JP5861677B2 - 吸着構造、ロボットハンドおよびロボット - Google Patents
吸着構造、ロボットハンドおよびロボット Download PDFInfo
- Publication number
- JP5861677B2 JP5861677B2 JP2013142875A JP2013142875A JP5861677B2 JP 5861677 B2 JP5861677 B2 JP 5861677B2 JP 2013142875 A JP2013142875 A JP 2013142875A JP 2013142875 A JP2013142875 A JP 2013142875A JP 5861677 B2 JP5861677 B2 JP 5861677B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- fixed base
- robot
- hole
- seal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/30—End effector
- Y10S901/40—Vacuum or mangetic
Description
2 基台
3 昇降部
4 第1関節部
5 第1アーム
6 第2関節部
7 第2アーム
8 第3関節部
10 ハンド
11 プレート支持部
12 プレート
12a 吸気孔
12b 貫通孔
12c 係合孔
13、13’、13’’ パッド
13a 接触部
13b 主面部
13c 吸気孔
13d 支持部
13e、13e’ 固定部
13f 第1突起部
13g 第2突起部
13h ねじり部
13i リブ部
14 真空路
15 シール部材
20 制御装置
30 上位装置
C 規定位置にあるウェハの中心
SC 締結部材
W ウェハ
Claims (9)
- 固定ベースと、
被吸着物に接触する接触部を有するパッドと、
平面視で前記パッドを貫く直線沿いに配置され前記固定ベースに対して前記パッドを固定する支持部と、
前記支持部にあって前記パッドが前記直線を中心に傾動可能に前記パッドを支持するねじり部と、
前記パッドおよび前記固定ベースの間に設けられるシール部材と、
前記接触部に囲まれた空間を前記シール部材を通って真空源に連通させる吸気孔と
を備えることを特徴とする吸着構造。 - 前記シール部材は、
略環状に形成された弾性体であること
を特徴とする請求項1に記載の吸着構造。 - 前記支持部は、
前記固定ベース側に下垂させて設けられる固定部を有し、
前記固定部は、
先割れ形状で頭部に返しとなる突起を有した形状に形成され、前記固定ベースに設けられた貫通孔に挿し込まれることによって前記パッドを前記固定ベースに固定すること
を特徴とする請求項1または2に記載の吸着構造。 - 前記支持部は、貫通孔を有し、
前記固定ベースは、前記貫通孔に係合する孔部を有し、
前記支持部は、
前記貫通孔に挿通させた締結部材を前記孔部へ挿入して固定することによって前記パッドを前記固定ベースに固定すること
を特徴とする請求項1または2に記載の吸着構造。 - 前記シール部材は、
前記パッドおよび前記固定ベースの間隔よりも大きい高さを有して形成され、前記パッドが前記固定ベースに固定されることによって圧着固定されること
を特徴とする請求項3または4に記載の吸着構造。 - 前記パッドに設けられ、前記シール部材に接触して該シール部材の位置を規制する突起部
をさらに備えることを特徴とする請求項1〜5のいずれか一つに記載の吸着構造。 - 前記パッドは、
規定位置にある前記被吸着物の中心から放射状に伸びる方向に対して前記直線である前記支持部の軸線方向が略直交する向きとなるように配置されること
を特徴とする請求項1〜6のいずれか一つに記載の吸着構造。 - 前記固定ベースを基部とし、
請求項1〜7のいずれか一つに記載の吸着構造
を備えることを特徴とするロボットハンド。 - 請求項8に記載のロボットハンド
を備えることを特徴とするロボット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013142875A JP5861677B2 (ja) | 2013-07-08 | 2013-07-08 | 吸着構造、ロボットハンドおよびロボット |
TW103122985A TW201520154A (zh) | 2013-07-08 | 2014-07-03 | 抽吸結構、自動機手及自動機 |
CN201410320556.9A CN104275701A (zh) | 2013-07-08 | 2014-07-07 | 吸附结构、机器人手及机器人 |
KR1020140084700A KR20150006376A (ko) | 2013-07-08 | 2014-07-07 | 흡착 구조, 로봇 핸드 및 로봇 |
US14/324,244 US9108320B2 (en) | 2013-07-08 | 2014-07-07 | Suction structure, robot hand and robot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013142875A JP5861677B2 (ja) | 2013-07-08 | 2013-07-08 | 吸着構造、ロボットハンドおよびロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015013359A JP2015013359A (ja) | 2015-01-22 |
JP5861677B2 true JP5861677B2 (ja) | 2016-02-16 |
Family
ID=52251289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013142875A Expired - Fee Related JP5861677B2 (ja) | 2013-07-08 | 2013-07-08 | 吸着構造、ロボットハンドおよびロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US9108320B2 (ja) |
JP (1) | JP5861677B2 (ja) |
KR (1) | KR20150006376A (ja) |
CN (1) | CN104275701A (ja) |
TW (1) | TW201520154A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10312127B2 (en) | 2013-09-16 | 2019-06-04 | Applied Materials, Inc. | Compliant robot blade for defect reduction |
JP5929947B2 (ja) * | 2014-02-28 | 2016-06-08 | 株式会社安川電機 | 吸着パッド、ロボットハンドおよびロボット |
KR20160007005A (ko) * | 2014-07-10 | 2016-01-20 | 삼성전자주식회사 | 이송 장치용 패드와 이를 포함하는 대상물 이송 장치, 및 대상물 이송 방법 |
JP6486140B2 (ja) * | 2015-02-25 | 2019-03-20 | キヤノン株式会社 | 搬送ハンド、リソグラフィ装置及び被搬送物を搬送する方法 |
