (en) * 2023-03-13 2026-03-25 Shanghai Flexiv Robotics Tech Co Ltd ADHESION DEVICE AND ROBOT

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JPH0653309A (ja) * 1992-06-10 1994-02-25 Internatl Business Mach Corp <Ibm> 基板用保持固定具
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
JPH0817896A (ja) * 1994-06-29 1996-01-19 Canon Inc 基板搬送装置
JP2012199282A (ja) * 2011-03-18 2012-10-18 Tokyo Electron Ltd 基板保持装置
JP2016538711A (ja) * 2014-03-06 2016-12-08 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェーハ‐ハンドリング・エンドエフェクタ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
JP2002184835A (ja) 2000-12-13 2002-06-28 Ando Electric Co Ltd 吸着パッド
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
JP4468893B2 (ja) 2003-01-29 2010-05-26 三星ダイヤモンド工業株式会社 真空吸着ヘッド
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
WO2010111784A1 (en) * 2009-03-31 2010-10-07 Ats Automation Tooling Systems Inc. Vacuum gripper assembly stabilized by springs
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP2014176914A (ja) 2013-03-14 2014-09-25 Nippon Electric Glass Co Ltd 吸着パッド及び吸着装置
JP5861677B2 (ja) * 2013-07-08 2016-02-16 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JPH0653309A (ja) * 1992-06-10 1994-02-25 Internatl Business Mach Corp <Ibm> 基板用保持固定具
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
JPH0817896A (ja) * 1994-06-29 1996-01-19 Canon Inc 基板搬送装置
JP2012199282A (ja) * 2011-03-18 2012-10-18 Tokyo Electron Ltd 基板保持装置
JP2016538711A (ja) * 2014-03-06 2016-12-08 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェーハ‐ハンドリング・エンドエフェクタ

Also Published As

Publication number Publication date
AT519587B1 (de) 2021-10-15
NL2018243B1 (en) 2018-08-07
KR20180088598A (ko) 2018-08-06
AT519587A2 (de) 2018-08-15
SG10201800716YA (en) 2018-08-30
TW201831290A (zh) 2018-09-01
KR102344555B1 (ko) 2021-12-28
US10259124B2 (en) 2019-04-16
AT519587A3 (de) 2020-02-15
CN108364903A (zh) 2018-08-03
DE102018100856A1 (de) 2018-08-02
US20180215049A1 (en) 2018-08-02
TWI710438B (zh) 2020-11-21

Similar Documents

Publication Publication Date Title
JP2018157194A (ja) エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法
JP7109927B2 (ja) エンドエフェクタ
US11027437B2 (en) Apparatus, system and method for providing a conformable vacuum cup for an end effector
US20140227072A1 (en) Wafer transfer blade and wafer transfer apparatus having the same
CN106672889A (zh) 半导体器件及其制造方法
CN102680749B (zh) 用于可释放地容纳半导体芯片的器件
US20100288525A1 (en) Electronic package and method of manufacture
US11664556B2 (en) Secondary battery comprising a deformed gasket and method for manufacturing the same
US8465619B2 (en) Semiconductor die collet
JP2012069952A (ja) マイクロスプリング接点を有するインターポーザ、ならびにインターポーザを製作する方法および使用する方法
US8037918B2 (en) Pick-up heads and systems for die bonding and related applications
JPH09181156A (ja) 真空チャック
KR102002553B1 (ko) 반도체 웨이퍼의 정밀이송을 위한 경량 진공척
JP6074734B2 (ja) 半導体製造装置用吸着ヘッドおよびその製造方法、ならびに半導体装置の吸着方法
KR101764244B1 (ko) 완충기능을 가지는 반도체 칩 이송모듈
KR100533748B1 (ko) 반도체 다이 접착용 픽업 툴
TW201608669A (zh) 用於拾取半導體芯片的夾頭
TWI616997B (zh) 植球製程
CN114203615A (zh) 用于吸附薄脆型芯片的高柔性吸嘴结构
JP2020072170A (ja) コレット及びコレットを用いた発光装置の製造方法。
JPH07122584A (ja) 半導体装置の実装装置及びそれに用いられるマウントコレット

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200205

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200205

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210302

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210601

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210914

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20211210

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220210

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220510