TWI710438B - 用於末端執行器之抽吸裝置、用於保持基板之末端執行器及製造末端執行器之方法 - Google Patents

用於末端執行器之抽吸裝置、用於保持基板之末端執行器及製造末端執行器之方法 Download PDF

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Publication number
TWI710438B
TWI710438B TW107102181A TW107102181A TWI710438B TW I710438 B TWI710438 B TW I710438B TW 107102181 A TW107102181 A TW 107102181A TW 107102181 A TW107102181 A TW 107102181A TW I710438 B TWI710438 B TW I710438B
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TW
Taiwan
Prior art keywords
end effector
main body
contact surface
layer
suction device
Prior art date
Application number
TW107102181A
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English (en)
Chinese (zh)
Other versions
TW201831290A (zh
Inventor
伯恩哈德 博格納
Original Assignee
德商蘇士微科技印刷術股份有限公司
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Publication of TW201831290A publication Critical patent/TW201831290A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/007—Means or methods for designing or fabricating manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW107102181A 2017-01-27 2018-01-22 用於末端執行器之抽吸裝置、用於保持基板之末端執行器及製造末端執行器之方法 TWI710438B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2018243 2017-01-27
NL2018243A NL2018243B1 (en) 2017-01-27 2017-01-27 Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector

Publications (2)

Publication Number Publication Date
TW201831290A TW201831290A (zh) 2018-09-01
TWI710438B true TWI710438B (zh) 2020-11-21

Family

ID=62843388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107102181A TWI710438B (zh) 2017-01-27 2018-01-22 用於末端執行器之抽吸裝置、用於保持基板之末端執行器及製造末端執行器之方法

Country Status (9)

Country Link
US (1) US10259124B2 (https=)
JP (1) JP2018157194A (https=)
KR (1) KR102344555B1 (https=)
CN (1) CN108364903A (https=)
AT (1) AT519587B1 (https=)
DE (1) DE102018100856A1 (https=)
NL (1) NL2018243B1 (https=)
SG (1) SG10201800716YA (https=)
TW (1) TWI710438B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3657537A1 (en) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH End effector for slab formed substrates
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
PT3772089T (pt) * 2019-07-30 2021-06-28 Semsysco Gmbh Dispositivo de manuseamento de substrato para uma pastilha
US20230321758A1 (en) 2022-03-25 2023-10-12 Ii-Vi Delaware, Inc. Laser-roughened reaction-bonded silicon carbide for wafer contact surface
EP4273911A1 (de) * 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
US12348002B2 (en) 2022-05-31 2025-07-01 Ii-Vi Delaware, Inc. Current load-controlled laser driver
US12337467B2 (en) * 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
EP4658455A4 (en) * 2023-03-13 2026-03-25 Shanghai Flexiv Robotics Tech Co Ltd ADHESION DEVICE AND ROBOT

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
CN102369088A (zh) * 2009-03-31 2012-03-07 Ats自动化加工系统公司 由弹簧稳定的真空抓持器组件
TWI490974B (zh) * 2011-03-18 2015-07-01 東京威力科創股份有限公司 基板固持裝置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
JP3200285B2 (ja) * 1994-06-29 2001-08-20 キヤノン株式会社 基板搬送装置
JP2002184835A (ja) 2000-12-13 2002-06-28 Ando Electric Co Ltd 吸着パッド
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
JP4468893B2 (ja) 2003-01-29 2010-05-26 三星ダイヤモンド工業株式会社 真空吸着ヘッド
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP2014176914A (ja) 2013-03-14 2014-09-25 Nippon Electric Glass Co Ltd 吸着パッド及び吸着装置
JP5861677B2 (ja) * 2013-07-08 2016-02-16 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
US9991152B2 (en) 2014-03-06 2018-06-05 Cascade Microtech, Inc. Wafer-handling end effectors with wafer-contacting surfaces and sealing structures
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
CN102369088A (zh) * 2009-03-31 2012-03-07 Ats自动化加工系统公司 由弹簧稳定的真空抓持器组件
CN102369088B (zh) 2009-03-31 2015-03-25 Ats自动化加工系统公司 由弹簧稳定的真空抓持器组件
TWI490974B (zh) * 2011-03-18 2015-07-01 東京威力科創股份有限公司 基板固持裝置

Also Published As

Publication number Publication date
AT519587B1 (de) 2021-10-15
NL2018243B1 (en) 2018-08-07
KR20180088598A (ko) 2018-08-06
AT519587A2 (de) 2018-08-15
SG10201800716YA (en) 2018-08-30
TW201831290A (zh) 2018-09-01
KR102344555B1 (ko) 2021-12-28
US10259124B2 (en) 2019-04-16
AT519587A3 (de) 2020-02-15
CN108364903A (zh) 2018-08-03
DE102018100856A1 (de) 2018-08-02
US20180215049A1 (en) 2018-08-02
JP2018157194A (ja) 2018-10-04

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