KR101681191B1 (ko) * | 2015-09-30 | 2016-12-12 | 세메스 주식회사 | 반송 유닛, 기판 처리 장치, 기판 처리 방법 |
US9778968B1 (en) * | 2015-12-29 | 2017-10-03 | Amazon Technologies, Inc. | Programatic implementations generated from an API call log |
US9975255B1 (en) * | 2016-12-15 | 2018-05-22 | Jabil Inc. | Apparatus, system and method for providing a conformable vacuum cup for an end effector |
NL2018243B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector |
US10663434B2 (en) * | 2017-03-31 | 2020-05-26 | Sonix, Inc. | Wafer chuck |
JP6442563B1 (ja) * | 2017-05-30 | 2018-12-19 | キヤノン株式会社 | 搬送ハンド、搬送装置、リソグラフィ装置、物品の製造方法及び保持機構 |
CN110299297B (zh) * | 2018-03-23 | 2022-02-15 | 上海新昇半导体科技有限公司 | 一种硅片测试台 |
EP3578323B1 (en) * | 2018-06-05 | 2020-08-12 | C.R.F. Società Consortile per Azioni | A suction-type gripping device |
KR102301113B1 (ko) * | 2019-09-06 | 2021-09-10 | 주식회사 글린트머티리얼즈 | 적층 구조의 미끄럼 방지 패드 및 이를 구비한 웨이퍼 이송 로봇 |
JP7299808B2 (ja) * | 2019-09-19 | 2023-06-28 | 川崎重工業株式会社 | 傾き調整装置、及びそれを備えるロボット |
CN110587648B (zh) * | 2019-10-19 | 2020-12-08 | 台州隆达科技有限公司 | 一种轴承套圈用提取装置 |
CN114505208B (zh) * | 2022-04-19 | 2022-06-14 | 成都泰美克晶体技术有限公司 | 一种晶片用上蜡机 |
EP4273911A1 (de) * | 2022-05-03 | 2023-11-08 | Werner Lieb GmbH | Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen |
Family Cites Families (13)
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US3152828A (en) * | 1962-02-02 | 1964-10-13 | Alvey Conveyor Mfg Co | Vacuum cup units for lifting pads |
US4529353A (en) * | 1983-01-27 | 1985-07-16 | At&T Bell Laboratories | Wafer handling apparatus and method |
US5172922A (en) * | 1991-04-25 | 1992-12-22 | Digital Equipment Corporation | Self aligning vacuum nozzle |
DE4430381C2 (de) * | 1993-08-31 | 1997-02-27 | Smc Kk | Saugpipette |
JP2002321181A (ja) * | 2001-04-24 | 2002-11-05 | Matsushita Electric Works Ltd | 吸着支持装置 |
US6942265B1 (en) * | 2002-10-23 | 2005-09-13 | Kla-Tencor Technologies Corporation | Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto |
US7055875B2 (en) * | 2003-07-11 | 2006-06-06 | Asyst Technologies, Inc. | Ultra low contact area end effector |
JP2005288595A (ja) * | 2004-03-31 | 2005-10-20 | Nippon Pisuko:Kk | 吸着パッド装置 |
JP4098338B2 (ja) | 2006-07-20 | 2008-06-11 | 川崎重工業株式会社 | ウェハ移載装置および基板移載装置 |
CN201147927Y (zh) * | 2008-01-18 | 2008-11-12 | 昆明理工大机电装备集成科技有限公司 | 多唇边式真空吸盘 |
JP2009241182A (ja) * | 2008-03-28 | 2009-10-22 | Fujinon Corp | 吸着パッド、搬送装置、及び搬送方法 |
JP2010058213A (ja) * | 2008-09-03 | 2010-03-18 | Central Motor Co Ltd | バキュームパッド装置 |
JP5345167B2 (ja) * | 2011-03-18 | 2013-11-20 | 東京エレクトロン株式会社 | 基板保持装置 |
-
2013
- 2013-07-08 JP JP2013142875A patent/JP5861677B2/ja not_active Expired - Fee Related
-
2014
- 2014-07-03 TW TW103122985A patent/TW201520154A/zh unknown
- 2014-07-07 CN CN201410320556.9A patent/CN104275701A/zh active Pending
- 2014-07-07 US US14/324,244 patent/US9108320B2/en not_active Expired - Fee Related
- 2014-07-07 KR KR1020140084700A patent/KR20150006376A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN104275701A (zh) | 2015-01-14 |
US9108320B2 (en) | 2015-08-18 |
TW201520154A (zh) | 2015-06-01 |
KR20150006376A (ko) | 2015-01-16 |
JP2015013359A (ja) | 2015-01-22 |
US20150015014A1 (en) | 2015-01-15 |
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