WO2007097147A1 - 搬送装置及び搬送方法 - Google Patents
搬送装置及び搬送方法 Download PDFInfo
- Publication number
- WO2007097147A1 WO2007097147A1 PCT/JP2007/050899 JP2007050899W WO2007097147A1 WO 2007097147 A1 WO2007097147 A1 WO 2007097147A1 JP 2007050899 W JP2007050899 W JP 2007050899W WO 2007097147 A1 WO2007097147 A1 WO 2007097147A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate
- suction
- arm
- suction arm
- wafer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 210000001503 Joints Anatomy 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 35
- 238000000034 method Methods 0.000 description 5
- 210000000078 Claw Anatomy 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001174 ascending Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112007000305T DE112007000305T5 (de) | 2006-02-20 | 2007-01-22 | Transportvorrichtung und Transportverfahren |
US12/160,516 US20100222918A1 (en) | 2006-02-20 | 2007-01-22 | Transfer device and transfer method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-042110 | 2006-02-20 | ||
JP2006042110A JP2007221031A (ja) | 2006-02-20 | 2006-02-20 | 搬送装置及び搬送方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007097147A1 true WO2007097147A1 (ja) | 2007-08-30 |
Family
ID=38437191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/050899 WO2007097147A1 (ja) | 2006-02-20 | 2007-01-22 | 搬送装置及び搬送方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100222918A1 (ja) |
JP (1) | JP2007221031A (ja) |
KR (1) | KR20080102361A (ja) |
CN (1) | CN101375386A (ja) |
DE (1) | DE112007000305T5 (ja) |
TW (1) | TW200807610A (ja) |
WO (1) | WO2007097147A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT2146821E (pt) * | 2007-04-26 | 2012-06-21 | Adept Technology Inc | Aparelho de preensão a vácuo |
US8903547B2 (en) | 2009-03-11 | 2014-12-02 | Honda Motor Co., Ltd. | Working device and working method |
FR2960074B1 (fr) * | 2010-05-14 | 2012-06-15 | Staubli Sa Ets | Procede de commande d'une cellule de travail automatisee |
CN102569140A (zh) * | 2010-12-17 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 真空机械手和晶片处理系统 |
CN102152297B (zh) * | 2011-03-16 | 2013-04-10 | 哈尔滨工业大学 | 一种串联型r轴扩展机械臂 |
CN102768977B (zh) * | 2011-05-06 | 2015-09-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 机械手、大气传输单元和晶片传输方法 |
JP2014053343A (ja) * | 2012-09-05 | 2014-03-20 | Toyota Motor Corp | 半導体位置決め装置、及び半導体位置決め方法 |
CN103413773B (zh) * | 2013-07-15 | 2015-09-02 | 中国电子科技集团公司第四十八研究所 | 一种硅片全自动上下料机械手及其运动轨迹控制方法 |
JP6360762B2 (ja) * | 2014-09-26 | 2018-07-18 | 株式会社ディスコ | 加工装置 |
WO2016067689A1 (ja) * | 2014-10-29 | 2016-05-06 | 株式会社安川電機 | 加工装置及びワークの生産方法 |
JP6511074B2 (ja) * | 2015-02-13 | 2019-05-15 | 川崎重工業株式会社 | 基板搬送ロボットおよびその運転方法 |
CN104986380B (zh) * | 2015-05-20 | 2017-07-18 | 杭州厚达自动化系统有限公司 | 厅门装箱机构 |
CN107635730A (zh) * | 2015-06-30 | 2018-01-26 | 株式会社安川电机 | 机器人系统 |
JP6382783B2 (ja) | 2015-11-09 | 2018-08-29 | ファナック株式会社 | ワークを吸着する吸着式ハンド |
CN109103137A (zh) * | 2018-08-17 | 2018-12-28 | 浙江雅市晶科技有限公司 | 一种半导体搬运设备的抓取装置 |
KR102108298B1 (ko) * | 2019-11-28 | 2020-05-07 | 최경철 | Cmp 설비의 패드 교체장치 및 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002289673A (ja) * | 2001-03-26 | 2002-10-04 | Disco Abrasive Syst Ltd | 搬出入装置 |
JP2002536201A (ja) * | 1999-02-12 | 2002-10-29 | エルピーイー・ソチエタ・ペル・アチオニ | 平坦なディスク形状サセプタを有するエピタキシャル誘導反応器における自己水平化真空システムにより基板を取り扱うための装置及びその操作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100428781B1 (ko) * | 2001-04-16 | 2004-04-27 | 삼성전자주식회사 | 웨이퍼 이송 장치 및 그 이송 방법 |
JP4640766B2 (ja) | 2003-09-24 | 2011-03-02 | 日東電工株式会社 | 粘着テープの貼付方法及び貼付装置 |
-
2006
- 2006-02-20 JP JP2006042110A patent/JP2007221031A/ja not_active Withdrawn
-
2007
- 2007-01-22 DE DE112007000305T patent/DE112007000305T5/de not_active Withdrawn
- 2007-01-22 CN CNA200780003869XA patent/CN101375386A/zh active Pending
- 2007-01-22 KR KR1020087018141A patent/KR20080102361A/ko not_active Application Discontinuation
- 2007-01-22 US US12/160,516 patent/US20100222918A1/en not_active Abandoned
- 2007-01-22 WO PCT/JP2007/050899 patent/WO2007097147A1/ja active Application Filing
- 2007-02-02 TW TW096103930A patent/TW200807610A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002536201A (ja) * | 1999-02-12 | 2002-10-29 | エルピーイー・ソチエタ・ペル・アチオニ | 平坦なディスク形状サセプタを有するエピタキシャル誘導反応器における自己水平化真空システムにより基板を取り扱うための装置及びその操作方法 |
JP2002289673A (ja) * | 2001-03-26 | 2002-10-04 | Disco Abrasive Syst Ltd | 搬出入装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101375386A (zh) | 2009-02-25 |
KR20080102361A (ko) | 2008-11-25 |
JP2007221031A (ja) | 2007-08-30 |
US20100222918A1 (en) | 2010-09-02 |
TW200807610A (en) | 2008-02-01 |
DE112007000305T5 (de) | 2009-01-02 |
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